JPH11340129A - Pattern manufacturing method and pattern manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower the manufacturing cost of a pattern by effectively utilizing a resist material which is a solute and reducing the man-hour required for fixing the resist material to a pattern forming surface by depositing the drops of fluidized materials prepared by dissolving the resist material in a solvent to the pattern forming surface, and solidifying the drops. SOLUTION: Fluidized materials 11-1n prepared by dissolving a resist material in a solvent by the ink jet method are applied to the pattern forming surface 100 of a transparent electrode film. Then the resist pattern 102 formed on the surface 100 is solidified. Namely, a control circuit 5 heats the pattern 102 by supplying a control signal Sp to, for example, a solidifying device 6. The solidification is made with the purpose of improving the adhesion between the pattern 102 and surface 100 by evaporating the solvent. Usually, heat treatment is used for the solidification. For performing the heat treatment, the pattern 102 is irradiated with the high-energy laser light of an excimer laser, etc., or the light emitting from an excimer lamp, etc. It is also possible to use infrared rays or electromagnetic waves of microwaves, etc., for heating the pattern 102.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to pattern formation on a substrate, and more particularly, to a pattern manufacturing technique for eliminating a disadvantage of a lithography method by utilizing an ink jet method or the like.

[0002]

2. Description of the Related Art Conventionally, a lithography method or the like has been used to manufacture a minute circuit, for example, an integrated circuit. For example, "Thin Film Handbook", edited by JSPS, pp283-293
Discloses basic processing steps of a lithography method. According to this document, for example, a photosensitive material called a resist is thinly applied on a silicon wafer, and a photomask according to a circuit pattern created by photolithography is formed on the resist. Next, exposure is performed to expose the resist in a region where light is not blocked by a photomask, and a developing process is performed to provide a resist pattern corresponding to the circuit pattern on the silicon wafer. Then, etching is performed on the resist pattern to remove silicon, and silicon is formed in accordance with the pattern. According to the above literature, spinner method, spray method, roll coater method, and dipping method have been used for applying the resist. For example, according to the spinner method, a substrate is placed on a turntable, and a resist material is applied while rotating the substrate at a high speed.

[0003]

However, the resist forming process usually used in the lithography method has disadvantages such as wasting of the resist material, an increase in the number of steps, and a limitation on the resist material.

That is, in the conventional resist coating method, a resist material must be applied to the entire surface on which a pattern is to be formed, even if the region serving as an etching resist pattern is extremely small, and the thickness of the resist is controlled. It was difficult. In particular, in the application method using a spinner, 9
Not only 5% or more is wasted, but also there is a problem that the resist material leaked at the time of application goes to the back side of the substrate.

In the conventional method of forming a resist pattern, many steps are required to obtain a resist pattern, such as resist coating, masking, exposure, development, and unnecessary removal of the resist. In addition, the amount of the photomask material required a material other than the resist, such as the necessity of a negative film. Although the use of screen printing or the blade method can prevent a certain amount of material waste, the fact that the thickness of the resist is difficult to control does not change, so that the waste of the resist material could not be fundamentally solved. As can be seen from these facts, the conventional method has necessitated waste of materials and an increase in man-hours, causing a rise in manufacturing costs.

Further, conventionally, since it was necessary to expose the resist, the resist was limited to a photosensitive material, and the selection of the material was limited.

In view of the above problems, the present applicant has noticed that the above problems can be completely solved by using an ink jet system or the like, and has conceived of giving a new option to the pattern manufacturing technology.

[0008]

That is, a first object of the present invention is to reduce the production cost by reducing the waste of the resist material and the number of man-hours by the manufacturing method in which the resist is locally provided. A second object of the present invention is to provide a specific option for adjusting the thickness of the resist, thereby reducing the waste of the resist material and the number of steps, and reducing the manufacturing cost. A third object of the present invention is to remove the restriction that the resist must have photosensitivity by presenting conditions for locally providing the resist,
The purpose is to improve the selectivity of the resist. A fourth object of the present invention is to improve the selectivity of the resist by presenting a composition for locally providing the resist, thereby removing the restriction that the resist must have photosensitivity. A fifth object of the present invention is to provide a manufacturing apparatus capable of locally providing a resist, thereby reducing waste of resist material and man-hours, and reducing manufacturing cost.

The invention for solving the above first object is a pattern manufacturing method for forming a resist pattern on a pattern forming surface, wherein a liquid droplet of a fluid in which a solute resist material is dissolved in a solvent is formed. The method further comprises a step of causing the resin to adhere to the pattern forming surface and solidify. If the resist is patterned at a predetermined position and the resist material has etching resistance, the steps of exposure and development can be omitted.

[0010] Here, "fluid" refers to a liquid having a viscosity that can be ejected from the nozzles of the ink jet head. The solvent of the "fluid" does not matter whether it is aqueous or oily. It is sufficient that the resist has a fluidity (viscosity) that can be discharged from a nozzle or the like. Even if fine particles that are solid substances are dispersed as a resist material, it is sufficient that the fine particles are entirely fluid.
The “pattern forming surface” is a surface on which a pattern is attached regardless of whether it is a flat surface, a curved surface, or an uneven shape,
It may be a hard surface such as a substrate or a surface on a flexible film.

Here, in the above step, it is preferable that droplets of the fluid are ejected from an ink jet type head so as to adhere to the pattern forming surface. That is, various methods such as various printing methods can be applied as a method of attaching the fluid, but according to the ink jet method, the fluid is attached at an arbitrary thickness on an arbitrary place on the pattern forming surface with inexpensive equipment. Because you can do it. The ink jet method may be a piezo jet method in which a fluid is ejected by a change in volume of a piezoelectric element, or a method in which a fluid is ejected by sudden generation of steam by application of heat.

In the invention for solving the third problem,
As a condition required for the fluid, the viscosity needs to be adjusted to 1 cp or more and 20 cp or less by adjusting the solute concentration, the type of the solvent, or the amount of the solvent. Viscosity is 1c
If the viscosity is lower than p, the solid content is too low and the film-forming property is deteriorated. If the viscosity is higher than 20 cp, smooth discharge cannot be performed and the frequency of clogging of the nozzle holes increases.
More preferably, the viscosity is adjusted to 2 cp or more and 4 cp or less. This is because if the viscosity is in this range, the film formability is good and the frequency of clogging of the nozzle hole is low.

The surface energy of the liquid droplets must be adjusted to 20 mN / m or more and 70 mN / m or less by adjusting the solute concentration, the type of solvent or the amount of solvent. If the surface energy is lower than 20 mN / m, the wettability around the nozzle hole is increased and the flight of the droplet is bent, and if the surface energy is higher than 70 mN / m, the meniscus shape at the nozzle tip becomes unstable. This is because it becomes difficult to control the discharge amount and the discharge timing. 6 when the surface energy is 30 mN / m or more
It is preferably adjusted to 0 mN / m or less.

The adhesion between the fluid and the pattern forming surface can be measured by the contact angle. By adjusting the solute concentration, the type of the solvent, or the amount of the solvent, the fluid has a contact angle with the material constituting the head nozzle surface of 30 degrees or more and 17 degrees.
It must be adjusted so that it is 0 degrees or less. If the contact angle is smaller than 30 degrees, the wettability around the nozzle hole is increased, and the flight of the droplet is bent. If the contact angle is larger than 170 degrees, the meniscus shape at the nozzle tip is not stable, This is because it becomes difficult to control the discharge amount and the discharge timing. In particular, it is preferable that the contact angle with respect to the material constituting the head nozzle surface is adjusted to be 35 degrees or more and 65 degrees or less.

The solute concentration in the fluid is 0.01 w
It is preferable that the amount is adjusted to 10 wt% or less at t% or more. If the solute concentration is lower than 0.01 wt%, a sufficient thickness of the resist layer cannot be formed unless a large amount of fluid is discharged, resulting in poor efficiency. If the solute concentration is higher than 10 wt%, it becomes difficult to discharge the fluid. This is because it increases the viscosity to a certain extent.

For example, in the invention for solving the fourth object, the solvent in the fluid is glycerin, diethylene glycol, methanol, ethanol, water or 1,3.
-Dimethyl-2-imidazolidinone (DMI), ethoxyethanol, N, N-dimethylformamide (DM
F), one or more solvents selected from N-methylpyrrolidone (NMP) and ethylene glycol ether. This is because the above conditions can be satisfied by mixing these solvents. The resist material as a solvent is any one of vinyl cinnamate, novolak resin, polyimide and epoxy resin.
Of course, other materials may be used as long as the above conditions are satisfied and the resistance to the etchant during etching is satisfied.

In the invention for solving the second problem, the concentration of the resist material in the fluid is changed according to the conditions required for the resist. Also,
The amount of liquid droplets attached per unit area of the pattern forming surface may be changed. As a method of changing the amount of the droplet attached, the number of droplets per unit area of the pattern formation surface is controlled, the pitch is controlled by the pitch between droplets to be attached to the pattern formation surface, or the droplet is attached at one time. It is controlled by the amount of the droplet.

Further, in the present invention, after the step of adhering the droplets of the fluid, a step of solidifying the adhering droplets to form a resist pattern, a step of etching the pattern formation surface on which the resist pattern is formed, Is further provided. If these steps are processed together with the resist coating of the present invention, the patterning of the substrate can be performed.

The invention for solving the fifth problem is a pattern manufacturing apparatus for forming a resist pattern on a pattern formation surface, and has the following configuration.

A) An ink jet type head (either a piezo jet type or a bubble type) in which liquid droplets of a fluid obtained by dissolving a solute resist material in a solvent can be attached to a pattern forming surface.

B) A transport device (step motor, rotary motion-horizontal motion conversion mechanism, etc.) configured to change the relative position between the ink jet head and the pattern forming surface.

C) A control device (computer, sequencer, etc.) for controlling the ejection of the fluid from the ink jet head and the driving by the driving device. This controller is
A resist pattern can be formed by causing a droplet of a fluid to adhere to a pattern forming surface from the inkjet head while moving the inkjet head along an arbitrary pattern forming region by a transport device.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. (Description of Configuration) FIG. 1 shows a configuration diagram of a pattern manufacturing apparatus used in this embodiment. This pattern forming apparatus is shown in FIG.
As shown in the figure, the ink jet heads 21 to 2n (n
Is an arbitrary natural number), tanks 31 to 3n, a transport device 4, and a control circuit 5.

Each of the fluids 11 to 1n is manufactured by dissolving a solute as a resist material in a solvent. The fluids 11 to 1n are stored in tanks 31 to 3n, respectively. When the pressure in the pressurizing chambers of the ink jet heads 21 to 2n decreases, each fluid is supplied from the tank to the pressurizing chamber of the ink jet head. It has become so.

As a condition required for each fluid, it is necessary that the viscosity be adjusted to 1 cp or more and 20 cp or less by adjusting the solute concentration, the type of the solvent or the amount of the solvent. If the viscosity is lower than 1 cp, the solid content is too low, and the film formability is deteriorated. If the viscosity is higher than 20 cp, smooth discharge cannot be performed, and the frequency of clogging of the nozzle holes increases. More preferably, the viscosity is adjusted to 2 cp or more and 4 cp or less. This is because if the viscosity is in this range, the film forming property is good and the frequency of clogging of the nozzle hole is low.

It is necessary that the surface energy of the liquid droplets of the fluid is adjusted to 20 mN / m or more and 70 mN / m or less by adjusting the solute concentration, the type of the solvent or the amount of the solvent. If the surface energy is lower than 20 mN / m, the wettability around the nozzle hole is increased, the flight of the droplet is bent, and if the surface energy is higher than 70 mN / m, the meniscus shape at the nozzle tip is not stable.
This is because it becomes difficult to control the discharge amount and the discharge timing. 60 mN / m when the surface energy is 30 mN / m or more
It is preferable to adjust the following.

The adhesion between the fluid and the pattern forming surface can be measured by the contact angle. The fluid needs to be adjusted so that the contact angle with the pattern forming surface is not less than 30 degrees and not more than 170 degrees by adjusting the solute concentration, the type of the solvent, or the amount of the solvent. If the contact angle is less than 30 degrees, the wettability around the nozzle hole increases, causing flight deflection of the droplet. If the contact angle is more than 170 degrees, the meniscus shape at the nozzle tip is not stable, so that the discharge amount And it is difficult to control the ejection timing. In particular, it is preferable that the contact angle with the pattern formation surface is adjusted to be 35 degrees or more and 65 degrees or less.

The solute concentration in the fluid is 0.01 w
It is preferable that the amount is adjusted to 10 wt% or less at t% or more. If the solute concentration is lower than 0.01 wt%, a sufficient thickness of the resist layer cannot be formed unless a large amount of fluid is discharged, resulting in poor efficiency. If the solute concentration is higher than 10 wt%, it becomes difficult to discharge the fluid. This is because it increases the viscosity to a certain extent.

Table 1 shows composition examples of the resist material (solute) and the solvent.

[0030]

[Table 1]

In Table 1, for example, non-photosensitive polyimide can be used because it does not need photosensitivity if it has etching resistance, and has the advantage that it can be easily fluidized because it is possible with DMF. In addition, novolak resin
Since there is no need for a photosensitive group, there is an advantage that not only the synthesis cost is reduced but also the range of solvent selection is widened.
For the same reason, vinyl cinnamate and epoxy resins are also effective.

Glycerin and diethylene glycol can be used as the lubricant. The solute, solvent, lubricant, water, methanol, cellosolve solvent, and cyclohexanone are added to adjust physical properties so as to conform to the physical conditions of the fluid. Note that other materials may be used as the solute, the solvent, and the lubricant as long as the above conditions are satisfied and the resistance to the etchant at the time of etching is satisfied.

Each of the ink jet heads 21 to 2n has the same structure. It is sufficient that any of the heads is configured to be able to discharge a fluid by an inkjet method. The fluid 1x from the tank 3x (x is any number from 1 to n) is supplied to the ink jet head 2x in a one-to-one relationship. For example, in the case of an on-demand type piezo jet system, the ink jet head includes a vibration plate on one surface of a pressure chamber substrate having a plurality of pressure chambers, and is provided at a position corresponding to the pressure chamber of the vibration plate. The piezoelectric device includes a piezoelectric element in which a piezoelectric ceramic crystal is sandwiched between electrode films. A nozzle plate having a nozzle hole is attached to the other surface of the pressure chamber substrate. A fluid for improving conductivity is supplied to the pressurizing chamber from a tank. Then, when the ejection signal Sh from the control circuit 5 is supplied between the electrode films of the piezoelectric element, when the volume of the piezoelectric element changes, the pressure changes in the pressurizing chamber. When a pressure change occurs in the pressurizing chamber, liquid droplets of the fluid are discharged from the nozzle holes.

The ink-jet head 2x may have a bubble-type head structure in which heat is applied to a fluid by a heating element to discharge droplets by expansion of the fluid, in addition to the above-described structure. However, the condition is that the fluid 1x does not deteriorate due to heat or the like.

The tanks 31 to 3n contain the fluids 11 to 1n.
And each fluid 1 through a pipe
1 to 1n can be supplied to the ink jet heads 21 to 2n. Of course, if the resist material is limited to one type, it is not necessary to prepare a plurality of tanks, ink jet heads, and fluids.

The transport device 4 includes a motor 41, a motor 42, and a rotary motion / horizontal motion conversion mechanism (not shown). The motor 41 is configured to be able to convey the ink jet head 2x in the X-axis direction (horizontal direction in FIG. 1) according to the drive signal Sx. The motor M2 is configured to be able to convey the ink jet head 2x in the Y-axis direction (the depth direction in FIG. 1) according to the drive signal Sy. Head up and down,
That is, a motor and a mechanism for transporting in the Z-axis direction may be provided. It is sufficient that the transporting device 4 has a configuration capable of relatively changing the position of the inkjet head 2x with respect to the substrate 1. Therefore, in addition to the above configuration, the substrate 1
A configuration may be provided in which the mounting table of the substrate is moved so as to move with respect to the inkjet head 2x, or a configuration in which the substrate 1 is moved together with the inkjet head 2x may be provided.

The control circuit 5 is, for example, a computer device and includes a CPU, a memory, an interface circuit and the like (not shown). The control circuit 5 is configured to execute a pattern manufacturing method of the present invention on the apparatus by executing a predetermined program. That is, when the liquid droplets 10 of the fluid are ejected, the ejection signals Sh1 to Shn are supplied to any of the ink jet heads 21 to 2n, and when the head is moved, the drive signal Sx or Sy is supplied to the motor 41 or 42. It is configured to be possible. The control circuit 5 stores pattern position information, which is data for designating pattern formation, in a memory. This information is input by a user or analyzed and generated by reading a pattern diagram with a scanner or the like.

When the solidifying process is performed on the liquid droplets 10 of the fluid from the ink jet type head 2x in parallel with the application of the fluid, a solidifying device 6 may be further provided.
The solidifying device 6 is configured to be able to perform a physical, physicochemical, or chemical treatment on the droplet 10 or the pattern forming surface 100 in accordance with the control signal Sp supplied from the control circuit 5. For example, it is configured to be able to perform heating / drying processing by blowing hot air, laser irradiation, lamp irradiation, and chemical change processing by administration of a chemical substance.

(Manufacturing Method) Next, a pattern manufacturing method according to the present embodiment will be described with reference to FIGS. In each figure, (a) is a cross-sectional view of a manufacturing process of a substrate on which a pattern is to be formed, and (b) is a plan view of the substrate as viewed from a pattern formation surface. In the following description, a case where a transparent electrode film is formed on a glass substrate will be exemplified. Such a substrate is frequently used in a display panel, for example. As shown in FIGS. 3 to 7, the pattern manufacturing method in the present embodiment includes an etching target layer forming step, a fluid applying step, a solidifying step, an etching step, and a removing step.

Step of Forming Layer to be Etched (FIG. 3): The step of forming a layer to be etched is a step of forming a transparent electrode layer 101 and the like to be a layer to be etched on the substrate 1. The substrate 1 has mechanical strength, has optical transparency, and is physically and chemically stable, such as glass or quartz cut into a predetermined shape. The transparent electrode film 101 serves as an electrode for supplying an electric field to a liquid crystal or the like. As a material of the transparent electrode, a material having conductivity and light transmittance, for example, I
Use TO or mesa. As a method for forming the transparent electrode layer 101, various coating methods such as a spinner method, a spray method, a roll coater method, and a die coating method are used. This step is processed by a coating apparatus different from the pattern manufacturing apparatus of the present invention.

Fluid coating step (FIG. 4): The fluid coating step is related to the present invention, and the fluids 11 to 1n obtained by dissolving a resist material in a solvent are applied on the pattern forming surface 100 of the transparent electrode film 101 by an ink jet method. This is the step of performing Specific processing is shown in the flowchart of FIG.

First, the user operates the control circuit 5 using the input device.
Is entered (S1). The control circuit 5 selects a fluid (supposed to be 10) that meets the input conditions, and the inkjet head 2 to which the fluid 10 is supplied.
To identify. Of course, the user manually operates the fluids 11 to 1n.
May be selected. It is also important to select a resist material so that the resist pattern is not broken under the etchant or etching conditions used in the etching step (FIG. 6).

Next, the user designates the amount of the adhered fluid to the control circuit 5 using the input device (S2). For example, it is specified by the thickness of the resist layer to be formed. The control circuit 5 supplies the ejection signal Sh to be supplied to the inkjet head 2 and the drive signal S to be supplied to the transporting device 4 in accordance with the designation of the adhesion amount.
Determine x and Sy. That is, the amount of droplets of the fluid 10 ejected from the ink jet head 2 at one time, the number of droplets ejected per unit area, so that the fluid adheres at the amount designated by the user, The pitch between the droplets of the fluid on the pattern forming surface is determined. The amount of liquid droplets ejected at one time can be controlled by the voltage of the ejection signal Sh applied to the ink jet type recording two heads, for example, when the volume change of the piezoelectric element is voltage-dependent. The number of times droplets are ejected per unit area is determined by the correlation between the transport speed of the ink jet head 2 and the frequency of fluid ejection from the ink jet head 2. The pitch between the droplets of the fluid on the pattern forming surface is determined by the same relationship.

Next, the control circuit 5 refers to the pattern position information and causes the fluid to adhere to the pattern shape in a designated amount (S3 to S10). The pattern position information is, as shown in FIG. 8, the start point, the target point, and the end point of the pattern set as a set of coordinate values for each pattern.
The first pattern P1 shown in FIG. 8A is a continuous line segment, and target points P10 to P15 are set at the vertices of the line segment. At the time of pattern formation, the control circuit 5 discharges the fluid along the line segment while transporting the ink jet head 2 along the line segment between a certain target point and the next target point. As for the curve pattern, the curve is divided into a set of short line segments and target points are set at the vertices as pattern position information. For example, in a curve pattern P2 shown in FIG. 8B, target points P20 to P27 are set so that the pattern is formed substantially along the curve. Further, in the area pattern P3 shown in FIG. 8C, target points P30 to P43 are set so that the fluid can be applied to the entire surface by reciprocating the head.

Based on the pattern position information, the control circuit 5 reads the start position information and conveys the ink jet head 2 to the start position (S3). Next, the next target point is read (S4), and the discharge of the fluid is started at the set or determined discharge frequency of the droplet 10 (S4).
5). Then, the transport of the inkjet head 2 is started (S6). Unless the target coordinates are reached (S7: NO),
Conveyance of the ink jet head 2 is continued (S6), and when the coordinates reach the target coordinates (S7: YES), it is determined whether the next target point is set, that is, whether the pattern is completed (S9). As long as the pattern continues (S
9: NO), the ejection of the fluid 10 and the transport of the head are continued (S4 to S7). When the pattern is completed, it is checked whether there is another pattern to which the fluid is to be attached (S10). If there is another pattern (S10: Y
ES) and the pattern is formed (S3 to S3).
9).

By the above processing, the pattern forming surface 100
Resist pattern 102 on which a suitable amount of fluid 10 adheres
Is formed. In FIG. 4B, a total of four patterns are formed. In the case of a non-linear pattern or a wide pattern, the reciprocation of the ink jet head 2 is repeated to form a pattern to a desired width.

Solidification Step (FIG. 5): The solidification step is performed by the resist pattern 102 formed on the pattern formation surface 100.
Is a step of solidifying The control circuit 5 supplies the control signal Sp to the solidification device 6, for example, to heat the resist pattern 102. The purpose of the solidification treatment is to evaporate the solvent component and improve the adhesion to the pattern formation surface. Usually, heat treatment is common. It is not necessary to separate and treat the pre-baking (pre-drying) and the post-baking as in the related art, and it is possible to evaporate the solvent component at once and improve the adhesion. In order to perform the heat treatment, high-energy laser light such as an excimer laser is irradiated, or an excimer lamp or the like is irradiated. Further, heating may be performed by supplying electromagnetic waves such as infrared rays and microwaves. Alternatively, the substrate may be taken out from the pattern manufacturing apparatus and directly heated in an electric furnace or the like. As the solidification treatment, a chemical treatment can be applied in addition to the heat treatment. That is, a compound that causes a chemical reaction with the resist material is applied on the pattern by an ink jet method so as to deposit a solid compound to form a pattern. The solidification treatment may be performed by sequentially irradiating a laser beam to the resist pattern that has been subjected to the attachment operation in parallel with the attachment operation of the fluid. By the above-described solidification processing, the resist pattern 102 in which the resist material is solidified is formed. When this process is completed, the pattern does not collapse even if the substrate 1 is tilted.

Etching (FIG. 6): The etching step is a step of etching the resist pattern 102 to etch the layer 101 to be etched into the shape of the resist pattern. For the etching method, a known etching method such as wet etching or dry etching is applied depending on the material of the layer to be etched. For example, when etching a transparent electrode, hydrofluoric acid or the like is used as an etchant. By this etching step, the transparent electrode film 101 is removed according to the resist pattern 102.

Removal Step (FIG. 7): The removal step is a step of removing an unnecessary resist pattern from the etched substrate. After the etching, the resist pattern 102 is unnecessary, so the resist pattern is removed with a solvent that dissolves the resist material. For example, 120
The film is immersed in a peeling agent mainly composed of a phenol and a halogen-based organic solvent heated to a temperature of from 130 ° C. to 130 ° C. or a strong acid such as hot concentrated sulfuric acid, fuming nitric acid or sulfuric acid-hydrogen peroxide to be peeled off.

As described above, according to the present embodiment, since the resist material can be locally provided by the ink jet method, waste of the resist material is small. Further, since the amount of the resist material attached can be controlled in units of droplets, the resist material is not excessively used. Further, since the resist material does not need to be photosensitive, a material that could not be used conventionally can be used as the resist material.

(Other Modifications) The present invention can be applied in various modifications without depending on the above embodiment. For example, in the above-described process, the transparent electrode film is patterned on a substrate such as glass. However, the present invention can be applied to any pattern formation conventionally formed by lithography regardless of this. For example, by applying to patterning of a substrate or a semiconductor circuit on which a discrete component is mounted, an assembly substrate, an IC or an LS
Semiconductors such as I can be formed by small equipment at low manufacturing cost without complicated process control. Further, the pattern formed on the pattern forming surface is not limited to an electric circuit, and may be formed on the pattern forming surface for mechanical or design purposes. This is because the advantage of the inkjet method that a fine pattern can be easily formed with inexpensive equipment can be enjoyed as it is. For example, the present invention can be applied to character formation using a special material, which is conventionally performed by a printing apparatus.

Further, before the ejection of the fluid by the ink jet method, the surface on which the pattern is formed may be subjected to a surface modification treatment in advance. The surface treatment improves the adhesion of the fluid. For example, as a treatment for surface modification so that the pattern forming surface has affinity, a method of applying a silane coupling agent, a method of applying reverse sputtering with argon or the like, a method of applying corona discharge, depending on the presence or absence of polar molecules of the fluid, Treatment, plasma treatment, ultraviolet irradiation treatment, ozone treatment, degreasing treatment, etc.
Various known methods are applied. If the fluid does not contain polar molecules, a method of applying a silane coupling agent,
Various known methods such as a method of forming a porous film of aluminum oxide or silica, a method of applying reverse sputtering with argon or the like, a corona discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, an ozone treatment, a degreasing treatment, and the like can be applied. is there.

[0053]

According to the present invention, since a step of providing a resist locally is provided, the waste of the resist material is eliminated and the number of steps is significantly reduced as compared with the case where the lithography method is used, thereby reducing the manufacturing cost. Can be.

According to the present invention, specific options for adjusting the thickness of the resist are presented, and by considering the most suitable one of these methods, the waste of the resist material and the number of steps can be reduced. Manufacturing costs can be reduced.

According to the present invention, the condition of the fluid for locally providing the resist is presented, so that the resist can be used as long as the condition is satisfied, and the limitation on the selection of the resist can be expanded. .

According to the present invention, it is possible to expand the room for the user to select a resist by specifically presenting a composition for locally providing a resist.

According to the present invention, a manufacturing apparatus capable of locally providing a resist is provided. If a resist is formed using this apparatus, waste of resist material and man-hours can be reduced, and manufacturing cost can be reduced. be able to.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a pattern manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart illustrating a pattern manufacturing method according to the embodiment.

FIG. 3 is an explanatory view of a step of forming a layer to be etched;
(A) is a sectional view of the substrate, and (b) is a plan view of the substrate.

4A and 4B are explanatory views of a fluid adhering step, wherein FIG. 4A is a cross-sectional view of a substrate, and FIG. 4B is a plan view of the substrate.

5A and 5B are explanatory views of a solidification step, in which FIG. 5A is a cross-sectional view of a substrate, and FIG. 5B is a plan view of the substrate. This is a discharge step when a fluid containing fine particles is used.

FIGS. 6A and 6B are explanatory views of an etching step, wherein FIG. 6A is a sectional view of a substrate, and FIG. 6B is a plan view of the substrate. This is a heating step when a fluid containing fine particles is used.

FIGS. 7A and 7B are explanatory views of a removing step, wherein FIG. 7A is a cross-sectional view of a substrate, and FIG. 7B is a plan view of the substrate. This is an adhesive film forming step when an adhesive is used.

FIG. 8 is an explanatory diagram of pattern position information.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 2, 2x, 21-2n ... Ink-jet head 3, 3x, 31-3n ... Processing device 4 ... Conveying device 5 ... Control circuit 6 ... Solidification device 1x, 11-1n ... Fluid (pattern forming material) 100 ... Pattern forming surface 101 ... Transparent electrode film 102 ... Resist pattern

Claims (23)

[Claims] 1. A pattern manufacturing method for forming a resist pattern on a pattern forming surface, comprising a step of attaching a liquid droplet of a fluid in which a solute resist material is dissolved in a solvent to the pattern forming surface. A method for producing a pattern. 2. The pattern manufacturing method according to claim 1, wherein, in the step, droplets of the fluid are ejected from an ink jet head to adhere to the pattern forming surface. 3. The pattern manufacturing method according to claim 1, wherein in the step, a concentration of the resist material in the fluid is changed according to a condition required for the resist. 4. The pattern manufacturing method according to claim 1, wherein in the step, the amount of the droplets attached per unit area of the pattern forming surface is changed according to a condition required for the resist. 5. The pattern manufacturing method according to claim 4, wherein the amount of the droplet attached is controlled by the number of attachments of the droplet per unit area of the pattern forming surface. 6. The pattern manufacturing method according to claim 4, wherein the amount of the droplet attached is controlled by a pitch between the droplets attached to the pattern forming surface. 7. The pattern manufacturing method according to claim 4, wherein the amount of the droplet attached is controlled by the amount of the droplet attached at one time. 8. The fluid has a viscosity of 1 cp or more by adjusting the solute concentration, the type of solvent or the amount of solvent.
2. The pattern manufacturing method according to claim 1, wherein the pattern is adjusted to 0 cp or less. 9. The fluid has a viscosity of 2 cp or more by adjusting the solute concentration, the type of solvent or the amount of solvent.
The pattern manufacturing method according to claim 1, wherein the pattern is adjusted to not more than cp. 10. The pattern manufacturing method according to claim 1, wherein the surface energy of the fluid is adjusted to 20 mN / m or more and 70 mN / m or less by adjusting the solute concentration, the type of the solvent, or the amount of the solvent. Method. 11. The pattern manufacturing method according to claim 1, wherein the surface energy of the fluid is adjusted to 30 mN / m or more and 60 mN / m or less. 12. The fluid is adjusted such that a contact angle with respect to a material constituting the head nozzle surface is 30 degrees or more and 170 degrees or less by adjusting a solute concentration, a type of a solvent, or a solvent amount. The pattern manufacturing method according to claim 2. 13. The fluid is adjusted so that a contact angle with a material constituting the head nozzle surface is 35 degrees or more and 65 degrees or less by adjusting a solute concentration, a kind of a solvent, or a solvent amount. The pattern manufacturing method according to claim 2. 14. The fluid having a solute concentration of 0.0
14. The pattern manufacturing method according to claim 8, wherein the amount is adjusted to 1 wt% or more and 10 wt% or less. 15. The solvent in the fluid may be glycerin, diethylene glycol, methanol, ethanol,
Water, 1,3-dimethyl-2-imidazolidinone (DM
The pattern production method according to claim 1, wherein the pattern production method comprises one or more solvents selected from the group consisting of I), ethoxyethanol, N, N-dimethylformamide (DMF), N-methylpyrrolidone (NMP), and ethylene glycol ether. 16. The pattern manufacturing method according to claim 1, wherein the resist material is one of vinyl cinnamate, novolak resin, polyimide, and epoxy. 17. A step of solidifying the adhered droplets to form a resist pattern after the step of adhering the droplets of the fluid, and a step of etching the pattern forming surface on which the resist pattern is formed. The pattern manufacturing method according to claim 1, further comprising: 18. A pattern manufacturing apparatus for forming a resist pattern on a pattern forming surface, wherein a liquid droplet of a fluid in which a solute resist material is dissolved in a solvent can be attached to the pattern forming surface. An inkjet head, a transport device configured to change a relative position between the inkjet head and the pattern forming surface, and controlling ejection of the fluid from the inkjet head and driving by the driving device. A control device, wherein the control device attaches the liquid droplets of the fluid to the pattern forming surface from the ink jet head while moving the ink jet head along an arbitrary pattern forming region by the transport device. Characterized in that the resist pattern is formed by forming Down manufacturing equipment. 19. The ink-jet head according to claim 19, wherein said ink-jet head is configured to selectively discharge said fluid having a different concentration of a resist material, and said control device controls said ink-jet head according to a condition required for said resist. The pattern manufacturing apparatus according to claim 18, wherein the concentration of the fluid to be discharged to the nozzle is changeable. 20. The control device according to claim 18, wherein an amount of the fluid adhered to the pattern forming surface can be changed according to a condition required for the resist.
3. The pattern manufacturing apparatus according to 1. 21. The method according to claim 21, wherein the control unit changes the amount of the fluid adhered to the pattern forming surface by controlling the number of times the droplets are ejected per unit area of the pattern forming surface. 20. The pattern manufacturing apparatus according to 20. 22. The control device, wherein the control unit controls the ejection timing of the droplets of the ink jet head and the transport speed of the transport unit to change the pitch between the droplets adhering to the pattern forming surface, thereby controlling the pattern. 21. The pattern manufacturing apparatus according to claim 20, wherein an amount of the fluid attached is changed by attaching the fluid to a forming surface. 23. The ink jet type head is configured to be able to change a liquid droplet amount of the fluid discharged at one time, and the control device is configured to control the liquid droplets discharged by the ink jet type head. 21. The pattern manufacturing apparatus according to claim 20, wherein the amount of the fluid adhered to the pattern forming surface is changed by controlling the amount.