JPH11348041A - Synthetic resin molding die, and method for heating and cooling it - Google Patents
Synthetic resin molding die, and method for heating and cooling itInfo
- Publication number
- JPH11348041A JPH11348041A JP15936098A JP15936098A JPH11348041A JP H11348041 A JPH11348041 A JP H11348041A JP 15936098 A JP15936098 A JP 15936098A JP 15936098 A JP15936098 A JP 15936098A JP H11348041 A JPH11348041 A JP H11348041A
- Authority
- JP
- Japan
- Prior art keywords
- heating
- cooling
- circuit
- mold
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 101
- 238000001816 cooling Methods 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000000465 moulding Methods 0.000 title claims abstract description 31
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 20
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000498 cooling water Substances 0.000 claims abstract description 10
- 239000002826 coolant Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 23
- 239000011347 resin Substances 0.000 abstract description 23
- 238000001746 injection moulding Methods 0.000 description 10
- 238000000748 compression moulding Methods 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 238000007664 blowing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、合成樹脂成形用金
型およびその加熱・冷却方法に係り、詳しくは、熱可塑
性樹脂あるいは熱硬化性樹脂の射出成形あるいは圧縮成
形において、金型を繰り返し加熱・冷却する合成樹脂成
形用金型およびその加熱・冷却方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for molding a synthetic resin and a method for heating and cooling the same. More specifically, the present invention relates to a method of repeatedly heating a mold in injection molding or compression molding of a thermoplastic resin or a thermosetting resin. The present invention relates to a synthetic resin molding die to be cooled and a heating / cooling method thereof.
【０００２】[0002]
【従来の技術】熱可塑性樹脂を射出成形あるいは圧縮成
形する場合、高温にした金型に溶融樹脂を充填し、その
後低温にした金型で溶融樹脂を冷却して、取り出し後の
製品の変形を防止することが望ましい。2. Description of the Related Art In injection molding or compression molding of a thermoplastic resin, a molten resin is filled into a high-temperature mold, and then the molten resin is cooled by a low-temperature mold to prevent deformation of the product after being taken out. It is desirable to prevent it.
【０００３】熱硬化性樹脂を射出成形あるいは圧縮成形
する場合においても、高温にした金型に溶融樹脂を充填
し硬化反応を行ない、その後金型温度を下げて溶融樹脂
を冷却して、取り出し後の製品の変形を防止することが
望ましい。In the case of injection molding or compression molding of a thermosetting resin, a molten resin is filled in a high-temperature mold and a curing reaction is carried out. Thereafter, the temperature of the mold is lowered and the molten resin is cooled. It is desirable to prevent deformation of the product.
【０００４】通常、熱可塑性樹脂の射出成形あるいは圧
縮成形においては、金型温度を上下する時間によって成
形サイクルが延びることを避けるために、溶融樹脂をな
んとか充填することができて取り出し後の製品の変形も
なんとか防止できる共通の金型温度領域を見付け、金型
温度を一定にして成形を行なっている。Normally, in injection molding or compression molding of a thermoplastic resin, in order to prevent the molding cycle from being prolonged by the time when the temperature of the mold rises or falls, the molten resin can be filled somehow and the product after removal is removed. They find a common mold temperature region that can somehow prevent deformation, and mold at a constant mold temperature.
【０００５】また、熱硬化性樹脂の射出成形あるいは圧
縮成形においては、金型の温度低下と冷却時間をできる
だけ少なくして成形サイクルが延びないないようにして
いる。[0005] In injection molding or compression molding of a thermosetting resin, the temperature of the mold and the cooling time are reduced as much as possible so that the molding cycle is not extended.
【０００６】しかしながら、熱可塑性樹脂の射出成形に
おいて、溶融樹脂を金型に充填する際に金型温度を高く
しておくと、樹脂の流動性がよいので薄肉成形に有利で
あるのみならず金型表面の転写が良好であり、ウエルド
ラインも目立たなくなることから、溶融樹脂を金型に充
填する間だけ金型表面のみを加熱する発明が数多く提案
されている。However, in the injection molding of a thermoplastic resin, if the temperature of the mold is set high when the molten resin is filled into the mold, the resin has good fluidity, which is advantageous not only for thin-wall molding but also for metal molding. Since the transfer of the mold surface is good and the weld line becomes inconspicuous, many inventions have been proposed in which only the mold surface is heated while the mold is filled with the molten resin.
【０００７】例えば、特公昭４５−２２０２０号公報に
は熱風による加熱方法、特開昭５１−２２７５９号公報
には電気ヒータによる加熱方法と水冷の組み合わせ、特
開昭５５−１０９６３９号公報には高周波誘導加熱方
法、特開昭５７−１６５２２９号公報にはキャビティ内
に蒸気を吹きこむ方法、特開昭６１−７９６１４号公報
にはキャビティとコアの間に熱板を挟む方法、特開昭６
４−４２２１７号公報にはハロゲン電球で加熱する方
法、特開平４−２６５７２０号公報には電気伝導層によ
る金型表面加熱方法などが提案されている。For example, Japanese Patent Publication No. 45-22020 discloses a heating method using hot air, Japanese Patent Application Laid-Open No. 51-22759 discloses a combination of a heating method using an electric heater and water cooling, and Japanese Patent Application Laid-Open No. 55-109639 discloses a high-frequency heating method. JP-A-57-165229 discloses a method of blowing steam into a cavity. JP-A-61-79614 discloses a method of sandwiching a hot plate between a cavity and a core.
Japanese Patent Application Laid-Open No. 4-42217 proposes a method of heating with a halogen bulb, and Japanese Patent Application Laid-Open No. 4-265720 proposes a method of heating a mold surface with an electric conductive layer.
【０００８】蒸気や熱水あるいは油などの加熱媒体を冷
却媒体と共通の回路に通す例としては、特開昭５６−５
５２１９、特開昭５８−１２７３９、特開昭６０−５４
８２８各号公報などがある。An example of passing a heating medium such as steam, hot water or oil through a common circuit with a cooling medium is disclosed in
5219, JP-A-58-12739, JP-A-60-54
828 publications.
【０００９】しかし、共通の回路を用いて加熱と冷却を
行なうと、金型の深部まで加熱され不必要な冷却を行な
うのみならず、加熱と冷却の切り換えに時間がかかるこ
とやキャビティ以外の部分も同時に加熱されたり冷却さ
れたりする不必要な作業が行なわれ加熱と冷却の応答性
が悪くなる。応答性を改良する目的で、特関昭５８−２
１５３０９号公報には加熱媒体と冷却媒体を別個のタン
クから供給しそれぞれに戻す方法、特開昭６２−２０８
９１８号公報には共通回路部分を極力少なくする方法、
特開平１−２６９５１５には金型加熱時だけ媒体経路の
途中で媒体を加熱する方法、特開昭５６−３７１０８に
は閉ループで熱水加熱する方法などが提案されている。However, when heating and cooling are performed by using a common circuit, not only unnecessary cooling is performed because the mold is deeply heated, but also time is required for switching between heating and cooling, and a portion other than the cavity is required. However, unnecessary work such as heating and cooling is performed at the same time, and the responsiveness of heating and cooling deteriorates. To improve response, Tokuseki Sho 58-2
No. 15309 discloses a method in which a heating medium and a cooling medium are supplied from separate tanks and returned to the respective tanks.
No. 918 discloses a method of minimizing a common circuit portion,
Japanese Patent Application Laid-Open No. Hei 1-269515 proposes a method of heating a medium in the middle of a medium path only when a mold is heated, and Japanese Patent Application Laid-Open No. 56-37108 proposes a method of heating hot water in a closed loop.
【００１０】[0010]
【発明が解決しようとする課題】従来の技術の前段で説
明した、熱風による加熱方法は加熱能力が小さい、電気
ヒータによる加熱方法や電気伝導層による金型表面加熱
方法は装置が複雑で高価になる、高周波誘導加熱方法は
加熱装置の出し入れに時間がかかるとともに装置が高価
になる、キャビティ内に蒸気を吹きこむ方法は適用範囲
が金型が濡れても差し支えない成形方法に限られる、キ
ャビティとコアの間に熱板を挟む方法やハロゲン電球で
加熱する方法は製品の取り出しとは別に加熱装置の出し
入れに時間がかかるという問題点があった。The heating method using hot air described in the preceding paragraph of the prior art has a small heating capacity, and the heating method using an electric heater or the mold surface heating method using an electric conductive layer is complicated and expensive. The high-frequency induction heating method takes a long time to put the heating device in and out and makes the device expensive, and the method of blowing steam into the cavity is limited to a molding method that can be applied even if the mold is wet. The method of sandwiching the hot plate between the cores or the method of heating with a halogen bulb has a problem that it takes time to take in and out of the heating device separately from taking out the product.
【００１１】また、従来技術の後段で説明した、金型内
で加熱媒体と冷却媒体を共通回路に通す方式について提
案された改良案である、加熱媒体と冷却媒体を別個のタ
ンクから供給しそれぞれに戻す方法、共通回路部分を極
力少なくする方法、金型加熱時だけ媒体経路の途中で媒
体を加熱する方法、閉ループで熱水加熱する方法など
は、すべて、金型内の加熱冷却方式を改良しようとする
ものではなく、金型内の加熱冷却方式は従来のままで金
型外の部分を改良して成形サイクルを短縮しようとする
ものである．加熱能力の点から言って、熱媒体による加
熱、とりわけ蒸気による加熱が有利であることは言うま
でもない。すなわち、蒸気と水の組み合わせで加熱と冷
却を行なう方法が、設備が簡単で成形サイクルも短く、
最も経済的である。にもかかわらず、蒸気加熱以外の発
明が長年にわたり多数提案されてきたゆえんは、次に説
明するように、蒸気加熱の場合、従来の考え方では成形
サイクルが延びることにある。[0011] In addition, the heating medium and the cooling medium are supplied from separate tanks, which is an improvement proposed for a method of passing a heating medium and a cooling medium through a common circuit in a mold as described later in the prior art. The method of returning to, the method of minimizing the common circuit part, the method of heating the medium in the medium path only when heating the mold, the method of heating with hot water in a closed loop, etc. are all improvements to the heating and cooling method in the mold Rather, it is intended to shorten the molding cycle by improving the parts outside the mold while maintaining the conventional heating and cooling method in the mold. In terms of the heating capacity, it goes without saying that heating with a heating medium, particularly heating with steam, is advantageous. In other words, the method of heating and cooling with a combination of steam and water has simple equipment and a short molding cycle,
Most economical. Nevertheless, because many inventions other than steam heating have been proposed over the years, as will be described below, in the case of steam heating, the conventional concept is that the molding cycle is extended.
【００１２】通常の金型冷却回路の設計は、例えば、三
谷景造著「射出成形金型（シグマ出版、１９９７年初
版）第１３章『金型の温調』に記載されているように、
必要とされる単位あたりの除熱量に対応して、実務的に
は製品の厚みに対応して冷却回路の径が決められ、金型
表面の温度分布が均一になるように、回路径の２〜３倍
の深さの所に回路径の３倍程度の間隔で埋められる。回
路径は通常、キャビティ深さ２ｍｍ以下のものに対して
８〜１０ｍｍ、４〜６ｍｍのものに対して１０〜１２ｍ
ｍ、６ｍｍ以上のものに対して１２〜１５ｍｍのものが
使われる。[0012] The design of a normal mold cooling circuit is described in, for example, Chapter 13 “Temperature Control of Mold” by Keizo Mitani, “Injection Mold” (Sigma Publishing, 1997, first edition).
In accordance with the required heat removal per unit, the diameter of the cooling circuit is practically determined according to the thickness of the product, and the circuit diameter is set to 2 so that the temperature distribution on the mold surface becomes uniform. It is buried at a depth of about 3 times at an interval of about 3 times the circuit diameter. The circuit diameter is usually 8 to 10 mm for those having a cavity depth of 2 mm or less, and 10 to 12 m for those having a cavity depth of 4 to 6 mm.
For m and 6 mm or more, 12 to 15 mm is used.
【００１３】こういう冷却回路に蒸気を通すと、金型表
面だけではなく金型の深部まで加熱され、その冷却に余
分な時間がかかるとともに、回路が金型の深部にあるた
め加熱や冷却の応答性が遅い。[0013] When steam is passed through such a cooling circuit, not only the surface of the mold but also the deep part of the mold is heated, and extra time is required for the cooling. Slowness.
【００１４】また、加熱と冷却の切り換えの時間を短縮
する目的で、金型表面の温度分布が均一になるような回
路配置の条件下で加熱と冷却の回路を交互に配置しよう
とすると、回路間の距離が短くなり金型強度に問題を起
こす。Further, in order to shorten the time for switching between heating and cooling, if the heating and cooling circuits are alternately arranged under the condition of the circuit arrangement so that the temperature distribution on the mold surface becomes uniform, The distance between them becomes short, causing a problem in mold strength.
【００１５】このように、媒体による繰り返し加熱冷却
を経済的に短時間で行なうことは、従来の考え方を以て
しては不可能であった。金型表面を加熱する発明が蒸気
加熱以外の方法に集中し、蒸気加熱を含む媒体加熱の方
法ではもっばら金型外の改良が提案されてきた理由がこ
こにある。As described above, it is impossible to perform the heating and cooling with the medium repeatedly in a short time economically based on the conventional concept. This is the reason why the invention for heating the mold surface concentrates on methods other than the steam heating, and in the method of medium heating including the steam heating, an improvement other than the mold has been proposed.
【００１６】本発明は、上述した問題点を解決するため
になされたものであって、金型表面の加熱と、金型の冷
却を経済的に短時間で行ないうる合成樹脂成形用金型お
よびその加熱・冷却方法を提供することを課題とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is intended to provide a synthetic resin molding die which can heat a die surface and cool the die economically in a short time. It is an object to provide a heating and cooling method.
【００１７】[0017]
【課題を解決するための手段】本発明は、上記課題を次
のようにして解決した。金型の壁部の金型表面に近い位
置と、金型表面より遠い位置にそれぞれ回路を設け、金
型表面に近い位置に設けた回路には、加熱を必要とする
時のみ水蒸気などの加熱媒体を通し、金型表面より遠い
位置に設けられ前記回路より大径の冷却用回路には常時
冷却水などの冷却媒体を通す。The present invention has solved the above-mentioned problems as follows. Circuits are provided at positions close to the mold surface on the mold wall and at positions farther from the mold surface, and circuits installed near the mold surface are heated with water vapor or the like only when heating is required. A cooling medium such as cooling water is always passed through a cooling circuit provided at a position farther than the mold surface and having a larger diameter than the circuit.
【００１８】[0018]
【発明の実施の形態】本発明の実施の形態を図面を参照
して説明する。図１は、本発明による合成樹脂成形用金
型の模式図である。同図に示すように、金型の壁部に
は、通常の冷却用回路Ｂが設けられ、この冷却用回路Ｂ
よりも金型表面（キャビティ面）１に近い位置に加熱・
冷却用回路Ａが設けられている。Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a synthetic resin molding die according to the present invention. As shown in the figure, a normal cooling circuit B is provided on the wall of the mold.
To a position closer to the mold surface (cavity surface) 1 than
A cooling circuit A is provided.
【００１９】前記冷却用回路Ｂを水冷却用回路として、
終始冷却水を通して金型の冷却を継続する一方、加熱・
冷却用回路Ａを水蒸気加熱・水冷却用回路とし、金型表
面１を加熱する時に加熱媒体として水蒸気、冷却する時
に冷却媒体として冷却水を通すことが望ましい。なお、
水冷却から水蒸気加熱に切り換える時には、水蒸気を通
す前に冷却水をエアーで排出すると好都合である。The cooling circuit B is used as a water cooling circuit,
While continuing to cool the mold through the cooling water throughout,
It is desirable that the cooling circuit A be a steam heating / water cooling circuit, in which steam is passed as a heating medium when the mold surface 1 is heated, and cooling water is passed as a cooling medium when cooling. In addition,
When switching from water cooling to steam heating, it is advantageous to discharge the cooling water by air before passing the steam.
【００２０】前記加熱・冷却用回路Ａを水蒸気加熱用回
路として、金型表面１を加熱する時のみ水蒸気を通して
も差し支えない。The heating / cooling circuit A may be used as a steam heating circuit, and steam may be passed only when the mold surface 1 is heated.
【００２１】前記加熱・冷却用回路（または加熱用回
路、以下同じ）Ａの回路径は、４ｍｍ以下、好ましくは
３．５ｍｍ以下、更に好ましくは３ｍｍ以下である。回
路径の下限は、孔の長さと工作機械の能力により決ま
る。The circuit diameter of the heating / cooling circuit (or heating circuit, hereinafter the same) A is 4 mm or less, preferably 3.5 mm or less, more preferably 3 mm or less. The lower limit of the circuit diameter is determined by the length of the hole and the capability of the machine tool.
【００２２】通常、冷却用回路Ｂの回路径には８ｍｍ以
上のものが使われていることに比べると、加熱・冷却用
回路Ａの回路径は１／２〜１／３以下でよい。これは、
冷却水の伝熱係数が１〜６ＫＷ／ｍ2Ｋであることに対
して、飽和蒸気の伝熱係数が５〜１７ＫＷ／ｍ2Ｋであ
ることで説明される。Normally, the circuit diameter of the heating / cooling circuit A may be ２〜 to 以下 or less as compared with the case where the circuit diameter of the cooling circuit B is 8 mm or more. this is,
It is explained that the heat transfer coefficient of the cooling water is 1 to 6 KW / m 2 K, whereas the heat transfer coefficient of the saturated steam is 5 to 17 KW / m 2 K.
【００２３】冷却用回路Ｂは、金型表面１の温度分布が
均一になるように回路径の２〜３倍の深さＣの所に回路
径の３〜５倍程度の間隔Ｄで埋められ、また、加熱・冷
却用回路Ａの回路径は、冷却用回路Ｂの回路径の１／２
〜１／３であるので、加熱・冷却用回路Ａを、冷却用回
路Ｂに対し、より金型表面１に近い位置に、加熱時の金
型表面１の温度分布が均一になるような配置で設置でき
る。その際、加熱・冷却用回路Ａも冷却用回路Ｂの回路
と同様な配置で設置してもよい。The cooling circuit B is buried at a depth C of 2 to 3 times the circuit diameter and at an interval D of about 3 to 5 times the circuit diameter so that the temperature distribution on the mold surface 1 becomes uniform. The circuit diameter of the heating / cooling circuit A is 1/2 of the circuit diameter of the cooling circuit B.
Therefore, the heating / cooling circuit A is arranged at a position closer to the mold surface 1 with respect to the cooling circuit B so that the temperature distribution of the mold surface 1 during heating becomes uniform. Can be set up. In this case, the heating / cooling circuit A may be installed in the same arrangement as the cooling circuit B.
【００２４】本発明による合成樹脂成形用金型は、上述
したように構成されているので、熱可塑性樹脂あるいは
熱硬化性樹脂の射出成形あるいは圧縮成形において、金
型を繰り返し加熱冷却する場合に最適である。Since the synthetic resin molding die according to the present invention is configured as described above, it is most suitable for repeatedly heating and cooling the die in injection molding or compression molding of a thermoplastic resin or a thermosetting resin. It is.
【００２５】熱可塑性樹脂を射出成形あるいは圧縮成形
する場合、高温にした金型に溶融樹脂を充填し、その後
低温にした金型で溶融樹脂を冷却して、取り出し後の製
品の変形を防止することができる。In the case of injection molding or compression molding of a thermoplastic resin, the molten resin is filled into a high-temperature mold, and then the molten resin is cooled by the low-temperature mold to prevent deformation of the product after being taken out. be able to.
【００２６】熱可塑性樹脂の射出成形において、溶融樹
脂を金型に充填する際に金型温度を高くしておくと、溶
融樹脂の流動性がよいので薄肉成形に有利であるのみな
らず金型表面の転写が良好であり、ウエルドラインも目
立たない。In injection molding of a thermoplastic resin, if the mold temperature is set high when the molten resin is filled in the mold, the flowability of the molten resin is good, which is advantageous not only for thin-wall molding but also for the mold. The surface transfer is good, and the weld line is not noticeable.
【００２７】この場合、金型の加熱温度は、樹脂の熱変
形温度以上、加熱分解温度以下が好ましいが、これにこ
だわることなく任意の温度を選ぶことができる。また、
金型の冷却温度には、成形雰囲気で金型が結露しない範
囲で任意の温度を選ぶことができる。In this case, the heating temperature of the mold is preferably equal to or higher than the thermal deformation temperature of the resin and equal to or lower than the thermal decomposition temperature, but an arbitrary temperature can be selected without particular limitation. Also,
Any temperature can be selected for the cooling temperature of the mold as long as the mold does not condense in the molding atmosphere.
【００２８】熱硬化性樹脂を射出成形あるいは圧縮成形
する場合においても、短い成形サイクルで、高温にした
金型に溶融樹脂を充填して硬化反応を行ない、その後金
型温度を下げて溶融樹脂を冷却し、取り出し後の製品の
変形を防止することができる。In the case of injection molding or compression molding of a thermosetting resin, a high temperature mold is filled with a molten resin and a curing reaction is performed in a short molding cycle, and then the molten resin is cooled by lowering the mold temperature. It is possible to prevent deformation of the product after cooling and taking out.
【００２９】この場合、金型の加熱温度は、溶融樹脂の
硬化を進めるために必要にして充分な温度とする。ま
た、金型の冷却温度には、成形雰囲気で金型が結露しな
い範囲で任意の温度を選ぶことができる。In this case, the heating temperature of the mold is set to a necessary and sufficient temperature for promoting the curing of the molten resin. In addition, an arbitrary temperature can be selected for the cooling temperature of the mold within a range in which the mold does not condense in the molding atmosphere.
【００３０】[0030]
【実施例】本発明の実施例について説明する。An embodiment of the present invention will be described.
【００３１】本発明による合成樹脂成形用金型を使用し
て金型の加熱・冷却試験を行った。A heating / cooling test of the mold was performed using the mold for molding a synthetic resin according to the present invention.
【００３２】使用した合成樹脂成形用金型（図１参照）
の仕様および加熱・冷却条件は下記の通りである。Used synthetic resin mold (see FIG. 1)
The specifications and heating / cooling conditions are as follows.
【００３３】金型 ：厚み３５ｍｍ、材質アルミ合金 回路Ａ：直径３ｍｍ、間隔（Ｄ）１０．５ｍｍ、深さ
（Ｃ）６ｍｍ 加熱（蒸気５ｋｇ／ｃｍ2）、冷却（冷却水１０℃） 回路Ｂ：直径１０ｍｍ、間隔（Ｄ）２８ｍｍ、深さ
（Ｃ）２０ｍｍ 加熱（蒸気５ｋｇ／ｃｍ2）、冷却および連続冷却（冷
却水１０℃） 図２は、金型表面加熱の試験データで、加熱時間に対す
る金型表面温度を示している。Mold: thickness 35 mm, material aluminum alloy Circuit A: diameter 3 mm, interval (D) 10.5 mm, depth (C) 6 mm Heating (steam 5 kg / cm 2 ), cooling (cooling water 10 ° C.) Circuit B : Diameter 10 mm, interval (D) 28 mm, depth (C) 20 mm Heating (steam 5 kg / cm 2 ), cooling and continuous cooling (cooling water 10 ° C.) FIG. 2 shows test data of mold surface heating, and heating time. Shows the mold surface temperature with respect to.
【００３４】 本発明による加熱条件（イ）では、従来技術の加熱条件
（ロ）に比べ、金型表面温度の上昇が速くなる。加熱条
件（ハ）は、金型表面加熱の点だけみれば金型表面温度
の上昇が格段と速くなる。[0034] Under the heating condition (a) according to the present invention, the mold surface temperature rises faster than in the conventional heating condition (b). Regarding the heating condition (c), the mold surface temperature rises remarkably faster if only the mold surface heating is considered.
【００３５】図３は、金型表面冷却の試験データで、金
型の冷却前温度に対する６ｓｅｃ冷却後の金型表面温度
を示している。FIG. 3 shows test data of mold surface cooling, and shows the mold surface temperature after cooling for 6 seconds with respect to the mold pre-cooling temperature.
【００３６】 本発明による冷却条件（イ）では、従来技術の（または
本発明による他の）冷却条件（ロ）に比べ、冷却後の金
型表面温度の低下が格段と速くなる。冷却条件（ハ）
は、冷却条件（イ）に比べ金型表面温度の低下が遅くな
る。[0036] Under the cooling condition (a) according to the present invention, the temperature of the mold surface after cooling is significantly lower than the cooling condition (b) according to the prior art (or other according to the present invention). Cooling conditions (c)
In (2), the decrease in the mold surface temperature is slower than in the cooling condition (A).
【００３７】[0037]
【発明の効果】本発明による合成樹脂成形用金型では、
金型表面に近い位置に設けた回路に、金型表面を加熱す
る時のみ水蒸気などの加熱媒体を通し、金型表面より遠
い位置に設けた回路に常時冷却水などの冷却媒体を通す
ことにより、金型は常に冷却され、溶融樹脂が充填され
る時にのみ金型表面が加熱されるので、金型表面の加熱
と金型の冷却を経済的に短時間で行うことができる。In the synthetic resin molding die according to the present invention,
By passing a heating medium such as water vapor through the circuit provided near the mold surface only when heating the mold surface, and by constantly passing a cooling medium such as cooling water through the circuit provided farther from the mold surface. Since the mold is always cooled and the mold surface is heated only when the molten resin is charged, the heating of the mold surface and the cooling of the mold can be performed economically in a short time.
【図１】本発明による合成樹脂成形用金型の模式図であ
る。FIG. 1 is a schematic view of a synthetic resin molding die according to the present invention.
【図２】金型表面加熱の試験データで、加熱時間に対す
る金型表面温度を示している。FIG. 2 shows test data of mold surface heating, showing mold surface temperature with respect to heating time.
【図３】金型表面冷却の試験データで、金型の冷却前温
度に対する６ｓｅｃ冷却後の金型表面温度を示してい
る。FIG. 3 shows test data of mold surface cooling, showing the mold surface temperature after 6 seconds of cooling with respect to the mold pre-cooling temperature.
１ 金型表面 Ａ 回路（加熱・冷却用回路、加熱用回路） Ｂ 回路（冷却用回路） Ｃ 深さ Ｄ 間隔 1 Mold surface A Circuit (heating / cooling circuit, heating circuit) B Circuit (cooling circuit) C Depth D Interval
Claims (9)
用回路（Ａ）、金型表面（１）より遠い位置に冷却用回
路（Ｂ）を設けたことを特徴とする合成樹脂成形用金
型。1. A synthetic resin characterized in that a heating / cooling circuit (A) is provided at a position near the mold surface (1) and a cooling circuit (B) is provided at a position farther from the mold surface (1). Mold for molding.
を、前記冷却用回路（Ｂ）の回路径の１／２〜１／３と
し、冷却用回路（Ｂ）を、その回路径の２〜３倍の深さ
（Ｃ）の所に回路径の３〜５倍の間隔（Ｄ）で配置した
ことを特徴とする請求項１記載の合成樹脂成形用金型。2. The circuit diameter of the heating / cooling circuit (A) is ２〜 to １ ／ of the circuit diameter of the cooling circuit (B), and the cooling circuit (B) is 2. The synthetic resin molding die according to claim 1, wherein the metal mold is disposed at a depth (C) that is two to three times the circuit diameter and at an interval (D) that is three to five times the circuit diameter.
を、４ｍｍ以下としたことを特徴とする請求項１または
２記載の合成樹脂成形用金型。3. The synthetic resin molding die according to claim 1, wherein the circuit diameter of the heating / cooling circuit (A) is 4 mm or less.
熱・水冷却用回路であり、前記冷却用回路（Ｂ）は水冷
却用回路であることを特徴とする請求項１、２または３
記載の合成樹脂成形用金型。4. The heating / cooling circuit (A) is a steam heating / water cooling circuit, and the cooling circuit (B) is a water cooling circuit. 3
The synthetic resin molding die according to the above.
回路（Ａ）としたことを特徴とする請求項１、２または
３記載の合成樹脂成形用金型。5. The synthetic resin molding die according to claim 1, wherein a heating circuit (A) is used instead of the heating / cooling circuit.
路であり、前記冷却用回路（Ｂ）は水冷却用回路である
ことを特徴とする請求項５記載の合成樹脂成形用金型。6. The synthetic resin molding die according to claim 5, wherein the heating circuit (A) is a steam heating circuit, and the cooling circuit (B) is a water cooling circuit. .
（Ａ）には、金型表面（１）を加熱する時に加熱媒体を
通し、冷却する時に冷却媒体を通し、金型表面（１）よ
り遠い位置に設けた冷却用回路（Ｂ）には、常時冷却媒
体を通すことを特徴とする合成樹脂成形用金型の加熱・
冷却方法。7. The circuit (A) provided near the mold surface (1) is provided with a heating medium when heating the mold surface (1) and a cooling medium when cooling the mold surface (1). (1) Heating and cooling of a synthetic resin molding die, characterized in that a cooling medium is always passed through a cooling circuit (B) provided at a farther position.
Cooling method.
（Ａ）には、金型表面（１）を加熱する時のみ加熱媒体
を通し、金型表面（１）より遠い位置に設けた冷却用回
路（Ｂ）には、常時冷却媒体を通すことを特徴とする合
成樹脂成形用金型の加熱・冷却方法。8. A circuit (A) provided at a position close to the mold surface (1) is provided with a heating medium only when heating the mold surface (1), and at a position farther from the mold surface (1). A method for heating and cooling a synthetic resin molding die, wherein a cooling medium is constantly passed through the provided cooling circuit (B).
水であることを特徴とする請求項７または８記載の合成
樹脂成形用金型の加熱・冷却方法。9. The method for heating and cooling a synthetic resin molding die according to claim 7, wherein the heating medium is steam and the cooling medium is cooling water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15936098A JP3802233B2 (en) | 1998-06-08 | 1998-06-08 | Mold for synthetic resin molding and heating / cooling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15936098A JP3802233B2 (en) | 1998-06-08 | 1998-06-08 | Mold for synthetic resin molding and heating / cooling method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11348041A true JPH11348041A (en) | 1999-12-21 |
| JPH11348041A5 JPH11348041A5 (en) | 2005-06-30 |
| JP3802233B2 JP3802233B2 (en) | 2006-07-26 |
Family
ID=15692150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15936098A Expired - Lifetime JP3802233B2 (en) | 1998-06-08 | 1998-06-08 | Mold for synthetic resin molding and heating / cooling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3802233B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005169925A (en) * | 2003-12-12 | 2005-06-30 | Ono Sangyo Kk | Method and apparatus for injection molding |
| JP2005297386A (en) * | 2004-04-13 | 2005-10-27 | Ono Sangyo Kk | Mold assembly and molding method |
| JP2006076276A (en) * | 2004-08-10 | 2006-03-23 | Mitsubishi Plastics Ind Ltd | Insert molding die, method of manufacturing insert molded product, and insert molded product |
| US7294295B2 (en) | 2003-06-16 | 2007-11-13 | Ono Sangyo Co., Ltd. | Method of manufacturing molded product of foamed resin and apparatus for molding foamed resin |
| JP2008149578A (en) * | 2006-12-18 | 2008-07-03 | Mazda Motor Corp | Molding method and mold apparatus |
| DE112009000694T5 (en) | 2008-03-26 | 2011-02-10 | Panasonic Electric Works Co., Ltd., Kadoma-shi | Plastic injection mold |
| WO2012086675A1 (en) | 2010-12-24 | 2012-06-28 | 株式会社キャップ | Molding device and molding method by the molding device |
-
1998
- 1998-06-08 JP JP15936098A patent/JP3802233B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7294295B2 (en) | 2003-06-16 | 2007-11-13 | Ono Sangyo Co., Ltd. | Method of manufacturing molded product of foamed resin and apparatus for molding foamed resin |
| JP2005169925A (en) * | 2003-12-12 | 2005-06-30 | Ono Sangyo Kk | Method and apparatus for injection molding |
| JP2005297386A (en) * | 2004-04-13 | 2005-10-27 | Ono Sangyo Kk | Mold assembly and molding method |
| JP2006076276A (en) * | 2004-08-10 | 2006-03-23 | Mitsubishi Plastics Ind Ltd | Insert molding die, method of manufacturing insert molded product, and insert molded product |
| JP2008149578A (en) * | 2006-12-18 | 2008-07-03 | Mazda Motor Corp | Molding method and mold apparatus |
| DE112009000694T5 (en) | 2008-03-26 | 2011-02-10 | Panasonic Electric Works Co., Ltd., Kadoma-shi | Plastic injection mold |
| DE202009018131U1 (en) | 2008-03-26 | 2011-03-17 | Panasonic Electric Works Co., Ltd., Kadoma-shi | Plastic injection mold |
| US8272865B2 (en) | 2008-03-26 | 2012-09-25 | Panasonic Corporation | Resin injection mold |
| DE112009000694B4 (en) * | 2008-03-26 | 2016-09-15 | Panasonic Corporation | Plastic injection mold |
| WO2012086675A1 (en) | 2010-12-24 | 2012-06-28 | 株式会社キャップ | Molding device and molding method by the molding device |
| US9738022B2 (en) | 2010-12-24 | 2017-08-22 | Cap Co., Ltd. | Molding device and molding method using the molding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3802233B2 (en) | 2006-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20040222566A1 (en) | Method for molding a product and a mold used therein | |
| JPH08238623A (en) | Method and device for producing synthetic resin component part | |
| US4464324A (en) | Apparatus and method for injection moulding of plastic parts of irregular shape, hollow or undercut form | |
| JP2004536724A5 (en) | ||
| US5837183A (en) | Golf ball molding method and apparatus | |
| EP0920969A1 (en) | Injection molding means | |
| JPH11348041A (en) | Synthetic resin molding die, and method for heating and cooling it | |
| KR102326379B1 (en) | Method and apparatus for mold heating | |
| JPS5919805B2 (en) | Rapid molding method for plastic film | |
| JPH11348041A5 (en) | ||
| JP2837990B2 (en) | Cooling device for plastic molds | |
| JP2000238103A (en) | Molding die device | |
| JPH09314611A (en) | Easily temperature controllable mold structure | |
| JP2004060946A (en) | Waste melting apparatus and waste melting method | |
| JP4255045B2 (en) | Manufacturing method of molded products | |
| JPH11115013A (en) | Plastic injection molding method | |
| JPH071457A (en) | Mold for molding | |
| JPH0462245B2 (en) | ||
| JP2009202348A (en) | Molding equipment | |
| JPH0538749A (en) | Heat insulating mold for blow molding | |
| JP2000271969A (en) | Injection mold | |
| JP2960689B2 (en) | Molding method of bottle with handle | |
| JPS6064819A (en) | Mold for molding plastic | |
| US1481743A (en) | Method and apparatus for pressing disk sound records without the aid of heating and cooling mediums | |
| JPH05237624A (en) | Device for heating and cooling metallic mold for casting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041014 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041014 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20041014 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060116 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060125 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060322 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060412 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060427 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090512 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100512 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110512 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110512 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120512 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120512 Year of fee payment: 6 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120512 Year of fee payment: 6 |
|
| R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120512 Year of fee payment: 6 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130512 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140512 Year of fee payment: 8 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |