JPH1134559A - Certification identification ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a certification identification IC card having strength against bending and reliability by attaching a reinforcing plate to an area having a connecting part of components, and injecting resin to integrally mold it. SOLUTION: An IC chip 12 and coiled antenna 13 are connected at a connecting part 14 directly or via a cushion layer to the back of a surface sheet 11. Board resin 17 injected together with a reinforcing plate 15 covered with the part 14 is sealed between the sheet 11 and opposed sheet 16. As the plate 15, it is necessary to be strong against bending. Further, a material in which a reinforcing force is weakened due to separation of the resin of a periphery and the adhesive at the time of bending is not satisfactory. Therefore, resin sheet formed so as not to separate between the sheets by forming fine protrusions and recesses on the surface is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card suitable for use as an identification card for a driver's license, an employee card, a membership card, an alien registration card, a student card, or the like.

[0002]

2. Description of the Related Art A non-contact type IC card is capable of forming an authentication identification image such as a face image or printing on a surface because an electric component such as an IC chip is not exposed on the surface. Storing security data in a chip or the like is advantageous in preventing forgery and falsification, and is suitable for use as an authentication identification card (hereinafter, also referred to as an ID card). FIG. 1 shows an example of a component arrangement inside a card. As the production method, a heat bonding method, an adhesive bonding method, and an injection molding method are known.

As a method of manufacturing an IC card by injection molding, Japanese Patent Application Laid-Open Nos. 5-286292 and 5-286294.
No. 5-286295 and No. 7-232345, an IC card substrate having a concave portion for accommodating an IC module is manufactured by injection molding, and the module is placed in the concave portion, and
Japanese Patent Application Laid-Open No. Hei 5-218237 discloses that a foamable resin is injected into a skin container having a part including an IC chip mounted therein and foamed to fill the inside of the IC card with a resin. Japanese Unexamined Patent Publication No. Sho 61-26285 discloses that an IC card is formed by mounting a part including a surface sheet and an IC chip on one surface of a mold and injecting resin.
-222712, 61-222713, 61-
No. 222715 describes that an IC card is formed by mounting a component including an IC chip at a predetermined position in a mold and injecting resin. Further, a method of manufacturing by an adhesive bonding method is disclosed in JP-A-59-4898 and JP-A-60-4898.
No. 09887. Among these, there is an advantage that the process including the parts including both the top sheet and the IC chip placed in a predetermined position in the mold in advance, injecting resin, and integrally forming an IC card can simplify the process. There is.

[0004] Incidentally, since the ID card is used by an individual, it can be flexed by carrying or sitting in a waist pocket, and the electric parts such as an internal IC chip can be bent. Could be damaged. Therefore, the IC chip is hardly affected by the bending of the card, for example, it is devised to be located at any of the four corners.

[0005]

However, when a component including an IC chip is placed at a predetermined position in a mold and a resin is injected and integrally molded into an IC card, a gate for injecting the resin is provided. The positional relationship of components is regulated for reasons such as preventing the occurrence of weld lines and sink marks, and preventing the components and topsheet from being peeled off by the flow of the resin whose viscosity has increased. In many cases, it must be placed at the center.

Also, an IC is provided between top sheets facing each other with an adhesive.
When an IC card is formed by enclosing a component including a chip, an IC chip or the like may be moved to the vicinity of the center in preparation for intrusion of water or chemicals from the outside.

If the component including the IC chip is located near the center as described above, the joint may be disengaged due to bending, making it unusable.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an authentication identification IC card which is resistant to bending and has high reliability.

[0009]

SUMMARY OF THE INVENTION The object of the present invention is to achieve
A part including a C chip is placed at a predetermined position in a mold, and a reinforcing plate is placed along an area having a joint between the parts, and a resin is injected and integrally molded, or a resin sheet is bonded. An authentication identification IC card formed by bonding with an agent, the reinforcing plate being located on both sides sandwiching the joint, and being made of metal,
Achieved by

That is, the inventor of the present invention has conceived of setting a large resistance against bending in a region having a joint portion, and has reached the present invention.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to embodiments, but embodiments of the present invention are not limited thereto.

FIG. 2 shows a configuration of a cross section in the long side direction of the IC card according to the present invention.

In the figure, an IC chip 12 and a coiled antenna 13 are joined and adhered to a back surface of a top sheet 11 directly or via a cushion layer at a joining portion 14. The joint 1 between the sheet 11 and the opposing sheet 16
4 is sealed with the injected substrate resin 17 together with the reinforcing plate 15.

As the material of the topsheet, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), ABS resin, vinyl chloride resin, polycarbonate resin and the like can be used.

As the substrate resin, an ABS resin is generally widely used and can be applied to the present invention. However, PET-G (R) manufactured by Eastman Chemical Company, whose crystallization is controlled for injection molding, is: It is also preferable in that the image receiving sheet is easily fused.

Although the IC module shown in FIG. 2 has an antenna coil, an IC module having an antenna pattern formed on a printed circuit board may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. In this case, the bonding between the IC chip and the antenna pattern is performed using a conductive adhesive such as a silver paste, a copper paste, or a carbon paste (Hitachi Chemical's EN-4000 series,
This is performed using an anisotropic conductive film (such as Anisorm manufactured by Hitachi Chemical Co., Ltd.) or a Toshiba Chemical XAP series.

As the reinforcing plate, it is necessary to be strong against bending, and it is not preferable that the reinforcing plate is separated from the surrounding resin or adhesive when bent and has a weak reinforcing force. Therefore, a resin sheet or the like is used in which fine irregularities or the like are formed on the surface (for example, irregularities of 2 to 10 μm are randomly formed by surface buffing) so as not to separate. In the case of injection molding, a 25- to 100-μm-thick PET sheet, ABS resin sheet, or the like, whose surface softens slightly with respect to the injection temperature of the substrate resin to be injected and exhibits rigidity upon cooling, may be used.

Further, in order to provide a noise shielding effect, a stainless plate having a thickness of 20 to 80 μm or a sheet obtained by coating the above resin sheet with metal vapor deposition or the like may be used.

FIG. 3 is a diagram showing another example of an IC card according to the present invention.

Particularly, in the case of an IC card formed by injection molding, it is effective to use a reinforcing plate because it is weak against stress in a direction perpendicular to the card plane due to its structure. Is preferred. In the figure, the joint 20 between the IC chip 12 and the circuit board 19
Between the surface buffed stainless steel plates 151 and 152.

FIG. 4 is a view for explaining the integral molding method according to the present invention.

In FIG. 4, a sheet 11 having a component group 18 including an IC chip adhered to the back surface is placed on a lower mold 21 having a gate 23 and fixed by means such as vacuum suction. On the other hand, the top sheet 16 is also placed on the upper mold 22 and similarly fixed. A cavity 24 is formed by abutting both molds, and after injecting the substrate resin from the gate 23, the cavity 24 is compressed by the upper mold to a position corresponding to the thickness of the card indicated by the alternate long and short dash line as indicated by an arrow. Thus, the gate is cut, and the mold is opened to obtain the IC card as described above.

[0023]

According to the present invention, since the reinforcing plate is provided along the joint of the components, it is possible to obtain a reliable authentication / identification IC card which is resistant to bending and has high reliability by injection molding.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a component arrangement inside an IC card.

FIG. 2 is a diagram showing a configuration of a cross section in a long side direction of the IC card according to the present invention.

FIG. 3 is a diagram showing another example of the IC card according to the present invention.

FIG. 4 is a diagram illustrating an integral molding method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 2,12 IC chip 3a, 3b Electrode 4 Capacitor 5 Antenna 11,16 Surface sheet 13 Coiled antenna 14,20 Joining part 15,151,152 Reinforcement plate 17 Substrate resin 21 Lower mold 22 Upper mold 23 Gate 24 cavities

Claims (2)

[Claims] 1. A component including an IC chip is placed at a predetermined position in a mold, a reinforcing plate is provided along a region having a joint between the components, and a resin is injected and integrally molded. Alternatively, an authentication identification IC card formed by bonding a resin sheet with an adhesive. 2. The authentication / identification IC card according to claim 1, wherein the reinforcing plates are located on both sides of the joining portion and are made of metal.