JPH1143573A - Resin composition and laminate thereof - Google Patents
Resin composition and laminate thereofInfo
- Publication number
- JPH1143573A JPH1143573A JP21805297A JP21805297A JPH1143573A JP H1143573 A JPH1143573 A JP H1143573A JP 21805297 A JP21805297 A JP 21805297A JP 21805297 A JP21805297 A JP 21805297A JP H1143573 A JPH1143573 A JP H1143573A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- content
- evoh
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 19
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 72
- -1 phosphoric acid compound Chemical class 0.000 claims abstract description 22
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052796 boron Inorganic materials 0.000 claims abstract description 18
- 238000007127 saponification reaction Methods 0.000 claims abstract description 15
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000005977 Ethylene Substances 0.000 claims abstract description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 10
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 7
- 150000001639 boron compounds Chemical class 0.000 claims abstract description 7
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 6
- 239000010452 phosphate Substances 0.000 claims abstract description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract 2
- 229910000403 monosodium phosphate Inorganic materials 0.000 claims description 13
- 235000019799 monosodium phosphate Nutrition 0.000 claims description 13
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 8
- YYRMJZQKEFZXMX-UHFFFAOYSA-L calcium bis(dihydrogenphosphate) Chemical compound [Ca+2].OP(O)([O-])=O.OP(O)([O-])=O YYRMJZQKEFZXMX-UHFFFAOYSA-L 0.000 claims description 5
- 229940062672 calcium dihydrogen phosphate Drugs 0.000 claims description 5
- 229910000389 calcium phosphate Inorganic materials 0.000 claims description 5
- QQFLQYOOQVLGTQ-UHFFFAOYSA-L magnesium;dihydrogen phosphate Chemical compound [Mg+2].OP(O)([O-])=O.OP(O)([O-])=O QQFLQYOOQVLGTQ-UHFFFAOYSA-L 0.000 claims description 5
- 235000019691 monocalcium phosphate Nutrition 0.000 claims description 5
- 229910000401 monomagnesium phosphate Inorganic materials 0.000 claims description 5
- 235000019785 monomagnesium phosphate Nutrition 0.000 claims description 5
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 5
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 5
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 26
- 238000000465 moulding Methods 0.000 abstract description 16
- 239000011229 interlayer Substances 0.000 abstract description 13
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 51
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 50
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 49
- 238000000034 method Methods 0.000 description 35
- 239000010410 layer Substances 0.000 description 21
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 18
- 239000004327 boric acid Substances 0.000 description 18
- 239000000047 product Substances 0.000 description 13
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 11
- 239000007864 aqueous solution Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 241000251468 Actinopterygii Species 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 229910021538 borax Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 235000010339 sodium tetraborate Nutrition 0.000 description 6
- 239000004840 adhesive resin Substances 0.000 description 4
- 229920006223 adhesive resin Polymers 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229910052751 metal Chemical class 0.000 description 4
- 239000002184 metal Chemical class 0.000 description 4
- 239000004328 sodium tetraborate Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000003905 agrochemical Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- QGBLCIBATKETJC-UHFFFAOYSA-N 3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane;manganese(2+) Chemical compound [Mn+2].O1B([O-])OB2OB([O-])OB1O2 QGBLCIBATKETJC-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 2
- XBJJRSFLZVLCSE-UHFFFAOYSA-N barium(2+);diborate Chemical compound [Ba+2].[Ba+2].[Ba+2].[O-]B([O-])[O-].[O-]B([O-])[O-] XBJJRSFLZVLCSE-UHFFFAOYSA-N 0.000 description 2
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- AUTNMGCKBXKHNV-UHFFFAOYSA-P diazanium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [NH4+].[NH4+].O1B([O-])OB2OB([O-])OB1O2 AUTNMGCKBXKHNV-UHFFFAOYSA-P 0.000 description 2
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 239000003317 industrial substance Substances 0.000 description 2
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HKFZDVPCCOOGEV-UHFFFAOYSA-N nickel(3+);borate Chemical compound [Ni+3].[O-]B([O-])[O-] HKFZDVPCCOOGEV-UHFFFAOYSA-N 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- VPOLVWCUBVJURT-UHFFFAOYSA-N pentadecasodium;pentaborate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] VPOLVWCUBVJURT-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- NVIFVTYDZMXWGX-UHFFFAOYSA-N sodium metaborate Chemical compound [Na+].[O-]B=O NVIFVTYDZMXWGX-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- DPUZPWAFXJXHBN-UHFFFAOYSA-N tetrasodium dioxidoboranyloxy(dioxido)borane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]B([O-])OB([O-])[O-] DPUZPWAFXJXHBN-UHFFFAOYSA-N 0.000 description 2
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- GDTSJMKGXGJFGQ-UHFFFAOYSA-N 3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound O1B([O-])OB2OB([O-])OB1O2 GDTSJMKGXGJFGQ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- YAMJITULHOEKMI-UHFFFAOYSA-N B([O-])([O-])[O-].[Ag+3] Chemical compound B([O-])([O-])[O-].[Ag+3] YAMJITULHOEKMI-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- GABQNAFEZZDSCM-RMKNXTFCSA-N Cinnamyl anthranilate Chemical compound NC1=CC=CC=C1C(=O)OC\C=C\C1=CC=CC=C1 GABQNAFEZZDSCM-RMKNXTFCSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000019739 Dicalciumphosphate Nutrition 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OTRAYOBSWCVTIN-UHFFFAOYSA-N OB(O)O.OB(O)O.OB(O)O.OB(O)O.OB(O)O.N.N.N.N.N.N.N.N.N.N.N.N.N.N.N Chemical compound OB(O)O.OB(O)O.OB(O)O.OB(O)O.OB(O)O.N.N.N.N.N.N.N.N.N.N.N.N.N.N.N OTRAYOBSWCVTIN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- QFVJLAYKIQBTGJ-UHFFFAOYSA-N [Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] QFVJLAYKIQBTGJ-UHFFFAOYSA-N 0.000 description 1
- DOVLHZIEMGDZIW-UHFFFAOYSA-N [Cu+3].[O-]B([O-])[O-] Chemical compound [Cu+3].[O-]B([O-])[O-] DOVLHZIEMGDZIW-UHFFFAOYSA-N 0.000 description 1
- FZQSLXQPHPOTHG-UHFFFAOYSA-N [K+].[K+].O1B([O-])OB2OB([O-])OB1O2 Chemical compound [K+].[K+].O1B([O-])OB2OB([O-])OB1O2 FZQSLXQPHPOTHG-UHFFFAOYSA-N 0.000 description 1
- MXWVLJGUIUZJSQ-UHFFFAOYSA-N [K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] MXWVLJGUIUZJSQ-UHFFFAOYSA-N 0.000 description 1
- XVDCMYGYCHKSOH-UHFFFAOYSA-N [K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] XVDCMYGYCHKSOH-UHFFFAOYSA-N 0.000 description 1
- MZMIWABCFXURCX-UHFFFAOYSA-N [Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].OB(O)[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].OB(O)[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] MZMIWABCFXURCX-UHFFFAOYSA-N 0.000 description 1
- XLLZUKPXODPNPP-UHFFFAOYSA-N [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] XLLZUKPXODPNPP-UHFFFAOYSA-N 0.000 description 1
- BUWURQPWRDROFU-UHFFFAOYSA-N [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] BUWURQPWRDROFU-UHFFFAOYSA-N 0.000 description 1
- CSPKQASYQIUQRF-UHFFFAOYSA-N [Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] Chemical compound [Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] CSPKQASYQIUQRF-UHFFFAOYSA-N 0.000 description 1
- WMEFLUAXDSCMBO-UHFFFAOYSA-N [Ni+4].[O-]B([O-])OB([O-])[O-] Chemical compound [Ni+4].[O-]B([O-])OB([O-])[O-] WMEFLUAXDSCMBO-UHFFFAOYSA-N 0.000 description 1
- 238000006359 acetalization reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- HSBONFIDJMNFJD-UHFFFAOYSA-N aluminum potassium borate Chemical compound B([O-])([O-])[O-].[K+].[Al+3] HSBONFIDJMNFJD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- LYSTYSFIGYAXTG-UHFFFAOYSA-L barium(2+);hydrogen phosphate Chemical compound [Ba+2].OP([O-])([O-])=O LYSTYSFIGYAXTG-UHFFFAOYSA-L 0.000 description 1
- ACOIWNYPCCHUDF-UHFFFAOYSA-N barium(2+);tetraborate Chemical compound [Ba+2].[Ba+2].[Ba+2].[Ba+2].[Ba+2].[Ba+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] ACOIWNYPCCHUDF-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YISOXLVRWFDIKD-UHFFFAOYSA-N bismuth;borate Chemical compound [Bi+3].[O-]B([O-])[O-] YISOXLVRWFDIKD-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910001730 borate mineral Inorganic materials 0.000 description 1
- 239000010429 borate mineral Substances 0.000 description 1
- 235000010338 boric acid Nutrition 0.000 description 1
- KSUWPYXSYBTWFG-UHFFFAOYSA-N cadmium(2+);diborate Chemical compound [Cd+2].[Cd+2].[Cd+2].[O-]B([O-])[O-].[O-]B([O-])[O-] KSUWPYXSYBTWFG-UHFFFAOYSA-N 0.000 description 1
- WUXDZHVEKQZJSQ-UHFFFAOYSA-N cadmium(2+);tetraborate Chemical compound [Cd+2].[Cd+2].[Cd+2].[Cd+2].[Cd+2].[Cd+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] WUXDZHVEKQZJSQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- WEZJBAOYGIDDLB-UHFFFAOYSA-N cobalt(3+);borate Chemical compound [Co+3].[O-]B([O-])[O-] WEZJBAOYGIDDLB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007278 cyanoethylation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 229910000390 dicalcium phosphate Inorganic materials 0.000 description 1
- 235000019700 dicalcium phosphate Nutrition 0.000 description 1
- 229940038472 dicalcium phosphate Drugs 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- HQYGGVLSRVLMEE-UHFFFAOYSA-N dimagnesium dioxidoboranyloxy(dioxido)borane Chemical compound [Mg+2].[Mg+2].[O-]B([O-])OB([O-])[O-] HQYGGVLSRVLMEE-UHFFFAOYSA-N 0.000 description 1
- MHJAJDCZWVHCPF-UHFFFAOYSA-L dimagnesium phosphate Chemical compound [Mg+2].OP([O-])([O-])=O MHJAJDCZWVHCPF-UHFFFAOYSA-L 0.000 description 1
- 229910000395 dimagnesium phosphate Inorganic materials 0.000 description 1
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- KTDLRMKJADTUIF-UHFFFAOYSA-N dodecasilver;tetraborate Chemical compound [Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[Ag+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] KTDLRMKJADTUIF-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- NDNPFWOOAFWTAI-UHFFFAOYSA-N hexazinc;tetraborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] NDNPFWOOAFWTAI-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- CPSYWNLKRDURMG-UHFFFAOYSA-L hydron;manganese(2+);phosphate Chemical compound [Mn+2].OP([O-])([O-])=O CPSYWNLKRDURMG-UHFFFAOYSA-L 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- HZRMTWQRDMYLNW-UHFFFAOYSA-N lithium metaborate Chemical compound [Li+].[O-]B=O HZRMTWQRDMYLNW-UHFFFAOYSA-N 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- LOCZQLKNTOXJDV-UHFFFAOYSA-N magnesium;oxido(oxo)borane Chemical compound [Mg+2].[O-]B=O.[O-]B=O LOCZQLKNTOXJDV-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- RZTUFFQPZSXZEM-UHFFFAOYSA-N manganese(2+);oxido(oxo)borane Chemical compound [Mn+2].[O-]B=O.[O-]B=O RZTUFFQPZSXZEM-UHFFFAOYSA-N 0.000 description 1
- AAWVBZMCMMRKSG-UHFFFAOYSA-N manganese(2+);tetraborate Chemical compound [Mn+2].[Mn+2].[Mn+2].[Mn+2].[Mn+2].[Mn+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] AAWVBZMCMMRKSG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- HZVHQZNLOHJMHF-UHFFFAOYSA-N nickel(2+);tetraborate Chemical compound [Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[Ni+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] HZVHQZNLOHJMHF-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- IGLGDSDAIYIUDL-UHFFFAOYSA-N pentadecalithium pentaborate Chemical compound [Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[Li+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] IGLGDSDAIYIUDL-UHFFFAOYSA-N 0.000 description 1
- PYUBPZNJWXUSID-UHFFFAOYSA-N pentadecapotassium;pentaborate Chemical compound [K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[K+].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] PYUBPZNJWXUSID-UHFFFAOYSA-N 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- JVUYWILPYBCNNG-UHFFFAOYSA-N potassium;oxido(oxo)borane Chemical compound [K+].[O-]B=O JVUYWILPYBCNNG-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- LGXHAKXISCHJPE-UHFFFAOYSA-N silver;oxido(oxo)borane Chemical compound [Ag+].[O-]B=O LGXHAKXISCHJPE-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 229910000391 tricalcium phosphate Inorganic materials 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- 229940078499 tricalcium phosphate Drugs 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- CQDTUBLRLRFEJX-UHFFFAOYSA-N tricopper;diborate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]B([O-])[O-].[O-]B([O-])[O-] CQDTUBLRLRFEJX-UHFFFAOYSA-N 0.000 description 1
- RIUWBIIVUYSTCN-UHFFFAOYSA-N trilithium borate Chemical compound [Li+].[Li+].[Li+].[O-]B([O-])[O-] RIUWBIIVUYSTCN-UHFFFAOYSA-N 0.000 description 1
- WUUHFRRPHJEEKV-UHFFFAOYSA-N tripotassium borate Chemical compound [K+].[K+].[K+].[O-]B([O-])[O-] WUUHFRRPHJEEKV-UHFFFAOYSA-N 0.000 description 1
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 1
- 235000019798 tripotassium phosphate Nutrition 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- LKCUKVWRIAZXDU-UHFFFAOYSA-L zinc;hydron;phosphate Chemical compound [Zn+2].OP([O-])([O-])=O LKCUKVWRIAZXDU-UHFFFAOYSA-L 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【課題】 溶融成形時のロングラン性や外観性等に優
れ、更には積層体とした時の層間接着性にも優れたエチ
レン−酢酸ビニル系共重合体ケン化物組成物およびその
積層体を提供すること。
【解決手段】 エチレン含有量が20〜60モル%、ケ
ン化度が90モル%以上のエチレン−酢酸ビニル共重合
体ケン化物(A)、ホウ素化合物(B)、酢酸(C)お
よびリン酸化合物(D)を含有してなり、かつ(B)の
含有量がホウ素換算で(A)100重量部に対して0.
001〜1重量部、(C)の含有量が(A)100重量
部に対して0.05重量部以下、(D)の含有量がリン
酸根換算で(A)100重量部に対して0.0005〜
0.05重量部である樹脂組成物およびその積層体。PROBLEM TO BE SOLVED: To provide a saponified ethylene-vinyl acetate copolymer composition which is excellent in long-run property and appearance during melt molding and further has excellent interlayer adhesion when formed into a laminate. Providing the laminate. SOLUTION: An ethylene-vinyl acetate copolymer saponified product (A) having an ethylene content of 20 to 60 mol% and a saponification degree of 90 mol% or more, a boron compound (B), an acetic acid (C) and a phosphoric acid compound (D), and the content of (B) is 0.1% based on 100 parts by weight of (A) in terms of boron.
001 to 1 part by weight, the content of (C) is 0.05 parts by weight or less based on 100 parts by weight of (A), and the content of (D) is 0 based on 100 parts by weight of (A) in terms of phosphate. .0005-
0.05 parts by weight of a resin composition and a laminate thereof.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、エチレン−酢酸ビ
ニル系共重合体ケン化物(以下、EVOHと略記する)
樹脂組成物及びそれを用いた積層体に関し、更に詳しく
は溶融成形時のロングラン性に優れ、フィッシュアイや
スジが少なく外観性に優れ、かつ積層体としたときに層
間接着性に優れた樹脂組成物及びそれを用いた積層体に
関するものである。The present invention relates to a saponified ethylene-vinyl acetate copolymer (hereinafter abbreviated as EVOH).
The resin composition and the laminate using the same, more specifically, a resin composition having excellent long-run property during melt molding, having less fish eyes and stripes, having excellent appearance, and having excellent interlayer adhesion when formed into a laminate. TECHNICAL FIELD The present invention relates to a product and a laminate using the same.
【0002】[0002]
【従来の技術】一般に、EVOHはその透明性、ガスバ
リヤー性、保香性、耐溶剤性、耐油性などに優れてお
り、かかる特性を生かして、食品包装材料、医薬品包装
材料、工業薬品包装材料、農薬包装材料等のフィルムや
シート、或いはボトル等の容器等に成形されて利用され
ている。かかる成形にあたっては、通常溶融成形が行わ
れ、かかる成形により、フィルム状、シート状、ボトル
状、カップ状、チューブ状、パイプ状等の形状に加工さ
れて実用に供されており、その加工性(成形性)は大変
重要であり、また、一般的には機械的強度、耐湿性、ヒ
ートシール性等を付与するためにポリオレフィン系樹脂
等の基材と接着剤層を介して共押出されて積層体とされ
ており、該積層体の層間接着性も重要である。即ち、成
形物の外観性(フィッシュアイやスジのない成形物)、
溶融成形時のロングラン性(長時間の成形においてもフ
ィッシュアイやスジのない成形物が得られる)、層間接
着性等を十分満足する必要がある。かかる層間接着性の
向上のためにEVOHにホウ素化合物を配合することが
提案されており(特開昭59−192564号公報)、
本出願人も溶融成形性の改善のためにEVOHにホウ素
やその塩を配合した組成物の成形法を提案した(特開昭
55−12108号公報)。2. Description of the Related Art In general, EVOH is excellent in transparency, gas barrier property, fragrance retention, solvent resistance, oil resistance and the like. It is used after being formed into materials, films and sheets of packaging materials for agricultural chemicals, containers such as bottles, and the like. In such molding, usually, melt molding is performed, and by such molding, it is processed into a shape such as a film shape, a sheet shape, a bottle shape, a cup shape, a tube shape, a pipe shape, and is provided for practical use. (Moldability) is very important, and is generally co-extruded with a base material such as a polyolefin resin via an adhesive layer in order to impart mechanical strength, moisture resistance, heat sealability, and the like. It is a laminate, and the interlayer adhesion of the laminate is also important. That is, the appearance of the molded product (molded product without fish eyes or stripes),
It is necessary to sufficiently satisfy the long run property at the time of melt molding (a molded article free of fish eyes and streaks is obtained even during long time molding), interlayer adhesion, and the like. It has been proposed to incorporate a boron compound into EVOH in order to improve the interlayer adhesion (JP-A-59-192564).
The present applicant has also proposed a molding method of a composition in which boron or a salt thereof is blended with EVOH in order to improve the melt moldability (Japanese Patent Application Laid-Open No. 55-12108).
【0003】[0003]
【発明が解決しようとする課題】しかしながら、かかる
特開昭59−192564号公報開示技術や特開昭55
−12108号公報開示技術では、上記の成形物の外観
性や溶融成形時のロングラン性については十分に考慮さ
れておらず、更に層間接着性についても新なる改善が望
まれるところである。However, the technique disclosed in Japanese Patent Application Laid-Open No. Sho 59-192564 and the method disclosed in Japanese Patent Application Laid-Open No.
In the technology disclosed in -12108, the appearance of the molded product and the long-run property during melt molding are not sufficiently considered, and a new improvement in interlayer adhesion is desired.
【0004】[0004]
【課題を解決するための手段】そこで、本発明者は、か
かる現況に鑑みて鋭意研究を重ねた結果、エチレン含有
量が20〜60モル%、ケン化度が90モル%以上のE
VOH(A)、ホウ素化合物(B)、酢酸(C)および
リン酸化合物(D)を含有してなり、かつ(B)の含有
量がホウ素換算で(A)100重量部に対して0.00
1〜1重量部、(C)の含有量が(A)100重量部に
対して0.05重量部以下、(D)の含有量がリン酸根
換算で(A)100重量部に対して0.0005〜0.
05重量である樹脂組成物が、かかる課題を解決するこ
とを見出し、本発明を完成するに至った。尚、上記の
(B)〜(D)の含有量の測定にあたっては、以下の方
法によって測定することができる。 (B):樹脂組成物をアルカリ溶融して、IPC発光分
光分析により、ホウ素量を定量 (C):樹脂組成物を熱水抽出して、抽出液をアルカリ
で中和滴定して酢酸量を定量 (D):樹脂組成物を温希硫酸抽出して、吸光光度法
(モリブデン青)により、リン酸根を定量(JIS K
0102に準拠)Accordingly, the present inventor has conducted intensive studies in view of the present situation, and as a result, has found that the ethylene content is 20 to 60 mol% and the saponification degree is 90 mol% or more.
It contains VOH (A), boron compound (B), acetic acid (C) and phosphoric acid compound (D), and the content of (B) is 0.1% based on 100 parts by weight of boron (A). 00
1 to 1 part by weight, the content of (C) is 0.05 parts by weight or less based on 100 parts by weight of (A), and the content of (D) is 0 based on 100 parts by weight of (A) in terms of phosphate group. .0005-0.
It has been found that a resin composition having a weight of 05 solves such a problem, and the present invention has been completed. The content of (B) to (D) can be measured by the following method. (B): The resin composition was alkali-melted, and the amount of boron was determined by IPC emission spectroscopy. (C): The resin composition was extracted with hot water, and the extract was neutralized and titrated with alkali to determine the amount of acetic acid. Quantitative (D): The resin composition is extracted with warm dilute sulfuric acid, and the phosphate group is quantified by a spectrophotometric method (molybdenum blue) (JIS K
0102)
【0005】[0005]
【発明の実施の形態】以下に、本発明を詳細に述べる。
本発明のEVOH(A)としては、エチレン含有量が2
0〜60モル%(更には25〜55モル%)、ケン化度
が90モル%以上(更には95モル%以上)のものが用
いられ、該エチレン含有量が20モル%未満では高湿時
のガスバリヤー性、溶融成形性が低下し、逆に60モル
%を越えると充分なガスバリヤー性が得られず、更にケ
ン化度が90モル%未満ではガスバリヤー性、熱安定
性、耐湿性等が低下して、本発明の目的を達成すること
ができない。また、EVOH(A)は、メルトインデッ
クス(MI)(210℃、荷重2160g)が0.5〜
100g/10分(更には1〜50g/10分)のもの
が好ましく、該メルトインデックスが該範囲よりも小さ
い場合には、成形時に押出機内が高トルク状態となって
押出加工が困難となり、また該範囲よりも大きい場合に
は、成形物の機械的強度が不足して好ましくない。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The EVOH (A) of the present invention has an ethylene content of 2
Those having 0 to 60 mol% (more preferably 25 to 55 mol%) and a saponification degree of 90 mol% or more (furthermore, 95 mol% or more) are used. The gas barrier properties and melt-molding properties of the resin deteriorate, whereas if it exceeds 60 mol%, sufficient gas barrier properties cannot be obtained, and if the saponification degree is less than 90 mol%, the gas barrier properties, heat stability and moisture resistance And the like, and the object of the present invention cannot be achieved. EVOH (A) has a melt index (MI) (210 ° C., load 2160 g) of 0.5 to
The melt index is preferably 100 g / 10 min (more preferably 1 to 50 g / 10 min). If the melt index is smaller than the above range, the inside of the extruder will be in a high torque state at the time of molding and extrusion processing will be difficult. If it is larger than this range, the mechanical strength of the molded product is insufficient, which is not preferable.
【0006】該EVOH(A)は、エチレン−酢酸ビニ
ル系共重合体のケン化によって得られ、該エチレン−酢
酸ビニル系共重合体は、公知の任意の重合法、例えば懸
濁重合、エマルジョン重合、溶液重合などにより製造さ
れ、エチレン−酢酸ビニル系共重合体のケン化も公知の
方法で行い得る。該EVOHは、少量であればα−オレ
フィン、不飽和カルボン酸系化合物、不飽和スルホン酸
系化合物、(メタ)アクリロニトリル、(メタ)アクリ
ルアミド、ビニルエーテル、ビニルシラン化合物、塩化
ビニル、スチレンなどの他のコモノマーで「共重合変
性」されても差し支えない。又、本発明の趣旨を損なわ
ない範囲で、ウレタン化、アセタール化、シアノエチル
化など「後変性」されても差し支えない。The EVOH (A) is obtained by saponification of an ethylene-vinyl acetate copolymer, and the ethylene-vinyl acetate copolymer can be produced by any known polymerization method, for example, suspension polymerization, emulsion polymerization. , A solution polymerization or the like, and saponification of an ethylene-vinyl acetate copolymer can be carried out by a known method. If EVOH is used in a small amount, other comonomers such as α-olefin, unsaturated carboxylic acid compound, unsaturated sulfonic acid compound, (meth) acrylonitrile, (meth) acrylamide, vinyl ether, vinyl silane compound, vinyl chloride and styrene And may be "copolymerized". Also, "post-modified" such as urethanization, acetalization, and cyanoethylation may be used as long as the gist of the present invention is not impaired.
【0007】上記のEVOH(A)に含有されるホウ素
化合物(B)としては、ホウ酸またはその金属塩、例え
ばホウ酸カルシウム、ホウ酸コバルト、ホウ酸亜鉛(四
ホウ酸亜鉛,メタホウ酸亜鉛等)、ホウ酸アルミニウム
・カリウム、ホウ酸アンモニウム(メタホウ酸アンモニ
ウム、四ホウ酸アンモニウム、五ホウ酸アンモニウム、
八ホウ酸アンモニウム等)、ホウ酸カドミウム(オルト
ホウ酸カドミウム、四ホウ酸カドミウム等)、ホウ酸カ
リウム(メタホウ酸カリウム、四ホウ酸カリウム、五ホ
ウ酸カリウム、六ホウ酸カリウム、八ホウ酸カリウム
等)、ホウ酸銀(メタホウ酸銀、四ホウ酸銀等)、ホウ
酸銅(ホウ酸第2銅、メタホウ酸銅、四ホウ酸銅等)、
ホウ酸ナトリウム(メタホウ酸ナトリウム、二ホウ酸ナ
トリウム、四ホウ酸ナトリウム、五ホウ酸ナトリウム、
六ホウ酸ナトリウム、八ホウ酸ナトリウム等)、ホウ酸
鉛(メタホウ酸鉛、六ホウ酸鉛等)、ホウ酸ニッケル
(オルトホウ酸ニッケル、二ホウ酸ニッケル、四ホウ酸
ニッケル、八ホウ酸ニッケル等)、ホウ酸バリウム(オ
ルトホウ酸バリウム、メタホウ酸バリウム、二ホウ酸バ
リウム、四ホウ酸バリウム等)、ホウ酸ビスマス、ホウ
酸マグネシウム(オルトホウ酸マグネシウム、二ホウ酸
マグネシウム、メタホウ酸マグネシウム、四ホウ酸三マ
グネシウム、四ホウ酸五マグネシウム等)、ホウ酸マン
ガン(ホウ酸第1マンガン、メタホウ酸マンガン、四ホ
ウ酸マンガン等)、ホウ酸リチウム(メタホウ酸リチウ
ム、四ホウ酸リチウム、五ホウ酸リチウム等)などの
他、ホウ砂、カーナイト、インヨーアイト、コトウ石、
スイアン石、ザイベリ石等のホウ酸塩鉱物などが挙げら
れ、好適にはホウ砂、ホウ酸、ホウ酸ナトリウム(メタ
ホウ酸ナトリウム、二ホウ酸ナトリウム、四ホウ酸ナト
リウム、五ホウ酸ナトリウム、六ホウ酸ナトリウム、八
ホウ酸ナトリウム等)が用いられる。As the boron compound (B) contained in the above EVOH (A), boric acid or a metal salt thereof, for example, calcium borate, cobalt borate, zinc borate (zinc tetraborate, zinc metaborate, etc.) ), Potassium aluminum borate, ammonium borate (ammonium metaborate, ammonium tetraborate, ammonium pentaborate,
Cadmium borate (cadmium orthoborate, cadmium tetraborate, etc.), potassium borate (potassium metaborate, potassium tetraborate, potassium pentaborate, potassium hexaborate, potassium octaborate, etc.) ), Silver borate (silver metaborate, silver tetraborate, etc.), copper borate (cupric borate, copper metaborate, copper tetraborate, etc.),
Sodium borate (sodium metaborate, sodium diborate, sodium tetraborate, sodium pentaborate,
Sodium hexaborate, sodium octaborate, etc.), lead borate (lead metaborate, lead hexaborate, etc.), nickel borate (nickel orthoborate, nickel diborate, nickel tetraborate, nickel octaborate, etc.) ), Barium borate (barium orthoborate, barium metaborate, barium diborate, barium tetraborate, etc.), bismuth borate, magnesium borate (magnesium orthoborate, magnesium diborate, magnesium metaborate, tetraborate) Trimagnesium, pentamagnesium tetraborate, etc.), manganese borate (manganese borate, manganese metaborate, manganese tetraborate, etc.), lithium borate (lithium metaborate, lithium tetraborate, lithium pentaborate, etc.) ), Borax, carnite, inyoite, stones,
Examples thereof include borate minerals such as suyanite and ziberite, and preferably borax, boric acid, and sodium borate (sodium metaborate, sodium diborate, sodium tetraborate, sodium pentaborate, hexaborate). Sodium octarate, etc.) are used.
【0008】かかる(B)の含有量は、ホウ素換算で
(A)100重量部に対して0.001〜1重量部で、
更に好ましくは0.001〜0.5重量部、特に好まし
くは0.002〜0.1重量部で、かかる(B)の含有
量が、ホウ素換算で0.001重量部未満では(B)含
有の効果は得られず、逆に1重量%を越えるとゲルやフ
ィッシュアイが多発して、本発明の目的を達成すること
ができない。(A)に(B)を含有させる方法として
は、特に限定されず、(A)に直接(B)をブレンド
する方法、(B)を水等の溶媒に溶解した後、(A)
に混合する方法、(B)の溶液に(A)を浸漬させる
方法、溶融状態の(A)に(B)をブレンドする方
法、(A)の水/アルコール溶液に(B)の溶液を添
加後、凝固槽中に析出させてその(多孔性)析出物を乾
燥する方法、(A)の水/アルコール溶液の多孔性析
出物を(B)の溶液中で含浸させた後、乾燥する方法等
が挙げられるが、(B)をより均一に効率良く分散させ
るという点では、やの方法が好適に用いられる。The content of (B) is 0.001 to 1 part by weight based on 100 parts by weight of (A) in terms of boron.
The content of (B) is more preferably 0.001 to 0.5 part by weight, particularly preferably 0.002 to 0.1 part by weight, and the content of (B) is less than 0.001 part by weight in terms of boron. In contrast, when the content exceeds 1% by weight, gels and fish eyes frequently occur, and the object of the present invention cannot be achieved. The method of causing (B) to be contained in (A) is not particularly limited, and a method of directly blending (B) with (A), dissolving (B) in a solvent such as water, and then adding (A)
, Method of dipping (A) in solution of (B), method of blending (B) with (A) in molten state, addition of solution of (B) to water / alcohol solution of (A) Thereafter, a method of drying the (porous) precipitate by depositing it in a coagulation bath, and a method of impregnating the porous precipitate of the water / alcohol solution of (A) in the solution of (B) and then drying it However, from the viewpoint of dispersing (B) more uniformly and efficiently, the following method is suitably used.
【0009】また、上記のEVOH(A)に含有される
酢酸(C)の含有量は、(A)100重量部に対して
0.05重量部以下で、更に好ましくは0.0005〜
0.03重量部、特に好ましくは0.0005〜0.0
1重量部で、かかる(C)の含有量が0.05重量部を
越えるとロングラン性が低下して、本発明の目的を達成
することができない。(A)に(C)を含有させる方法
としては、特に限定されず、上記の(B)と同様の含有
方法を採用することができる。The content of acetic acid (C) contained in the EVOH (A) is 0.05 parts by weight or less, more preferably 0.0005 to 5 parts by weight, per 100 parts by weight of (A).
0.03 parts by weight, particularly preferably 0.0005 to 0.0
If the content of (C) exceeds 1 part by weight and the content of (C) exceeds 0.05 part by weight, the long run property is reduced, and the object of the present invention cannot be achieved. The method for containing (C) in (A) is not particularly limited, and the same containing method as in (B) above can be employed.
【0010】更に、上記のEVOH(A)に含有される
リン酸化合物(D)としては、リン酸二水素ナトリウ
ム、リン酸水素二ナトリウム、リン酸二水素カリウム、
リン酸水素二カリウム、リン酸三カリウム、リン酸一水
素カルシウム、リン酸二水素カルシウム、リン酸三カル
シウム、リン酸マグネシウム、リン酸水素マグネシウ
ム、リン酸二水素マグネシウム、リン酸水素亜鉛、リン
酸水素バリウム、リン酸水素マンガン等を挙げることが
できるが、リン酸二水素ナトリウム、リン酸二水素カリ
ウム、リン酸二水素カルシウム、リン酸二水素マグネシ
ウムが好適に用いられ、(D)の含有量は、リン酸根換
算で(A)100重量部に対して0.0005〜0.0
5重量部で、更に好ましくは0.001〜0.04重量
部、特に好ましくは0.002〜0.03重量部で、か
かる(D)の含有量がリン酸根換算で0.0005重量
部未満ではロングラン性や層間接着性が低下し、逆に
0.05重量部を越えると成形物の外観性が低下して、
本発明の目的を達成することができない。(A)に
(D)を含有させる方法も特に限定されず、上記の
(B)と同様の含有方法を採用することができる。Further, the phosphate compound (D) contained in the EVOH (A) includes sodium dihydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate,
Dipotassium hydrogen phosphate, tripotassium phosphate, calcium monohydrogen phosphate, calcium dihydrogen phosphate, tricalcium phosphate, magnesium phosphate, magnesium hydrogen phosphate, magnesium dihydrogen phosphate, zinc hydrogen phosphate, phosphoric acid Examples thereof include barium hydrogen and manganese hydrogen phosphate, and sodium dihydrogen phosphate, potassium dihydrogen phosphate, calcium dihydrogen phosphate, and magnesium dihydrogen phosphate are preferably used, and the content of (D) Is 0.0005 to 0.0 with respect to 100 parts by weight of (A) in terms of phosphate group.
5 parts by weight, more preferably 0.001 to 0.04 parts by weight, particularly preferably 0.002 to 0.03 parts by weight, and the content of (D) is less than 0.0005 parts by weight in terms of phosphate group. In this case, the long-run property and the interlayer adhesion are reduced, and if it exceeds 0.05 parts by weight, the appearance of the molded product is reduced,
The object of the present invention cannot be achieved. The method for causing (A) to contain (D) is not particularly limited, and the same method for containing (D) as described above can be employed.
【0011】本発明においては、上記の如きEVOH
(A)に、ホウ素化合物(B)、酢酸(C)およびリン
酸化合物(D)を特定量含有させることにより、はじめ
て目的とする樹脂組成物が得られるのであって、これら
の条件を満たさない場合は上記の如く本発明の目的は達
成できないものである。上記の如き本発明の樹脂組成物
には、更に、必要に応じて、可塑剤、熱安定剤、紫外線
吸収剤、酸化防止剤、着色剤、抗菌剤、フィラー、他樹
脂などの添加剤を使用することも可能である。特にゲル
発生防止剤として、ハイドロタルサイト系化合物、ヒン
ダードフェノール系、ヒンダードアミン系熱安定剤、高
級脂肪族カルボン酸の金属塩を添加することもできる。
また、EVOH(A)として、異なる2種以上のEVO
Hを用いることも可能で、このときは、エチレン含有量
が5モル%以上異なり、及び/又はケン化度が1モル%
以上異なるEVOHのブレンド物を用いることにより、
ガスバリヤー性を保持したまま、更に高延伸時の延伸
性、真空圧空成形や深絞り成形などの2次加工性が向上
するので有用である。In the present invention, the above-mentioned EVOH
By adding a specific amount of the boron compound (B), the acetic acid (C), and the phosphoric acid compound (D) to (A), a target resin composition can be obtained for the first time, and these conditions are not satisfied. In such a case, the object of the present invention cannot be achieved as described above. In the resin composition of the present invention as described above, further, if necessary, additives such as a plasticizer, a heat stabilizer, an ultraviolet absorber, an antioxidant, a coloring agent, an antibacterial agent, a filler, and other resins are used. It is also possible. In particular, a hydrotalcite-based compound, a hindered phenol-based, a hindered amine-based heat stabilizer, and a metal salt of a higher aliphatic carboxylic acid can also be added as a gel generation inhibitor.
Further, as the EVOH (A), two or more different EVOs are used.
H can also be used, in which case the ethylene content differs by 5 mol% or more and / or the saponification degree is 1 mol%.
By using a blend of different EVOHs,
This is useful because the stretchability during high stretching and the secondary workability such as vacuum pressure forming and deep drawing can be further improved while maintaining gas barrier properties.
【0012】かくして得られた本発明の樹脂組成物は、
成形物の用途に多用され、溶融成形等によりペレット、
フィルム、シート、容器、繊維、棒、管、各種成形品等
に成形され、又、これらの粉砕品(回収品を再使用する
時など)やペレットを用いて再び溶融成形に供すること
も多い。溶融成形方法としては、押出成形法(T−ダイ
押出、インフレーション押出、ブロー成形、溶融紡糸、
異型押出等)、射出成形法が主として採用される。溶融
成形温度は、150〜250℃の範囲から選ぶことが多
い。[0012] The resin composition of the present invention thus obtained is
It is often used for molded products, and pellets by melt molding etc.
It is formed into films, sheets, containers, fibers, rods, tubes, various molded products, and the like, and is often subjected to melt molding again using crushed products (such as when reused products) or pellets are used. As the melt molding method, extrusion molding methods (T-die extrusion, inflation extrusion, blow molding, melt spinning,
Injection molding is mainly employed. The melt molding temperature is often selected from the range of 150 to 250 ° C.
【0013】本発明で得られた樹脂組成物は、上述の如
き成形物に用いることができるが、特に該樹脂組成物か
らなる層の少なくとも片面に熱可塑性樹脂層を積層して
なる積層体として用いることが好ましく、実用に適した
積層体が得られる。該積層体は、本発明のEVOH組成
物を用いているため、ガスバリヤー性、透明性はもとよ
り、高延伸時および真空圧空成形や深絞り成形のような
2次加工時の層間接着性に非常に優れた効果を示すもの
である。The resin composition obtained by the present invention can be used for a molded product as described above, and is particularly used as a laminate comprising a thermoplastic resin layer laminated on at least one surface of a layer made of the resin composition. It is preferably used, and a laminate suitable for practical use is obtained. Since the laminate uses the EVOH composition of the present invention, it has not only excellent gas barrier properties and transparency, but also excellent interlayer adhesion at the time of high stretching and at the time of secondary processing such as vacuum pressure forming or deep drawing. It shows an excellent effect.
【0014】該積層体を製造するに当たっては、本発明
で得られたEVOH組成物の層の片面又は両面に他の基
材を積層するのであるが、積層方法としては、例えば該
組成物のフィルム、シートに熱可塑性樹脂を溶融押出す
る方法、逆に熱可塑性樹脂等の基材に該組成物を溶融押
出する方法、該樹脂組成物と他の熱可塑性樹脂とを共押
出する方法、更には本発明で得られたEVOH組成物の
フィルム、シートと他の基材のフィルム、シートとを有
機チタン化合物、イソシアネート化合物、ポリエステル
系化合物、ポリウレタン化合物等の公知の接着剤を用い
てラミネートする方法等が挙げられる。In manufacturing the laminate, another substrate is laminated on one or both sides of the layer of the EVOH composition obtained in the present invention. The lamination method is, for example, a film of the composition. A method of melt-extruding a thermoplastic resin into a sheet, a method of melt-extruding the composition on a substrate such as a thermoplastic resin, a method of co-extruding the resin composition with another thermoplastic resin, and A method of laminating a film or sheet of the EVOH composition obtained by the present invention with a film or sheet of another substrate using a known adhesive such as an organic titanium compound, an isocyanate compound, a polyester compound, or a polyurethane compound. Is mentioned.
【0015】共押出の場合の相手側樹脂としては直鎖状
低密度ポリエチレン、低密度ポリエチレン、中密度ポリ
エチレン、高密度ポリエチレン、エチレン−酢酸ビニル
共重合体、アイオノマー、エチレン−プロピレン共重合
体、エチレン−アクリル酸エステル共重合体、ポリプロ
ピレン、プロピレン−α−オレフィン(炭素数4〜20
のα−オレフィン)共重合体、ポリブテン、ポリペンテ
ン等のオレフィンの単独又は共重合体、或いはこれらの
オレフィンの単独又は共重合体を不飽和カルボン酸又は
そのエステルでグラフト変性したものなどの広義のポリ
オレフィン系樹脂、ポリエステル、ポリアミド、共重合
ポリアミド、ポリ塩化ビニル、ポリ塩化ビニリデン、ア
クリル系樹脂、ポリスチレン、ビニルエステル系樹脂、
ポリエステルエラストマー、ポリウレタンエラストマ
ー、塩素化ポリエチレン、塩素化ポリプロピレン等が挙
げられる。エチレン−酢酸ビニル共重合体ケン化物も共
押出可能である。上記のなかでも、共押出製膜の容易
さ、フィルム物性(特に強度)の実用性の点から、ポリ
プロピレン、ポリアミド、ポリエチレン、エチレン−酢
酸ビニル共重合体、ポリスチレン、PETが好ましく用
いられる。In the case of coextrusion, the mating resin may be a linear low-density polyethylene, low-density polyethylene, medium-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ionomer, ethylene-propylene copolymer, ethylene -Acrylate copolymer, polypropylene, propylene-α-olefin (having 4 to 20 carbon atoms)
Α-olefins) copolymers, polyolefins such as polybutenes and polypentenes, or polyolefins in a broad sense, such as homo- or copolymers of these olefins, or graft-modified homo- or copolymers of these olefins with unsaturated carboxylic acids or esters thereof Resin, polyester, polyamide, copolymerized polyamide, polyvinyl chloride, polyvinylidene chloride, acrylic resin, polystyrene, vinyl ester resin,
Examples thereof include polyester elastomer, polyurethane elastomer, chlorinated polyethylene, and chlorinated polypropylene. Saponified ethylene-vinyl acetate copolymer can also be coextruded. Among these, polypropylene, polyamide, polyethylene, ethylene-vinyl acetate copolymer, polystyrene, and PET are preferably used from the viewpoint of ease of coextrusion film formation and practicality of film physical properties (particularly strength).
【0016】更に、本発明で得られた樹脂組成物から一
旦フィルム、シート等の成形物を得、これに他の基材を
押出コートしたり、他の基材のフィルム、シート等を接
着剤を用いてラミネートする場合、前記の熱可塑性樹脂
以外に任意の基材(紙、金属箔、一軸又は二軸延伸プラ
スチックフィルム又はシート、織布、不織布、金属綿
状、木質等)が使用可能である。積層体の層構成は、本
発明で得られた樹脂組成物の層をa(a1、a2、・・
・)、他の基材、例えば熱可塑性樹脂層をb(b1、
b2、・・・)とするとき、フィルム、シート、ボトル
状であれば、a/bの二層構造のみならず、b/a/
b、a/b/a、a1/a2/b、a/b1/b2、b2/
b1/a/b1/b2等任意の組み合わせが可能であり、
フィラメント状ではa、bがバイメタル型、芯(a)−
鞘(b)型、芯(b)−鞘(a)型、或いは偏心芯鞘型
等任意の組み合わせが可能である。Further, a molded product such as a film or sheet is once obtained from the resin composition obtained by the present invention, and another substrate is extrusion-coated thereon, or the film or sheet of another substrate is bonded to an adhesive. In the case of laminating using, any substrate (paper, metal foil, uniaxially or biaxially stretched plastic film or sheet, woven fabric, nonwoven fabric, metal flocculent, woody, etc.) other than the above-mentioned thermoplastic resin can be used. is there. The layer structure of the laminate is such that the layer of the resin composition obtained in the present invention is a (a 1 , a 2 ,...)
.), Another substrate, for example, a thermoplastic resin layer b (b 1 ,
b 2 ,...), in the case of a film, sheet, or bottle, not only a two-layer structure of a / b but also b / a /
b, a / b / a, a 1 / a 2 / b, a / b 1 / b 2, b 2 /
b 1 / a / b 1 / b 2 , etc. are possible any combination,
In the filament form, a and b are bimetal type, core (a)-
Any combination such as a sheath (b) type, a core (b) -sheath (a) type, or an eccentric core-sheath type is possible.
【0017】又、共押出の場合、aにb、bにaをブレ
ンドしたり、aやbの少なくとも一方に両層面の密着性
を向上させる樹脂を配合することもある。本発明におい
ては、該積層体は、そのまま各種形状のものに使用され
るが、更に該積層体の物性を改善するためには延伸処理
を施すことも好ましく、破断、ピンホール、クラック、
デラミ等の生じない延伸性および層間接着性に優れた効
果を示すので、非常に優れた積層体である。In the case of co-extrusion, a may be blended with b and b may be blended with a, or at least one of a and b may be blended with a resin which improves the adhesion between the two layers. In the present invention, the laminate is used as it is in various shapes, but it is also preferable to perform a stretching treatment in order to further improve the physical properties of the laminate, breaking, pinholes, cracks,
Since it exhibits an effect of excellent stretchability and interlayer adhesion without delamination or the like, it is a very excellent laminate.
【0018】延伸については、一軸延伸、二軸延伸のい
ずれであってもよく、できるだけ高倍率の延伸を行った
ほうが物性的に良好である。本発明においては、延伸時
にピンホールやクラック、延伸ムラ、デラミ等の生じな
い延伸フィルムや延伸シート等が得られる。The stretching may be either uniaxial stretching or biaxial stretching, and it is preferable to perform stretching at the highest possible magnification in terms of physical properties. In the present invention, a stretched film or a stretched sheet free from pinholes, cracks, stretch unevenness, delamination and the like during stretching can be obtained.
【0019】延伸方法としては、ロール延伸法、テンタ
ー延伸法、チューブラー延伸法、延伸ブロー法等の他、
深絞成形、真空成形等のうち延伸倍率の高いものも採用
できる。二軸延伸の場合は同時二軸延伸方式、逐次二軸
延伸方式のいずれの方式も採用できる。延伸温度は80
〜170℃、好ましくは100〜160℃程度の範囲か
ら選ばれる。The stretching method includes a roll stretching method, a tenter stretching method, a tubular stretching method, a stretching blow method, and the like.
Of the deep drawing, vacuum forming and the like, those having a high stretching ratio can be employed. In the case of biaxial stretching, any of a simultaneous biaxial stretching method and a sequential biaxial stretching method can be adopted. Stretching temperature is 80
To 170 ° C, preferably about 100 to 160 ° C.
【0020】かくして延伸が終了した後、次いで熱固定
を行う。熱固定は周知の手段で実施可能であり、上記延
伸フィルムを緊張状態を保ちながら80〜170℃、好
ましくは100〜160℃で2〜600秒間程度熱処理
を行う。又、得られる延伸フィルムは必要に応じ、冷却
処理、圧延処理、印刷処理、ドライラミネート処理、溶
液又は溶融コート処理、製袋加工、深しぼり加工、箱加
工、チューブ加工、スプリット加工等を行うことができ
る。After completion of the stretching, heat setting is performed. The heat setting can be performed by a well-known means, and heat treatment is performed at 80 to 170 ° C., preferably 100 to 160 ° C. for about 2 to 600 seconds while keeping the stretched film in a tensioned state. The obtained stretched film should be subjected to cooling, rolling, printing, dry laminating, solution or melt coating, bag making, deep squeezing, box processing, tube processing, split processing, etc. as necessary. Can be.
【0021】かくして得られた積層体の形状としては任
意のものであってよく、フィルム、シート、テープ、ボ
トル、パイプ、フィラメント、異型断面押出物等が例示
される。又、得られる積層体は必要に応じ、熱処理、冷
却処理、圧延処理、印刷処理、ドライラミネート処理、
溶液又は溶融コート処理、製袋加工、深絞り加工、箱加
工、チューブ加工、スプリット加工等を行うことができ
る。上記の如く得られたフィルム、シート或いは容器等
は食品、医薬品、工業薬品、農薬等各種の包装材料とし
て有用である。The shape of the laminate thus obtained may be arbitrary, and examples thereof include a film, a sheet, a tape, a bottle, a pipe, a filament, and an extrudate having a modified cross section. Further, the obtained laminate is heat-treated, cooled, rolled, printed, dry-laminated,
Solution or melt coating processing, bag making processing, deep drawing processing, box processing, tube processing, split processing, and the like can be performed. The films, sheets, containers and the like obtained as described above are useful as various packaging materials for foods, pharmaceuticals, industrial chemicals, agricultural chemicals and the like.
【0022】[0022]
【実施例】以下、実施例を挙げて本発明を具体的に説明
する。尚、実施例中「部」、「%」とあるのは特に断り
のない限り重量基準を示す。 実施例1 エチレン含有量35モル%、ケン化度99.5モル%、
MI20g/10分(210℃、荷重2160g)のE
VOH(A)のケン化後の水/メタノール溶液の多孔性
析出物(EVOH(A)100部に対して水100部含
有)を0.5%の酢酸水溶液で洗浄し、更に水で洗浄
後、0.2%のホウ酸(B)、0.1%の酢酸(C)お
よび0.015%のリン酸二水素ナトリウム(D)を含
有する水溶液中に投入し、30℃で5時間撹拌した後、
110℃で8時間乾燥を行って、EVOH(A)100
重量部に対して、ホウ酸(B)、酢酸(C)およびリン
酸二水素ナトリウム(D)をそれぞれ0.03重量部
(ホウ素換算)、0.009重量部および0.01重量
部(リン酸根換算)含有する本発明のEVOH組成物を
得た。The present invention will be specifically described below with reference to examples. In the examples, “parts” and “%” are based on weight unless otherwise specified. Example 1 Ethylene content 35 mol%, saponification degree 99.5 mol%,
E of MI 20g / 10min (210 ° C, load 2160g)
After washing the porous precipitate of the water / methanol solution after saponification of VOH (A) (containing 100 parts of water with respect to 100 parts of EVOH (A)) with a 0.5% aqueous acetic acid solution and further washing with water Into an aqueous solution containing 0.2% boric acid (B), 0.1% acetic acid (C) and 0.015% sodium dihydrogen phosphate (D), and stirred at 30 ° C. for 5 hours. After doing
After drying at 110 ° C. for 8 hours, the EVOH (A) 100
Parts by weight of boric acid (B), acetic acid (C) and sodium dihydrogen phosphate (D) were 0.03 parts by weight (in terms of boron), 0.009 parts by weight and 0.01 parts by weight (phosphorous). An EVOH composition of the present invention containing (in terms of acid radical) was obtained.
【0023】次いで、得られたEVOH組成物をTダイ
を備えた単軸押出機に供給し、下記の条件で、厚さ12
0μmのEVOHフィルムの成形を行って、下記の要領
で外観性およびロングラン性の評価を行った。 (単軸押出機による製膜条件) スクリュー内径 40mm L/D 28 スクリュー圧縮比 3.2 Tダイ コートハンガータイプ ダイ巾 450mm 押出温度 C1:180℃、 H:210℃ C2:200℃、 D:210℃ C3:220℃、 C4:220℃Next, the obtained EVOH composition was supplied to a single-screw extruder equipped with a T die, and a thickness of 12 mm was obtained under the following conditions.
A 0 μm EVOH film was molded, and the appearance and long run properties were evaluated in the following manner. (Film forming condition by single screw extruder) Screw inner diameter 40 mm L / D 28 Screw compression ratio 3.2 T die Coat hanger type Die width 450 mm Extrusion temperature C1: 180 ° C, H: 210 ° C C2: 200 ° C, D: 210 C3: 220C, C4: 220C
【0024】(外観性)上記の成形直後のフィルム(1
0cm×10cm)の外観性について、スジおよび
フィッシュアイの発生状況を目視観察して、以下のとお
り評価した。 スジ ○ −−− スジは認められなかった △ −−− スジが僅かに認められるが、実用上問題なし × −−− スジが多発し、実用上使用不可 フィッシュアイ ◎ −−− 0〜 3個 ○ −−− 4〜10個 △ −−− 11〜50個 × −−− 51個以上(Appearance) The film (1)
(0 cm × 10 cm), the appearance of streaks and fish eyes was visually observed and evaluated as follows. Streaks---No streaks were observed.----Streaks were slightly observed, but there was no problem in practical use.----Streaks occurred frequently and could not be used practically. Fisheye ◎---0 to 3 ○ −−− 4 to 10 △ −−− 11 to 50 × −−− 51 or more
【0025】(ロングラン性)また、上記の成形を10
日間連続に行って、その時の成形フィルムについて、ス
ジ、ゲル、フィッシュアイの増加状況を目視観察して、
以下のとおり評価した。 ○ −−− 増加は認められなかった △ −−− 若干の増加が認められた × −−− 著しい増加が認められた また、得られたEVOH組成物を用いて、フィードブロ
ック5層Tダイにより、ポリプロピレン層/接着樹脂層
/EVOH組成物層/接着樹脂層/ポリプロピレン層の
層構成となるように製膜し、多層積層フィルムを作製し
た。尚、フィルムの構成は、両外層のポリプロピレン層
(ポリプロピレンのMIが1.2g/10分)が100
μm、接着樹脂層(接着樹脂が無水マレイン酸変性ポリ
プロピレンであり、そのMIが2.6g/10分)が2
5μm、中間層のEVOH組成物層が50μmとした。
かかる多層積層フィルムについて、延伸ムラおよび層間
接着性を下記の如く評価した。(Long run property)
Performed for consecutive days, for the molded film at that time, streak, gel, visually observe the increase in fisheye,
The evaluation was as follows. ○ --- No increase was observed. △ --- A slight increase was observed. × --- A remarkable increase was observed. In addition, using the obtained EVOH composition, a feed block 5-layer T-die was used. Then, a film was formed so as to have a layer structure of polypropylene layer / adhesive resin layer / EVOH composition layer / adhesive resin layer / polypropylene layer to prepare a multilayer laminated film. In addition, the structure of the film is such that the polypropylene layers of both outer layers (the MI of polypropylene is 1.2 g / 10 min) are 100
μm, the adhesive resin layer (the adhesive resin is maleic anhydride-modified polypropylene, and its MI is 2.6 g / 10 min)
The thickness of the EVOH composition layer was 5 μm, and the thickness of the intermediate layer was 50 μm.
With respect to such a multilayer laminated film, stretch unevenness and interlayer adhesion were evaluated as follows.
【0026】(延伸ムラ)上記の多層構造体を8cm×
8cmにサンプリングし、該サンプルを150℃で1分
間予熱し、100mm/secの延伸速度で、縦方向に
3倍、横方向に3倍の順(延伸倍率:9倍)で逐次二軸
延伸を行い、得られた延伸フィルムの外観変化により下
記の基準で評価した。 ◎ −−− スジの発生は全く認められなかった ○ −−− 小さなスジが僅かに認められるものの、実用上問題なし △ −−− 大きなスジが1〜2本のスジが発生し、実用上の使用に制限あ り × −−− 大きなスジが3本以上発生し、実用上使用不可(Stretching unevenness) The above multilayer structure was 8 cm ×
The sample was sampled at 8 cm, the sample was preheated at 150 ° C. for 1 minute, and successively biaxially stretched at a stretching speed of 100 mm / sec in the order of 3 times in the longitudinal direction and 3 times in the transverse direction (stretching ratio: 9 times). The evaluation was performed according to the following criteria based on the change in appearance of the obtained stretched film. ◎ −−− No streaks were observed at all. ○ −−− Although small streaks were slightly observed, there was no problem in practical use. △ −−− One or two large streaks were generated. Limited to use × −−− Three or more large streaks are generated and cannot be used in practice
【0027】(層間接着性)上記の多層構造体の延伸フ
ィルムのEVOH層と接着剤層の接着強度をオートグラ
フにて、20℃、引張速度300mm/minでTピー
ル法により測定して、以下のとおり評価した。 ○ −−− 1000g/15mm以上 △ −−− 300〜1000g/15mm未満 × −−− 300g/15mm未満(Interlayer Adhesion) The adhesion strength between the EVOH layer and the adhesive layer of the stretched film of the multilayer structure was measured by an autograph at 20 ° C. and a tensile speed of 300 mm / min by the T-peel method. It evaluated as follows. ○ −−− 1000 g / 15 mm or more △ −−− 300 to less than 1000 g / 15 mm × −−− Less than 300 g / 15 mm
【0028】実施例2 実施例1において、エチレン含有量40モル%、ケン化
度99モル%、MI30g/10分(210℃、荷重2
160g)のEVOH(A)を用いて、0.2%のホウ
酸(B)、0.1%の酢酸(C)および0.007%の
リン酸二水素カルシウムを含有する水溶液で処理した以
外は同様に行って、EVOH(A)100重量部に対し
て、ホウ酸(B)、酢酸(C)およびリン酸二水素カル
シウム(D)をそれぞれ0.02重量部(ホウ素換
算)、0.008重量部および0.005重量部(リン
酸根換算)含有するEVOH組成物を得て、実施例1と
同様に評価を行った。Example 2 In Example 1, the ethylene content was 40 mol%, the saponification degree was 99 mol%, and MI was 30 g / 10 min (210 ° C., load 2
160 g) of EVOH (A), except that it was treated with an aqueous solution containing 0.2% boric acid (B), 0.1% acetic acid (C) and 0.007% calcium dihydrogen phosphate Is carried out in the same manner, and with respect to 100 parts by weight of EVOH (A), 0.02 parts by weight (in terms of boron) of boric acid (B), acetic acid (C) and calcium dihydrogen phosphate (D) are added. An EVOH composition containing 008 parts by weight and 0.005 parts by weight (in terms of phosphate group) was obtained and evaluated in the same manner as in Example 1.
【0029】実施例3 実施例1において、0.5%のホウ酸(B)、0.1%
の酢酸(C)および0.018%のリン酸二水素マグネ
シウム(D)を含有する水溶液で処理した以外は同様に
行って、EVOH(A)100重量部に対して、ホウ酸
(B)、酢酸(C)およびリン酸二水素マグネシウム
(D)をそれぞれ0.07重量部(ホウ素換算)、0.
008重量部および0.015重量部(リン酸根換算)
含有するEVOH組成物を得て、同様に評価を行った。Example 3 In Example 1, 0.5% boric acid (B), 0.1%
Of acetic acid (C) and an aqueous solution containing 0.018% of magnesium dihydrogen phosphate (D) in the same manner as described above, with respect to 100 parts by weight of EVOH (A), boric acid (B), Acetic acid (C) and magnesium dihydrogen phosphate (D) were each added in an amount of 0.07 parts by weight (in terms of boron),
008 parts by weight and 0.015 parts by weight (in terms of phosphate group)
An EVOH composition was obtained and evaluated similarly.
【0030】実施例4 実施例2において、0.1%のホウ酸(B)、0.05
%の酢酸(C)および0.01%のリン酸二水素カリウ
ム(D)を含有する水溶液で処理した以外は同様に行っ
て、EVOH(A)100重量部に対して、ホウ酸
(B)、酢酸(C)およびリン酸二水素カリウム(D)
をそれぞれ0.009重量部(ホウ素換算)、0.00
5重量部および0.008重量部(リン酸根換算)含有
するEVOH組成物を得て、同様に評価を行った。Example 4 In Example 2, 0.1% boric acid (B), 0.05%
% Of acetic acid (C) and an aqueous solution containing 0.01% of potassium dihydrogen phosphate (D). , Acetic acid (C) and potassium dihydrogen phosphate (D)
Are 0.009 parts by weight (converted to boron) and 0.009 parts by weight, respectively.
An EVOH composition containing 5 parts by weight and 0.008 parts by weight (in terms of phosphate group) was obtained and evaluated in the same manner.
【0031】実施例5 実施例2において、EVOH(A)として、エチレン含
有量30モル%、ケン化度99.5モル%、MI20g
/10分(210℃、荷重2160g)のEVOH(A
1)とエチレン含有量42モル%、ケン化度99.6モ
ル%、MI15g/10分(210℃、荷重2160
g)のEVOH(A2)の混合物(A1/A2の混合重量比が
70/30)を用いた以外は同様に行って、EVOH
(A)100重量部に対して、ホウ酸(B)、酢酸
(C)およびリン酸二カルシウム(D)をそれぞれ0.
018重量部(ホウ素換算)、0.008重量部および
0.005重量部(リン酸根換算)含有するEVOH組
成物を得て、同様に評価を行った。Example 5 In Example 2, as EVOH (A), ethylene content was 30 mol%, saponification degree was 99.5 mol%, and MI was 20 g.
EVOH (A) for 10 minutes (210 ° C., load 2160 g)
1) and ethylene content of 42 mol%, saponification degree of 99.6 mol%, MI of 15 g / 10 min (210 ° C., load of 2160
g), except that a mixture of EVOH (A2) (mixing weight ratio of A1 / A2 is 70/30) was used.
(A) 100 parts by weight of boric acid (B), acetic acid (C) and dicalcium phosphate (D) in an amount of 0.1 part each.
An EVOH composition containing 018 parts by weight (in terms of boron), 0.008 parts by weight, and 0.005 parts by weight (in terms of phosphate groups) was obtained and similarly evaluated.
【0032】実施例6 実施例1において、EVOH(A)として、エチレン含
有量30モル%、ケン化度99.5モル%、MI20g
/10分(210℃、荷重2160g)のEVOH(A
1)とエチレン含有量47モル%、ケン化度97モル
%、MI35g/10分(210℃、荷重2160g)
のEVOH(A2)の混合物(A1/A2の混合重量比が80
/20)を用いた以外は同様に行って、EVOH(A)
100重量部に対して、ホウ酸(B)、酢酸(C)およ
びリン酸二水素ナトリウム(D)をそれぞれ0.029
重量部(ホウ素換算)、0.009重量部および0.0
11重量部(リン酸根換算)含有するEVOH組成物を
得て、同様に評価を行った。Example 6 In Example 1, as EVOH (A), ethylene content was 30 mol%, saponification degree was 99.5 mol%, and MI was 20 g.
EVOH (A) for 10 minutes (210 ° C., load 2160 g)
1) and ethylene content 47 mol%, saponification degree 97 mol%, MI 35 g / 10 min (210 ° C., load 2160 g)
Of EVOH (A2) (A1 / A2 mixture weight ratio of 80
/ 20), except that EVOH (A) was used.
Boric acid (B), acetic acid (C) and sodium dihydrogen phosphate (D) were added to each of 0.029 parts by weight based on 100 parts by weight.
Parts by weight (in terms of boron), 0.009 parts by weight and 0.0
An EVOH composition containing 11 parts by weight (in terms of phosphate group) was obtained and evaluated in the same manner.
【0033】比較例1 実施例1において、水溶液中のホウ酸(B)量を0.0
01%とした以外は同様に行って、EVOH(A)10
0重量部に対して、ホウ酸(B)、酢酸(C)およびリ
ン酸二水素ナトリウム(D)をそれぞれ0.0005重
量部(ホウ素換算)、0.009重量部および0.01
重量部(リン酸根換算)含有するEVOH組成物を得
て、同様に評価を行った。Comparative Example 1 In Example 1, the amount of boric acid (B) in the aqueous solution was reduced to 0.0
EVOH (A) 10
With respect to 0 parts by weight, boric acid (B), acetic acid (C) and sodium dihydrogen phosphate (D) were respectively 0.0005 parts by weight (in terms of boron), 0.009 parts by weight and 0.01 part by weight.
An EVOH composition containing parts by weight (in terms of phosphate groups) was obtained and evaluated in the same manner.
【0034】比較例2 実施例1において、水溶液中のホウ酸(B)量を3%と
した以外は同様に行って、EVOH(A)100重量部
に対して、ホウ酸(B)、酢酸(C)およびリン酸二水
素ナトリウム(D)をそれぞれ1.3重量部(ホウ素換
算)、0.009重量部および0.01重量部(リン酸
根換算)含有するEVOH組成物を得て、同様に評価を
行った。Comparative Example 2 The procedure of Example 1 was repeated, except that the amount of boric acid (B) in the aqueous solution was changed to 3%. The amount of boric acid (B) and acetic acid was 100 parts by weight of EVOH (A). An EVOH composition containing 1.3 parts by weight (in terms of boron), 0.009 parts by weight and 0.01 part by weight (in terms of phosphate radical) of (C) and sodium dihydrogen phosphate (D), respectively, was obtained. Was evaluated.
【0035】比較例3 実施例1において、水溶液中の酢酸(C)量を1%とし
た以外は同様に行って、EVOH(A)100重量部に
対して、ホウ酸(B)、酢酸(C)およびリン酸二水素
ナトリウム(D)をそれぞれ0.03重量部(ホウ素換
算)、0.08重量部および0.01重量部(リン酸根
換算)含有するEVOH組成物を得て、同様に評価を行
った。Comparative Example 3 The procedure of Example 1 was repeated, except that the amount of acetic acid (C) in the aqueous solution was changed to 1%, with respect to 100 parts by weight of EVOH (A), boric acid (B) and acetic acid ( An EVOH composition containing 0.03 parts by weight (in terms of boron), 0.08 parts by weight and 0.01 part by weight (in terms of phosphate radical) of C) and sodium dihydrogen phosphate (D), respectively, was obtained. An evaluation was performed.
【0036】比較例4 実施例1において、水溶液中のリン酸二水素ナトリウム
(D)量を0.0005%とした以外は同様に行って、
EVOH(A)100重量部に対して、ホウ酸(B)、
酢酸(C)およびリン酸二水素ナトリウム(D)をそれ
ぞれ0.03重量部(ホウ素換算)、0.009重量部
および0.0003重量部(リン酸根換算)含有するE
VOH組成物を得て、同様に評価を行った。Comparative Example 4 The procedure of Example 1 was repeated except that the amount of sodium dihydrogen phosphate (D) in the aqueous solution was 0.0005%.
With respect to 100 parts by weight of EVOH (A), boric acid (B),
E containing 0.03 parts by weight (in terms of boron), 0.009 parts by weight and 0.0003 parts by weight (in terms of phosphate radical) of acetic acid (C) and sodium dihydrogen phosphate (D), respectively.
A VOH composition was obtained and evaluated similarly.
【0037】比較例5 実施例1において、水溶液中のリン酸二水素ナトリウム
(D)量を0.1%とした以外は同様に行って、EVO
H(A)100重量部に対して、ホウ酸(B)、酢酸
(C)およびリン酸二水素ナトリウム(D)をそれぞれ
0.03重量部(ホウ素換算)、0.009重量部およ
び0.08重量部(リン酸根換算)含有するEVOH組
成物を得て、同様に評価を行った。実施例、比較例のそ
れぞれの評価結果を表1にまとめて示す。Comparative Example 5 EVO was performed in the same manner as in Example 1 except that the amount of sodium dihydrogen phosphate (D) in the aqueous solution was changed to 0.1%.
With respect to 100 parts by weight of H (A), boric acid (B), acetic acid (C) and sodium dihydrogen phosphate (D) were added in an amount of 0.03 part by weight (in terms of boron), 0.009 part by weight, and 0.1 part by weight, respectively. An EVOH composition containing 08 parts by weight (in terms of phosphate groups) was obtained and evaluated in the same manner. Table 1 shows the evaluation results of the examples and comparative examples.
【0038】[0038]
【表1】 外観性 ロングラン性 延伸ムラ 層間接着性 実施例1 ○ ◎ ○ ○ ○ 〃 2 ○ ◎ ○ ◎ ○ 〃 3 ○ ◎ ○ ○ ○ 〃 4 ○ ◎ ○ ◎ ○ 〃 5 ○ ◎ ○ ◎ ○ 〃 6 ○ ◎ ○ ◎ ○ 比較例1 ○ ◎ ○ × × 〃 2 △ × △ △ ○ 〃 3 ○ ○ × ○ ○ 〃 4 ○ × × × △ 〃 5 × × ○ × ○ [Table 1]Appearance Long run properties Uneven stretchability Interlayer adhesion Example 1 ○ ◎ ○ ○ ○ 〃 2 ○ ◎ ○ ◎ ○ 〃 3 ○ ◎ ○ ○ ○ 〃 4 ○ ◎ ○ ◎ ○ 〃 5 ○ ◎ ○ ◎ ○6 6 ○ ◎ ○ ◎ ○ Comparative Example 1 ○ ◎ ○ × × 〃 2 △ × △ △ ○ 〃 3 ○ ○ × ○ ○ 〃 4 ○ × × × △ △〃 5 × × ○ × ○
【0039】[0039]
【発明の効果】本発明は、EVOH組成物は、ホウ素化
合物、酢酸およびリン酸化合物を特定量含有せしめてい
るため、溶融成形時のロングラン性に優れ、フィッシュ
アイが少なく、外観性にも優れた成形物が得られ、更に
は該成形物を積層体として、延伸や深絞りなどの二次加
工後も該積層体の層間接着性にも優れ、各種の積層体と
することができ、食品や医薬品、農薬品、工業薬品包装
用のフィルム、シート、チューブ、袋、容器等の用途に
非常に有用で、特に延伸を伴う二次加工製品等に好適に
用いることができる。According to the present invention, since the EVOH composition contains a specific amount of a boron compound, an acetic acid and a phosphoric acid compound, it has an excellent long-run property at the time of melt molding, has less fish eyes, and has an excellent appearance. In addition, the molded article is obtained, and the molded article is formed into a laminate, and after the secondary processing such as stretching or deep drawing, the laminate has excellent interlayer adhesion, and can be formed into various laminates. It is very useful for applications such as films, sheets, tubes, bags, containers and the like for packaging pharmaceuticals, agricultural chemicals and industrial chemicals, and can be suitably used particularly for secondary processed products involving stretching.
Claims (4)
ン化度が90モル%以上のエチレン−酢酸ビニル共重合
体ケン化物(A)、ホウ素化合物(B)、酢酸(C)お
よびリン酸化合物(D)を含有してなり、かつ(B)の
含有量がホウ素換算で(A)100重量部に対して0.
001〜1重量部、(C)の含有量が(A)100重量
部に対して0.05重量部以下、(D)の含有量がリン
酸根換算で(A)100重量部に対して0.0005〜
0.05重量部であることを特徴とする樹脂組成物。1. A saponified ethylene-vinyl acetate copolymer (A) having an ethylene content of 20 to 60 mol% and a saponification degree of 90 mol% or more, a boron compound (B), acetic acid (C) and phosphoric acid Compound (D) is contained, and the content of (B) is 0.1% based on 100 parts by weight of (A) in terms of boron.
001 to 1 part by weight, the content of (C) is 0.05 parts by weight or less based on 100 parts by weight of (A), and the content of (D) is 0 based on 100 parts by weight of (A) in terms of phosphate. .0005-
A resin composition characterized by being 0.05 part by weight.
リウム、リン酸二水素カリウム、リン酸二水素カルシウ
ム、リン酸二水素マグネシウムから選ばれる少なくとも
1種であることを特徴とする請求項1記載の樹脂組成
物。2. The phosphoric acid compound (D) is at least one selected from sodium dihydrogen phosphate, potassium dihydrogen phosphate, calcium dihydrogen phosphate, and magnesium dihydrogen phosphate. 2. The resin composition according to 1.
なる層の少なくとも片面に熱可塑性樹脂層を積層してな
ることを特徴とする積層体。3. A laminate comprising a layer made of the resin composition according to claim 1 and a thermoplastic resin layer laminated on at least one surface of the layer.
あることを特徴とする請求項3記載の積層体。4. The laminate according to claim 3, wherein the thermoplastic resin is a polyolefin resin.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21805297A JP3895011B2 (en) | 1997-07-28 | 1997-07-28 | Resin composition and laminate thereof |
| CA002267756A CA2267756C (en) | 1997-07-25 | 1998-07-24 | Resin composition, production thereof, and laminate comprising a layer composed of said resin composition |
| EP98933923A EP0930339B1 (en) | 1997-07-25 | 1998-07-24 | Resin composition, process for preparing the same, and laminate containing layer of said resin composition |
| US09/269,222 US6174949B1 (en) | 1997-07-25 | 1998-07-24 | Resin composition, process for preparing the same, and laminate containing layer of said resin composition |
| DE69821905T DE69821905T2 (en) | 1997-07-25 | 1998-07-24 | RESIN COMPOSITION, METHOD FOR THE PRODUCTION THEREOF AND LAMINATES CONTAINING A LAYER OF THIS RESIN COMPOSITION |
| AU83576/98A AU741372B2 (en) | 1997-07-25 | 1998-07-24 | Resin composition, process for preparing the same, and laminate containing layer of said resin composition |
| PCT/JP1998/003310 WO1999005213A1 (en) | 1997-07-25 | 1998-07-24 | Resin composition, process for preparing the same, and laminate containing layer of said resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21805297A JP3895011B2 (en) | 1997-07-28 | 1997-07-28 | Resin composition and laminate thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1143573A true JPH1143573A (en) | 1999-02-16 |
| JP3895011B2 JP3895011B2 (en) | 2007-03-22 |
Family
ID=16713907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21805297A Expired - Lifetime JP3895011B2 (en) | 1997-07-25 | 1997-07-28 | Resin composition and laminate thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3895011B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000063607A (en) * | 1998-08-24 | 2000-02-29 | Nippon Synthetic Chem Ind Co Ltd:The | Resin composition, production method thereof, and use thereof |
| JP2001072823A (en) * | 1999-07-07 | 2001-03-21 | Kuraray Co Ltd | Resin composition comprising ethylene-vinyl alcohol copolymer and multilayer structure using the same |
| JP2001146539A (en) * | 1999-09-07 | 2001-05-29 | Kuraray Co Ltd | Resin composition comprising ethylene-vinyl alcohol copolymer excellent in low odor and interlayer adhesion, and multilayer structure using the same |
| US7615272B2 (en) | 2002-02-15 | 2009-11-10 | Kuraray Co., Ltd. | Coinjection stretch blow molded container |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4082780B2 (en) * | 1998-04-08 | 2008-04-30 | 日本合成化学工業株式会社 | Manufacturing method of resin composition |
| JP4125417B2 (en) * | 1998-04-08 | 2008-07-30 | 日本合成化学工業株式会社 | Manufacturing method of resin composition |
| JP4164151B2 (en) * | 1998-04-08 | 2008-10-08 | 日本合成化学工業株式会社 | Manufacturing method of resin composition |
-
1997
- 1997-07-28 JP JP21805297A patent/JP3895011B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000063607A (en) * | 1998-08-24 | 2000-02-29 | Nippon Synthetic Chem Ind Co Ltd:The | Resin composition, production method thereof, and use thereof |
| JP2001072823A (en) * | 1999-07-07 | 2001-03-21 | Kuraray Co Ltd | Resin composition comprising ethylene-vinyl alcohol copolymer and multilayer structure using the same |
| JP2001146539A (en) * | 1999-09-07 | 2001-05-29 | Kuraray Co Ltd | Resin composition comprising ethylene-vinyl alcohol copolymer excellent in low odor and interlayer adhesion, and multilayer structure using the same |
| US7615272B2 (en) | 2002-02-15 | 2009-11-10 | Kuraray Co., Ltd. | Coinjection stretch blow molded container |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3895011B2 (en) | 2007-03-22 |
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