JPH11347901A - Truing tool and chamfering device for wafer therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable truing of a grinding wheel by a simple mechanism. SOLUTION: A truer 10 consisting of a truing grinding wheel 14 fixed to the outer peripheral part of a base metal formed into a disk-shape is attached to a θ axis shaft 98 serving as a rotary axis of a wafer table 100. Truing is performed by moving the truer 10 toward an outer peripheral grinding wheel 108 while rotating the truer 10, and pressing the truer 10 against the groove 108a of the rotating outer peripheral grinding wheel 108.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a truing tool and a wafer chamfering device with a truing tool, and more particularly to a truing tool for truing a grindstone (outer circumference, notch) of the wafer chamfering device and a wafer chamfering device with a truing tool.

[0002]

2. Description of the Related Art A grindstone for chamfering a wafer such as silicon, which is a highly brittle material, mainly uses metal or resin as a binder. Metal bond whetstones have the advantage of high abrasive holding power, but even with tight tolerances, it is difficult to accurately align the center of the whetstone with the center of the spindle when attaching the whetstone to the spindle. There is a disadvantage that runout occurs on the outer periphery.

[0003] On the other hand, the resin bond whetstone does not have a high abrasive grain holding force, but after attaching the whetstone to the spindle, truing is executed to newly create a groove (a chamfering groove) of the whetstone. This has the advantage that the occurrence of runout can be suppressed.

[0004]

However, when truing a resin bond whetstone with a chamfering device,
A separate truing mechanism is required, and when the truing mechanism is provided in the chamfering device, there is a disadvantage that the entire chamfering device becomes large and complicated. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a truing tool and a wafer chamfering device with a truing tool that can perform truing of a grindstone with a simple mechanism.

[0005]

According to the present invention, there is provided a truing tool for truing a grindstone of a wafer chamfering apparatus, wherein the truing tool is provided on an outer peripheral portion of a disk-shaped base material. A truing grindstone is fixedly attached, is mounted coaxially with a wafer table of the wafer chamfering device, and rotates the wafer table and the grindstone so that they are relatively close to each other, thereby making contact with the grindstone while rotating. Then, the truing of the whetstone is performed.

According to the present invention, the truing tool is mounted coaxially with the wafer table, and the outer periphery of the truing tool is brought into contact with the outer periphery of the grindstone by rotating the wafer table and the grindstone relatively to each other. Truing the whetstone.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a truing tool and a wafer chamfering apparatus with a truing tool according to the present invention will be described below in detail with reference to the accompanying drawings. 1 and 2 are a side view and a plan view, respectively, showing a configuration of a wafer chamfering apparatus to which the present invention is applied. 3 and 4 are a sectional view taken along the line AA and a sectional view taken along the line BB of FIG. 1, respectively.

As shown in FIGS. 1 and 2, a wafer chamfering apparatus 40 according to the present embodiment mainly includes a wafer feed unit 42, an outer peripheral processing unit 44, and a notch processing unit 46. First, the configuration of the wafer feeding unit 42 will be described. As shown in FIGS. 1 and 3, on a base plate 50 disposed horizontally,
A pair of Y-axis guide rails 52 are laid at predetermined intervals. This pair of Y-axis guide rails 52,
, On the Y-axis via Y-axis linear guides 54, 54,.
A shaft table 56 is slidably supported.

On the lower surface of the Y-axis table 56, a nut member 5 is provided.
The nut member 58 is fixed to the pair of Y members.
It is screwed to a Y-axis ball screw 60 disposed between the axis guide rails 52, 52. Both ends of the Y-axis ball screw 60 are rotatably supported by bearing members 62, 62 disposed on the base plate 50, and one end of the Y-axis ball screw 60 is provided on one of the bearing members 62. Motor 64
Output shafts are connected. The Y-axis ball screw 60 is rotated by driving the Y-axis motor 64. As a result, the Y-axis table 56
Slide horizontally along 2. Hereinafter, the direction in which the Y-axis table 56 slides is referred to as the Y-axis direction.

As shown in FIGS. 2 and 4, on the Y-axis table 56, the pair of Y-axis guide rails 52, 5
2 and a pair of X-axis guide rails 66
Is laid. This pair of X-axis guide rails 66,
On X 66, X-axis linear guides 68, 68,.
A shaft table 70 is slidably supported. A nut member 72 is fixed to the lower surface of the X-axis table 70, and the nut member 72 is attached to the pair of X-axis guide rails 6.
It is screwed to an X-axis ball screw 74 disposed between the first and second X-ray balls 6 and 66. Both ends of the X-axis ball screw 74 have the X
It is rotatably supported by bearing members 76, 76 disposed on a shaft table 70, and one end thereof is connected to an output shaft of an X-axis motor 78 provided on one bearing member 76. . The X-axis ball screw 74 is rotated by driving the X-axis motor 78. As a result, the X-axis table 70 slides horizontally along the X-axis guide rails 66. Hereinafter, the direction in which the X-axis table 70 slides is referred to as the X-axis direction.

As shown in FIGS. 2 and 3, a Z-axis base 80 is vertically provided on the X-axis table 70, and a pair of Z-axis guide rails 8 are provided on the Z-axis base 80.
2, 82 are laid at predetermined intervals. A Z-axis table 86 is slidably supported on the pair of Z-axis guide rails 82 via Z-axis linear guides 84, 84.

A nut member 8 is provided on the side of the Z-axis table 86.
The nut member 88 is fixed to the pair of Zs.
It is screwed into a Z-axis ball screw 90 provided between the axis guide rails 82,82. The Z-axis ball screw 90 has a bearing member 9 whose both ends are disposed on the Z-axis base 80.
2, 92, the lower end of which is connected to the output shaft of a Z-axis motor 94 provided on the lower bearing member 92. The Z-axis ball screw 90 is rotated by driving the Z-axis motor 94. As a result, the Z-axis table 86 slides vertically along the Z-axis guide rails 82. Hereinafter, the direction in which the Z-axis table 86 slides is referred to as a Z-axis direction.

On the Z-axis table 86, a θ-axis motor 9 is provided.
6 are installed vertically. A θ-axis shaft 98 is connected to the output shaft of the θ-axis motor 96, and a wafer table 100 and a truer (truing tool) 10 are mounted on the θ-axis shaft 98. The wafer table 100 holds the wafer W to be chamfered by vacuum suction, and rotates by driving the θ-axis motor 96.

The truer 10 is for performing truing of a grindstone (periphery processing grindstone 108 and notch processing grindstone 122), which will be described later. As shown in FIG. Truing whetstone 14 on the part
Are integrally fixed. The truing grindstone 14 is formed in the same cross-sectional shape as the groove shape required for the grindstone, and by pressing the truing grindstone 14 against the outer periphery of the grindstone while rotating, a predetermined groove is formed on the outer periphery of the grindstone. Is formed. The truing whetstone 14 of the present embodiment has a triangular cross section.

The truer 10 is provided detachably with respect to the θ-axis shaft 98 so that it can be replaced when worn. The truer 10 mounted on the θ-axis shaft 98 is connected to the θ-axis motor 96.
, And rotates together with the wafer table 100. In the wafer feeding unit 42 configured as described above, the wafer table 100 and the truer 10 slide horizontally along the Y-axis direction by driving the Y-axis motor 64 to drive the X-axis motor 78. To slide horizontally along the X-axis direction. Then, by driving the Z-axis motor 94, it slides vertically along the Z-axis direction,
6 is rotated around the θ axis.

Next, the configuration of the outer peripheral processing unit 44 will be described. As shown in FIGS. 1, 2 and 6, a gantry 102 is installed vertically on the base plate 50. An outer peripheral motor 104 is installed vertically on the gantry 102, and an outer peripheral spindle 106 is connected to an output shaft of the outer peripheral motor 104. An outer peripheral grinding wheel 108 for chamfering the outer periphery of the wafer W is mounted on the outer peripheral spindle 106. Then, the mounted outer peripheral grinding wheel 108 is rotated by driving the outer peripheral motor 104.

The outer peripheral processing grindstone 108 has two steps of grooves 108a and 108b having the same shape as the chamfered shape required for the wafer W on its outer peripheral surface. , The periphery of the wafer W is chamfered (form whetstone). The outer peripheral processing unit 44 is configured as described above. Hereinafter, the Y-axis guide rail 5 passes through the rotation center O of the outer peripheral grinding wheel 108 of the outer peripheral processing unit 44.
The straight line parallel to 2 and 52 is defined as the “Y axis”, and the outer peripheral grinding wheel 1
A straight line that passes through the rotation center O of 08 and is parallel to the X-axis guide rails 66 is defined as “X-axis”. And the outer peripheral processing whetstone 1
The rotation axis of 08 is “Z axis”.

Next, the configuration of the notch processing unit 46 will be described. As shown in FIGS. 1, 2, and 6, a column 110 is vertically disposed on a side portion of the gantry 102 along a rotation axis (Z axis) of the outer peripheral grinding wheel 108.
The lower end of the support 110 is supported by the side surface of the gantry 102, and a horizontal beam 110A is integrally formed at the upper end. A pair of bearing members 112, 112 are provided at the tip of the beam portion 102A.
An arm 116 is swingably supported by the pins 2 and 112 via pins 114.

Notch motor 11 is provided at the tip of arm 116.
8 is supported, and a notch spindle 120 is connected to the output shaft of the notch motor 118. A notch grinding wheel 122 for chamfering a notch formed on the wafer W is mounted on the notch spindle 120.
Then, the mounted notch grinding wheel 122 is rotated by driving the notch motor 118.

The arm 116 is supported so as to be fixed by a lock means (not shown). Then, the arm 116 is held horizontally by fixing with the locking means as shown in FIG. 1 or FIG. 6, and in this state, the notch grinding wheel 122 is located on the Y axis. Although not shown in detail, the outer periphery processing grindstone 10 is also provided on the outer periphery of the notch grinding wheel 122.
Like FIG. 8, two grooves having the same shape as the chamfered shape required for the wafer W are formed.

Next, the operation of the wafer chamfering apparatus 40 configured as described above will be described. First, a method of chamfering a wafer W by the wafer chamfering device 40 will be described. Here, the notched wafer W
Will be described.

In the initial state, the wafer table 10
Numeral 0 indicates that the rotation axis θ is located on the Y axis and is located at a position separated by a predetermined distance from the axis (Z axis) of the outer peripheral grinding wheel 108. Further, it is located at a position at a predetermined height with respect to the outer peripheral grinding wheel 108. Hereinafter, the position of the wafer table 100 is referred to as the “origin position” of the wafer table 100.

First, the wafer W is positioned and mounted on the wafer table 100 by a transfer device (not shown), and is suction-held. At this time, the wafer W is moved to its center O
_The wafer _W is placed so that _W coincides with the rotation axis θ of the wafer table 100, and is placed and suction-held so that its notch NO is located on the Y axis. The wafer W sucked and held on the wafer table 100 as described above is
As shown in (a), the center _OW is located on the Y axis and is located at a predetermined distance from the outer peripheral grinding wheel 108. Also, the groove 10 on the lower side of the outer peripheral grinding wheel 108
It is located at the same height as 8a. This position of the wafer W is defined as the “peripheral processing position” of the wafer W.

FIGS. 7A to 7D show a procedure for chamfering a circular portion C of the wafer W. First, the outer peripheral motor 104 and the θ-axis motor 96 are driven, and the outer peripheral processing grindstone 108 and the wafer table 100 are both rotated in the same direction at a high speed. Outer processing grinding wheel 108 and wafer table 1
When the rotation of the motor 00 is stabilized, the Y-axis motor 64
Is driven, and the wafer W is moved along the Y-axis on the outer peripheral grinding wheel 108.
Sent to. Here, the feed speed of the wafer W is reduced immediately before the wafer W comes into contact with the outer peripheral grinding wheel 108, and thereafter, the wafer W is moved to the outer peripheral grinding wheel 108.
Sent at a slow speed towards.

As shown in FIG. 7B, the peripheral edge of the wafer W sent toward the outer peripheral grinding wheel 108 contacts the groove 108a of the outer peripheral grinding wheel 108. Even after this contact, the wafer W is slowly sent toward the outer peripheral grinding wheel 108, and as a result, the circular portion C of the wafer W is ground and chamfered on the outer peripheral grinding wheel 108 by a small amount. FIG.
As shown in (c), when the center distance between the outer peripheral grinding wheel 108 and the wafer table 100 reaches a predetermined distance L, Y
The driving of the shaft motor 64 is stopped. After the stop, the Y-axis motor 64 is driven in the reverse direction, whereby the wafer W moves on the Y-axis in a direction away from the outer peripheral processing grindstone 108 and returns to the outer peripheral processing position, as shown in FIG. I do. When the wafer W returns to the outer peripheral processing position, the driving of the θ-axis motor 96 and the outer peripheral motor 104 is stopped, and the rotation of the wafer table 100 and the outer peripheral processing grindstone 108 is stopped.

With the above, the chamfering of the circular portion C of the wafer W is completed. Next, chamfering of the notch NO of the wafer W is performed. As shown in FIG. 7D, the wafer W returned to the outer peripheral processing position has the notch NO of Y
It is located on the axis. From this state, the Z-axis motor 94 is driven, and the wafer table 100 moves by a predetermined amount along the Z-axis direction. As a result, the wafer W is positioned at the same height as the groove below the notch grinding wheel 122. next,
The X-axis motor 78 is driven, and the wafer W moves by a predetermined amount in the X-axis direction. As a result, as shown in FIG. 8A, the corner NR of the notch NO formed on the wafer W is located on the Y axis. Hereinafter, the position of the wafer W is referred to as a “notch processing position” of the wafer W.

When the wafer W is located at the notch processing position, the notch motor 118 is driven, and the notch grinding wheel 122 rotates at high speed. At the same time, the Y-axis motor 6
4 is driven, and the wafer W moves toward the notch grinding wheel 122. When the wafer W moves a predetermined distance, the driving of the Y-axis motor 64 is stopped, and as a result, the notch corner NR of the wafer W comes into contact with the groove of the notch grinding wheel 122 as shown in FIG. Then, simultaneously with this contact, the X-axis motor 78 and the Y-axis motor 64 are simultaneously driven, so that the wafer W is fed in the X-axis direction and the Y-axis direction. The feed of the wafer W is given along the shape of the notch corner NR, and as a result, the notch corner NR
Always comes into contact with the notch grinding wheel 122, and the notch corner NR is chamfered.

When the chamfering of the notch corner NR is completed, the wafer W is continuously fed in the X-axis direction and the Y-axis direction, and the notch NO is chamfered. That is, as shown in FIG. 8C, the wafer W is fed along the shape of the notch NO such that the notch NO always contacts the notch grinding wheel 122. In this case, the notch NO is formed in a V-shape.
The wafer W is fed so as to draw a V-shape along the shape of the notch NO. As a result, the V-shaped notch NO is chamfered.

When the chamfering of the notch NO is completed, FIG.
As shown in (d), the contact point between the notch grinding wheel 122 and the wafer W reaches the notch corner NR on the other side.
When the contact point reaches the notch corner NR on the other side, the notch corner NR is chamfered continuously. That is, feed in the X-axis direction and feed in the Y-axis direction are given to the wafer W, and feed is given to the wafer W along the shape of the notch corner NR so that the notch corner NR always contacts the notch grinding wheel 122. . As a result, the notch corner NR of the wafer W is chamfered.

When the chamfering of the other notch corner NR is completed, the feeding of the wafer W is temporarily stopped. Then, from this state, a feed is given to the wafer W by an operation reverse to the above, and the notch corner NR,
The notch NO and the notch corner NR on the other side are chamfered. By repeating the above operation a plurality of times, the notch NO and the notch corner NR are chamfered.

When the chamfering of the notch NO and the notch corner NR is completed, the wafer W stops at the position where the chamfering of the notch is started, that is, the position shown in FIG.
Then, after the stop, it moves by a predetermined amount in a direction away from the notch processing grindstone 122 and returns to the notch processing position shown in FIG. When the wafer W returns to the notch processing position, the wafer table 100 moves a predetermined amount along the X-axis direction and a predetermined amount along the Z-axis direction, and returns to the origin position. On the other hand, at the same time, the driving of the notch motor 118 is stopped, and the rotation of the notch grinding wheel 122 is stopped.

In the above series of steps, the circular portion C of the wafer W,
The chamfering of the notch NO and the notch corner NR is completed. When the wafer table 100 returns to the home position, the suction of the wafer W is released, and the wafer W is picked up by a transfer device (not shown) and transferred to the next process as it is. Next, a method of truing the outer peripheral grinding wheel 108 by the truer 10 provided in the wafer chamfering apparatus 40 will be described.

In the initial state, the wafer table 10
Numeral 0 indicates that the rotation axis θ is located on the Y axis and is located at a predetermined distance from the axis (Z axis) of the outer peripheral grinding wheel 108. Further, it is located at a position at a predetermined height with respect to the outer peripheral grinding wheel 108 (origin position). First, the operator attaches the outer peripheral processing grindstone 108 to the outer peripheral spindle 106 and attaches the notch processing grindstone 122 to the notch spindle 120. At this time, a resin bond grindstone capable of truing is used for the outer peripheral grindstone 108 and the notch grindstone 122.

Outer peripheral grinding wheel 108 and notch grinding wheel 12
When the mounting of 2 is completed, the operator issues a truing execution command to the wafer chamfering device 40. The control unit (not shown) of the wafer chamfering device 40 receiving the execution instruction
Performs the truing of the outer peripheral grinding wheel 108 and the notch grinding wheel 122 as follows. First, the Z-axis motor 9
4 is driven, and the truer 10 moves by a predetermined amount along the Z-axis direction. As a result, as shown in FIG. 9A, the truer 10 is positioned at the same height as the groove 108a on the lower side of the outer peripheral grinding wheel 108. Hereinafter, the position of the truer 10 will be referred to as the “first outer circumferential groove truing position” of the truer 10.

Next, the outer peripheral motor 104 and the θ-axis motor 96
Is driven, and both the outer peripheral grinding wheel 108 and the truer 10 start rotating at high speed in the same direction. At this time, the wafer table 100 also rotates with the rotation of the truer 10. When the rotation of the outer peripheral grinding wheel 108 and the truer 10 is stabilized, the Y-axis motor 64 is driven, and the truer 10 moves on the Y axis toward the outer peripheral grinding wheel 108.

The truer 10 having moved toward the outer peripheral grinding wheel 108 decelerates immediately before coming into contact with the outer peripheral grinding wheel 108, moves at a slow speed as it is, and contacts the groove 108 a of the outer peripheral grinding wheel 108. Even after this contact, the truer 10 moves slowly on the Y-axis toward the outer peripheral grinding wheel 108, and as a result, the groove 108 a of the outer peripheral grinding wheel 108 is ground and trued by the truing grindstone 14 by a small amount.

As shown in FIG. 9B, the truer 10 stops when the distance between the axes of the truer grinding wheel 108 and the outer peripheral processing wheel 108 reaches a predetermined distance L. Then, after the stop, as shown in FIG. 9 (c), it moves on the Y-axis in a direction away from the outer peripheral grinding wheel 108 and returns to the first outer peripheral groove truing position. Thus, the truing of the groove 108a on the lower side of the outer peripheral grinding wheel 108 is completed. Next, truing of the upper groove 108b of the outer peripheral grinding wheel 108 is performed.

When the truer 10 returns to the first outer groove truing position, the Z-axis motor 94 is driven, and the truer 10 moves by a predetermined amount in the Z-axis direction. As a result, the truer 10 is positioned at the same height as the upper groove 108b of the outer peripheral grinding wheel 108. Hereinafter, the position of the truer 10 will be referred to as the second outer peripheral groove truing position of the truer 10.

Next, the Y-axis motor 64 is driven, and the truer 10 moves on the Y-axis toward the outer peripheral grinding wheel 108. The truer 1 moved toward the outer peripheral grinding wheel 108
0 decelerates immediately before contacting the outer peripheral grinding wheel 108, moves at a slow speed as it is, and comes into contact with the groove 108b of the outer peripheral grinding wheel 108. After this contact, the tool 10 also moves slowly on the Y-axis toward the outer peripheral grinding wheel 108, and as a result, the groove 108 of the outer peripheral grinding wheel 108
b is ground and trued by the truing grindstone 14 in minute amounts.

The truer 10 stops when the distance between its axes and the outer peripheral grinding wheel 108 reaches a predetermined distance L.
It moves on the Y axis in a direction away from the outer peripheral processing grindstone 108 and returns to the second outer peripheral groove truing position. Truer 10
Is returned to the second outer peripheral groove truing position, the driving of the outer peripheral motor 104 is stopped, and the rotation of the outer peripheral processing grindstone 108 is stopped.

Through a series of steps described above, the truing of the outer peripheral grinding wheel 108 is completed. Next, the notch grinding wheel 122
Truing is performed. First, the Z-axis motor 94 is driven, and the truer 10 moves by a predetermined amount along the Z-axis direction. As a result, the truer 10 becomes the notch grinding wheel 122.
Is located at the same height as the lower groove. Hereinafter, the position of the truer 10 will be referred to as the “first notch groove truing position” of the truer 10.

Next, the notch motor 118 is driven, and the notch grinding wheel 122 starts rotating at a high speed in the same direction as the wafer table 100. When the rotation of the notch grinding wheel 122 and the rotation of the truer 10 are stabilized, the Y-axis motor 6
4 is driven, and the truer 10 moves on the Y axis toward the notch grinding wheel 122.

The truer 10 that has moved toward the notch grinding wheel 122 decelerates immediately before coming into contact with the notch grinding wheel 122, moves at a slow speed, and comes into contact with the groove of the notch grinding wheel 122. After this contact, the tool 10 also moves slowly on the Y axis toward the notch grinding wheel 122, and as a result, the notch grinding wheel 122
Are ground by a small amount on the truing grindstone 14 and truing is performed.

The truer 10 stops when the distance between the shaft and the notch grinding wheel 122 reaches a predetermined distance. Then, after the stop, it moves on the Y axis in a direction away from the notch grinding wheel 122 and returns to the first notch groove truing position. Thus, the truing of the groove on the lower side of the notch grinding wheel 122 is completed. Next, the notch grinding wheel 122
Truing of the upper groove is performed.

When the truer 10 returns to the first notch groove truing position, the Z-axis motor 94 is driven, and the truer 10 moves by a predetermined amount in the Z-axis direction. As a result,
The groove 10 on the upper side of the notch grinding wheel 122
It is located at the same height as b. Hereafter, this truer 1
The position of 0 is defined as the second notch groove truing position of the truer 10.

Next, the Y-axis motor 64 is driven, and the truer 10 moves on the Y-axis toward the notch grinding wheel 122. The truer 10 that has moved toward the notch grinding wheel 122 decelerates immediately before contacting the notch grinding wheel 122, moves at a slow speed as it is, and contacts the groove of the notch grinding wheel 122. Even after this contact, the truer 10 slowly moves on the Y axis toward the notch grinding wheel 122, and as a result, the groove of the notch grinding wheel 122 is ground by the truing grindstone 14 by a small amount and trued.

The truer 10 stops when the center distance between the notch grinding wheel 122 and the notch processing wheel 122 reaches a predetermined distance.
It moves in the direction away from the notch grinding wheel 122 on the Y axis and returns to the second notch groove truing position. When the truer 10 returns to the second notch groove truing position, the driving of the notch motor 118 and the θ-axis motor 96 are stopped,
The rotation of the truer 10 and the notch grinding wheel 122 stops. Then, the Z-axis motor 94 is driven, and the wafer table 100 moves by a predetermined amount along the Z-axis direction, and returns to the origin position.

Through the series of steps described above, the truing of the outer peripheral grinding wheel 108 and the notch grinding wheel 122 is completed. The groove 108 of the outer peripheral processing grindstone on which the truing has been performed in this manner.
Since the grooves a and 108b and the grooves of the notch processing grindstone 122 are perfect circles, no run-out occurs even when rotated at a high speed, and the precision of the processed surface can be improved. Thus, in the wafer chamfering apparatus 40 of the present embodiment, the wafer table 10
By attaching the lure 10 to the rotation axis 0, the outer peripheral grinding wheel 10 can be easily formed without using a separate large-scale mechanism.
8 and the notch grinding wheel 122 can be trued.

In this embodiment, the outer peripheral grinding wheel 108 and the notch grinding wheel 122 in which grooves are formed in advance are used.
Has been described with an example in which truing is performed.
8 and the groove of the notch grinding wheel 122 may be formed by truing. Below, this truer 10
A method of forming a groove by the method will be described. First, the operator mounts the outer peripheral grinding wheel 108 on the outer peripheral spindle 106. Here, as shown in FIG. 10A, the outer peripheral processing grindstone 108 mounted on the outer peripheral spindle 106 has no groove formed on the outer periphery.

When the mounting of the outer peripheral processing whetstone 108 is completed,
The operator issues a truing execution command to the wafer chamfering device 40, and truing is performed. First, Z
The shaft motor 94 is driven, and the truer 10 moves a predetermined amount along the Z-axis direction. As a result, as shown in FIG. 10A, the truer 10 is located at a predetermined first groove forming position. The first groove forming position is a position of the same height as the lower groove 108a of the two-step groove formed on the outer peripheral grinding wheel 108.

Next, the outer peripheral motor 104 and the θ-axis motor 96
Is driven, and both the outer peripheral grinding wheel 108 and the truer 10 start rotating at high speed in the same direction. And the outer peripheral processing whetstone 1
08 and when the rotation of the truer 10 is stabilized, the Y-axis motor 64 is driven, and the truer 10 moves on the Y-axis toward the outer peripheral grinding wheel 108. The tool 10 moved toward the outer peripheral grinding wheel 108 is moved to the outer peripheral grinding wheel 108.
Decelerates immediately before contacting the surface, moves at a slow speed, and comes into contact with the groove 108a of the outer peripheral grinding wheel 108. Even after this contact, the truer 10 slowly moves on the Y axis toward the outer peripheral grinding wheel 108, and as a result, as shown in FIG. Groove 10
8b are formed.

As shown in FIG. 10 (b), the truer 10 stops when the distance between the shaft and the outer peripheral grinding wheel 108 reaches a predetermined distance L. Then, after the stop, as shown in FIG. 10 (c), it moves on the Y axis in a direction away from the outer peripheral grinding wheel 108 and returns to the first groove forming position. From the above,
A groove 108a on the lower side of the outer peripheral grinding wheel 108 is formed.
Next, the upper groove 108b of the outer peripheral grinding wheel 108 is formed.

When the truer 10 returns to the first groove forming position, the Z-axis motor 94 is driven, and the truer 10 moves by a predetermined amount in the Z-axis direction. As a result, the truer 10 is located at the predetermined second groove forming position. The second groove forming position is a position having the same height as the upper groove 108b formed on the outer peripheral grinding wheel 108. Next, the Y-axis motor 64 is driven, and the truer 10 moves on the Y-axis toward the outer peripheral grinding wheel 108. The tool 10 that has moved toward the outer peripheral grinding wheel 108 decelerates immediately before coming into contact with the outer peripheral grinding wheel 108, moves at a slow speed, and comes into contact with the outer peripheral surface of the outer peripheral grinding wheel 108. Even after this contact, the truer 10 slowly moves on the Y axis toward the outer peripheral grinding wheel 108, and as a result, the outer peripheral grinding wheel 1
08 is ground on the truing grindstone 14 by a small amount to form a groove 108b.

The truer 10 stops when the distance between its axes and the outer peripheral grinding wheel 108 reaches a predetermined distance L.
It moves on the Y axis in a direction away from the outer peripheral grinding wheel 108 and returns to the second groove forming position. Thus, the truing of the groove 108a on the lower side of the outer peripheral grinding wheel 108 is completed.
When the truer 10 returns to the second groove forming position, the driving of the outer peripheral motor 104 and the θ-axis motor 96 is stopped, and the rotation of the truer 10 and the outer peripheral processing grindstone 108 is stopped. And
The Z-axis motor 94 is driven, and the wafer table 100 moves by a predetermined amount along the Z-axis direction, and returns to the origin position.

In the above steps, the grooves 10 of the outer peripheral grinding wheel 108 are formed.
The formation of 8a and 108b is completed. Since the grooves 108a and 108b of the outer peripheral processing grindstone 108 thus formed have a perfect circle, even when the outer peripheral processing grindstone 108 is rotated at a high speed, no run-out occurs, and the accuracy of the processed surface can be improved.
Thus, in the wafer chamfering apparatus 40 of the present embodiment, the groove 108 of the outer peripheral processing grindstone 108 is formed by truing.
a, 108b can also be formed. Similarly,
The groove of the notch grinding wheel 122 can also be formed.

Further, in the present embodiment, an example has been described in which the grinding wheel mounted on the spindle is formed into a perfect circle by truing. However, the truer 10 of the present embodiment is capable of truing a grinding wheel having a shape collapse due to use. It can also be used effectively. Further, in the present embodiment, the truer 10 is configured to be mounted on the θ-axis shaft 98, but the installation position of the truer 10 is not limited to this position. That is, the wafer table 10
Any configuration may be used as long as it rotates and moves together with 0, and may be mounted on the wafer table 100, or may be mounted by suction and holding on the wafer table 100.

Further, in the wafer chamfering apparatus 40 of the present embodiment, the truing is performed by moving the wafer table 100 to bring the truer 10 into contact with the outer peripheral grinding wheel 108. By moving the processing grindstone 108 side, the truer 10 may be brought into contact with the outer peripheral processing grindstone 108 to perform truing, or both may be moved to perform truing. Is also good.

Further, in this embodiment, grooves 108a and 108 having the same shape as the chamfered shape required for wafer W are used.
Although the example has been described in which the outer peripheral processing whetstone (form whetstone) on which the b is formed is trued, the truer 10 of the present embodiment is used.
As shown in FIG. 11, the present invention can also be applied to the case where the grinding stone 130 having the trapezoidal groove 130A formed on the outer periphery is trued. In this case, truing is performed as shown in FIG.
As shown in (a) and (b), the taper 10 is formed on the tapered surfaces 130a and 130b formed above and below the groove 130A.
Is carried out by pressing the truing whetstone 14.

Further, in the truer 10 of the present embodiment, the shape of the truing grindstone 14 is formed to have a triangular cross section. However, the shape of the truing grindstone 14 is not limited to this shape, and the object of truing is not limited. Used appropriately according to the groove shape of the grindstone to be used.

[0060]

As described above, according to the present invention,
By simply mounting the grinding wheel coaxially with the wafer table of the wafer chamfering device, the grinding stone can be easily trued without using a separate large-scale mechanism.

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration of a wafer chamfering apparatus.

FIG. 2 is a plan view showing a configuration of a wafer chamfering apparatus.

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is a sectional view taken along line BB of FIG. 1;

FIG. 5 is a partial front sectional view showing the configuration of a truer.

FIG. 6 is a front view showing a configuration of an outer peripheral processing unit and a notch processing unit.

FIG. 7 is an explanatory view of a method of chamfering a circular portion of a notched wafer.

FIG. 8 is an explanatory view of a method of chamfering a notch and a notch corner of a notched wafer.

FIG. 9 is an explanatory view of a truing method of a grindstone.

FIG. 10 is an explanatory view of a truing method of a grindstone.

FIG. 11 is an explanatory view of a truing method of a grinding wheel according to another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Truer (truing tool) 12 ... Base material 14 ... Truing grindstone 40 ... Wafer chamfering device 42 ... Wafer feeding unit 44 ... Outer periphery processing unit 46 ... Notch processing unit 56 ... Y-axis table 64 ... Y-axis motor 70 ... X-axis table 78: X-axis motor 86: Z-axis table 96: θ-axis motor 100: wafer table 104: outer peripheral motor 108: outer peripheral grinding wheel W: wafer

Claims (4)

[Claims] 1. A truing tool for truing a grindstone of a wafer chamfering apparatus, wherein the truing tool is formed by fixing a truing grindstone to an outer peripheral portion of a base material formed in a disk shape.
Attached coaxially to the wafer table of the wafer chamfering device, by rotating the wafer table and the grindstone relatively close to each other, and contacting the grindstone while rotating to truing the grindstone, Truing tool. 2. The truing tool according to claim 1, wherein the truing tool is mounted coaxially with the wafer table by being suction-held by the wafer table. 3. The truing tool according to claim 1, wherein the truing tool is mounted on a rotating shaft of the wafer table. 4. A wafer chamfering device for chamfering the periphery of the wafer by bringing the rotating wafer held by the wafer table and the rotating grindstone relatively close to each other so that the periphery of the wafer comes into contact with the grindstone. In the above, the wafer table is provided with a truing tool in which a truing grindstone is fixed to an outer peripheral portion of a base material formed coaxially in a disk shape, and the wafer table and the grindstone are rotated to be relatively close to each other. The truing tool abuts the grindstone to truing the grindstone, whereby a wafer chamfering apparatus with a truing tool is provided.