JPH1177518A - Polishing pad - Google Patents

Abstract

(57) [PROBLEMS] To improve a polishing pad used for precision polishing of a semiconductor substrate, a substrate for a hard disk, and a glass substrate for a liquid crystal. A polishing pad having a continuous groove formed on a polishing surface of a circular polishing pad while leaving a slight outer peripheral portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a polishing pad used for precision polishing of semiconductor substrates, hard disk substrates, and liquid crystal substrates.

[0002]

2. Description of the Related Art Conventionally, semiconductor substrates such as silicon wafers,
Polishing cloth (hereinafter referred to as suede polishing) in which a urethane resin layer with a vertical foam structure is formed on one surface of a substrate such as a nonwoven fabric for precision polishing of glass, substrates for hard disks composed of aluminum / nickel, and glass substrates for liquid crystal displays. Cloth)
A polishing cloth (hereinafter referred to as a velor-like polishing cloth) in which a urethane resin is impregnated into a fiber sheet which is randomly laminated, and a single urethane foam resin sheet are used.

In order to further improve the circulation of the abrasive liquid (hereinafter referred to as slurry), a polishing pad having a continuous groove having an arbitrary shape such as a lattice pattern, a rhombus pattern, and a turtle pattern formed on a polishing surface is used. I have.

[0004]

As described above, since continuous grooves such as a lattice pattern, a rhombus plate, and a turtle pattern are formed on the entire surface of the polishing surface of the polishing pad, the supplied slurry flows along the grooves. Since the amount of the slurry flowing out of the polishing pad and acting on the polishing is reduced, the polishing rate is reduced and the cost is increased.

Further, when the polishing machine is stopped, the slurry in the groove portion flows out, the air comes into contact with the polishing surface, the chemical reaction is promoted, the groove shape is inverted on the polishing surface, and the uniformity of the polishing surface is improved. There was a drawback that lowering.

[0006]

According to the present invention, a continuous groove (3) is formed on a polishing surface of a circular polishing pad while leaving a small outer peripheral portion (1). .

For the polishing pad of the present invention, a suede-like polishing cloth, a velor-like polishing cloth and a urethane resin sheet having a single foam structure are used.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION A polishing pad according to the present invention is provided on a polishing surface (2) of a circular polishing pad having a certain outer peripheral edge (1) outside a portion where a polishing object is in contact with a polishing object. Using a press die such as a wire mesh, heating and pressing were performed to form a groove (3). A groove (3) was formed on the polished surface using a cutting tool such as a saw blade. As the shape of the groove, any continuous pattern such as a lattice pattern, a rhombus pattern, a turtle pattern, a spiral pattern, a sea-island pattern can be selected.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. A suede-like polishing cloth in which a urethane resin layer having a vertical foam structure is formed on one surface of a nonwoven fabric (5) having a thickness of 0.9 mm by a wet coagulation method, and a skin layer is removed by buffing to form a suede layer (2). Was cut into a circle by a die cutter. A steel grid pattern mold having a groove width of 1.0 mm and a groove gap of 4.0 mm was used on the polishing surface of the circular polishing pad, leaving an outer peripheral portion (1) on a ring having a width of 20 mm. , Pressure 250g / c
m, pressurizing time: 3 minutes, heating and pressurizing with a press machine to form a lattice pattern groove (3) having a groove width of 1.0 mm and a groove depth of 0.5 mm. The width of the ring-shaped outer peripheral portion (1) is set to 20 mm in the above embodiment, but is preferably set to 50 mm or less in practical use. As a result of polishing the aluminum / nickel substrate for a hard disk using this polishing pad, the amount of slurry used could be reduced by 25%. In addition, the polishing rate could be improved by 10%.

Further, as a result of inspection of the polished surface, the shape of the groove was not inverted on the polished surface, and the polishing quality was very uniform.

[0011]

As described above, the polishing pad of the present invention is composed of a circular portion having an arbitrary continuous pattern of grooves formed on the polishing surface and an outer peripheral portion having no continuous grooves formed thereon. Since the supplied slurry effectively acts on polishing without flowing out of the polishing pad along the groove, the amount of slurry used can be greatly reduced, and the production cost can be reduced.

Further, since the slurry is sufficiently held in the grooves at the end of polishing, the polished surface of the polished material does not come into contact with air, and therefore, there is no chemical reaction due to air, and uniform polishing quality is obtained.

[Brief description of the drawings]

FIG. 1 is a plan view of a polishing pad according to an embodiment of the present invention.

FIG. 2 is a sectional view of a polishing pad according to an embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 outer peripheral edge of polishing pad 2 suede layer of same pad 3 groove of same pad 4 outer peripheral edge of same pad 5 nonwoven fabric of same pad

Claims (1)

[Claims] 1. A polishing pad in which a continuous groove is formed on a polishing surface of a circular polishing pad while leaving a slight outer peripheral portion.