JPH11785A - Workpiece positioning device for laser beam machine - Google Patents

Workpiece positioning device for laser beam machine

Info

Publication number
JPH11785A
JPH11785A JP9153806A JP15380697A JPH11785A JP H11785 A JPH11785 A JP H11785A JP 9153806 A JP9153806 A JP 9153806A JP 15380697 A JP15380697 A JP 15380697A JP H11785 A JPH11785 A JP H11785A
Authority
JP
Japan
Prior art keywords
workpiece
sheet
positioning
surface plate
reference pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9153806A
Other languages
Japanese (ja)
Other versions
JP3727441B2 (en
Inventor
Takeshi Muneyuki
健 宗行
Satoharu Yamamoto
聡治 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15380697A priority Critical patent/JP3727441B2/en
Publication of JPH11785A publication Critical patent/JPH11785A/en
Application granted granted Critical
Publication of JP3727441B2 publication Critical patent/JP3727441B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials
    • B23K2103/166Multilayered materials
    • B23K2103/172Multilayered materials wherein at least one of the layers is non-metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic materials
    • B23K2103/42Plastics other than composite materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

(57)【要約】 【課題】 静電気を帯びやすくカールしやすいシート状
の被加工物を所定位置に精度よく位置決めするレーザー
加工機の位置決め装置を提供する。 【解決手段】 定盤2上に搬入されたシート状の被加工
物1を定盤2に設けた開口部3からの排気により浮上さ
せて移動を容易にした状態で、湾曲防止部16a〜16
dにより両端側で挟持し、位置決め操作部10の押出ピ
ン7により基準ピン5側に押し出してシート1の端部を
基準ピン5に当接させて位置決めする。シート1はカー
ルしやすく静電気を帯びやすいが、定盤2上で排気によ
り浮上させ湾曲防止部16で挟持されているので、平面
状態を保って移動させることが容易となり、正確な位置
決めを円滑に行うことができる。
(57) [Problem] To provide a positioning device of a laser processing machine for accurately positioning a sheet-shaped workpiece, which is easily charged with static electricity and easily curls, at a predetermined position. SOLUTION: In a state where a sheet-like workpiece 1 carried on a surface plate 2 is floated by exhaust from an opening 3 provided in the surface plate 2 to facilitate movement, the bending prevention portions 16a to 16 are provided.
The sheet is clamped at both ends by d, and is pushed out to the reference pin 5 side by the push-out pin 7 of the positioning operation section 10 to position the end of the sheet 1 by abutting the reference pin 5. The sheet 1 is easily curled and tends to be charged with static electricity. However, since the sheet 1 is levitated on the surface plate 2 by the exhaust and is sandwiched by the bending prevention unit 16, it can be easily moved while maintaining a flat state, and the accurate positioning can be smoothly performed. It can be carried out.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、シート状の被加工
物をレーザー加工機の所定の加工位置に位置決めするレ
ーザー加工機の被加工物位置決め装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a workpiece positioning device for a laser processing machine for positioning a sheet-shaped workpiece at a predetermined processing position of the laser processing machine.

【0002】[0002]

【従来の技術】高密度に電子回路を形成した多層基板等
に用いられる樹脂製のシートに微小な孔を高精度に加工
するためにレーザー加工機が用いられる。この加工を効
率よく低コストで実施するため、複数のシートを大きな
サイズのシート上に展開して1枚の加工用シートとし、
一括して処理することが望まれている。
2. Description of the Related Art A laser processing machine is used for processing minute holes with high precision in a resin sheet used for a multilayer substrate or the like on which electronic circuits are formed at high density. In order to carry out this processing efficiently and at low cost, a plurality of sheets are spread on a large-sized sheet to form one processing sheet,
It is desired to process them all at once.

【0003】このような大きなサイズのシートをレーザ
ー加工機の所定位置に位置決めする従来装置は、図5に
示すように構成されており、所定位置に配設された定盤
22上に搬入されたシート1を位置決めピン24で基準
ピン23側に押し出して、シート1の基準端を基準ピン
23に当接させることにより位置決めする。
A conventional apparatus for positioning such a large-sized sheet at a predetermined position of a laser beam machine is configured as shown in FIG. 5, and is carried on a surface plate 22 provided at a predetermined position. The sheet 1 is extruded toward the reference pins 23 by the positioning pins 24, and the sheet 1 is positioned by bringing the reference ends of the sheets 1 into contact with the reference pins 23.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、シート
1が1枚の加工サイズのシートとして裁断される以前は
ロール状態で供給されるため、裁断後にもロール時のカ
ールした形状が残存しており、これが大きなサイズにな
るほどカールする傾向が強くなり、また、樹脂製のシー
ト1は静電気を帯びやすく、その静電気により定盤22
上に吸着するため、位置決めピン24からの押圧を受け
ると、静電気による吸着とカール形状の残存とから定盤
22上での移動が円滑になされず、図示するように湾曲
が生じて位置決め精度が低下する問題点があった。
However, since the sheet 1 is supplied in a roll state before being cut as one sheet of a processing size, the curled shape at the time of the roll remains even after the cut, As this becomes larger, the tendency to curl becomes stronger, and the resin sheet 1 is easily charged with static electricity.
When pressed by the positioning pins 24, the movement on the surface plate 22 is not smooth due to the electrostatic attraction and the remaining curl shape. There was a problem of lowering.

【0005】本発明の目的とするところは、シート状の
被加工物を精度よく位置決めすることができるレーザー
加工機の被加工物位置決め装置を提供することにある。
An object of the present invention is to provide a workpiece positioning device for a laser beam machine which can accurately position a sheet-shaped workpiece.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
の本発明は、シート状の被加工物をレーザー加工機の所
定の加工位置に位置決めするレーザー加工機の被加工物
位置決め装置において、前記被加工物が載置される載置
面に形成された空気流通孔への吸気と排気とを切り換え
ることにより載置された被加工物を吸着または浮上さ
せ、浮上させて被加工物の位置決め移動を容易にし、吸
着して位置決めされた被加工物を平面状態に保持する定
盤と、前記定盤上に載置された被加工物の基準端の位置
を規制する基準ピンと、前記定盤上に載置されたシート
状の被加工物の基準端側及びその反対側を両面から挟ん
で被加工物の湾曲を防止する湾曲防止手段と、前記被加
工物を前記基準ピン側に押し出して被加工物の基準端を
基準ピンに当接させる位置決め操作部とを具備してなる
ことを特徴とする。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a workpiece positioning device for a laser processing machine for positioning a sheet-shaped workpiece at a predetermined processing position of the laser processing machine. By switching between intake and exhaust to an air flow hole formed on a mounting surface on which a workpiece is placed, the placed workpiece is sucked or floated, and then floated to move the workpiece. A platen for holding the workpiece positioned by suction, in a flat state, a reference pin for regulating the position of a reference end of the workpiece placed on the platen, Means for preventing the workpiece from being bent by sandwiching the reference end side and the opposite side of the sheet-like workpiece placed on the both sides from both sides, and extruding the workpiece toward the reference pin side to prevent the workpiece from bending. Make the reference end of the workpiece abut the reference pin And characterized by being provided with a positioning operation unit.

【0007】上記構成によれば、定盤上に搬入されたシ
ート状の被加工物は、定盤に形成された空気流通孔から
排気がなされることにより浮上するので、帯電した静電
気により定盤に吸着することがなく、その移動が円滑に
できる状態となる。この状態で被加工物の基準端側とそ
の反対側とから、その両面を湾曲防止手段により挟んで
おくことにより被加工物が湾曲状態に変形しないので、
位置決め操作部により被加工物を基準ピン側に押し出
し、被加工物の基準端を基準ピンに当接させると位置決
めされるので、定盤の空気流通孔を吸気に切り換え、被
加工物を定盤上に吸着して位置決めされた状態に保持す
る。この構成により被加工物がロール状態であったとき
のカール形状が残存していたり、静電気の帯電による定
盤への付着により位置決めの動作が円滑且つ正確になさ
れない状態は解決され、被加工物の位置決め精度が向上
して精密なレーザー加工を実施することができる。
[0007] According to the above construction, the sheet-like workpiece carried on the surface plate floats by being exhausted from the air circulation holes formed in the surface plate. It is in a state where it can be smoothly moved without being adsorbed on the surface. In this state, since the workpiece is not deformed into a curved state by sandwiching both surfaces of the workpiece from the reference end side and the opposite side with the bending prevention means,
The workpiece is pushed out to the reference pin side by the positioning operation unit, and the workpiece is positioned when the reference end of the workpiece is brought into contact with the reference pin. It is sucked up and held in a positioned state. With this configuration, the state where the curl shape remains when the workpiece is in a roll state or the positioning operation is not performed smoothly and accurately due to adhesion to the surface plate due to electrostatic charging is solved. The precision of laser processing can be performed by improving the positioning accuracy of the laser beam.

【0008】[0008]

【発明の実施の形態】以下、添付図面を参照して本発明
の一実施形態について説明し、本発明の理解に供する。
以下に示す実施形態は、高密度の電子回路を形成する多
層基板に使用される樹脂製シートを被加工物として、こ
れをレーザー加工機の所定位置に位置決めする位置決め
装置として構成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The embodiment described below is configured as a positioning device for positioning a resin sheet used for a multi-layer substrate forming a high-density electronic circuit at a predetermined position of a laser processing machine.

【0009】図1は、位置決め装置20の平面図、図2
は、そのA−A線矢視方向側面図を示しており、位置決
め装置20は、定盤2、基準ピン5、湾曲防止部16a
〜16d、位置決め操作部10を備えて構成され、定盤
2上に搬入されたシート1を所定位置に位置決めする。
FIG. 1 is a plan view of a positioning device 20, and FIG.
Shows a side view in the direction of arrows AA of FIG. 2, and the positioning device 20 includes a surface plate 2, a reference pin 5, and a bending prevention portion 16a.
16d, and is configured to include a positioning operation unit 10, and positions the sheet 1 carried on the surface plate 2 at a predetermined position.

【0010】定盤2は、シート1が載置される載置面上
に多数の開口部(空気流通孔)3が設けられており、各
開口部3は図2に示すように、空気配管で吸排気切替器
4に接続されて図外の吸排気装置に連結され、前記開口
部3から吸気するときには載置されたシート1を定盤2
上に吸着保持し、開口部3から排気するときには載置さ
れたシート1を僅かに浮上させることにより載置位置の
移動が容易にできるように構成されている。
The platen 2 is provided with a number of openings (air flow holes) 3 on a mounting surface on which the sheet 1 is mounted, and each opening 3 has an air pipe as shown in FIG. Is connected to an air intake / exhaust switching device 4 and is connected to an air intake / exhaust device (not shown).
When the sheet is held by suction and exhausted from the opening 3, the mounted sheet 1 is slightly lifted to easily move the mounting position.

【0011】基準ピン5は、定盤2上に載置されるシー
ト1の図示X軸方向の位置決め点となるもので、この基
準ピン5にシート1のX軸方向の位置決めの基準端とす
る端部を当接させることにより、X軸方向の位置決めが
なされる。尚、Y軸方向の位置決めは、Y軸方向から定
盤2上に搬入されるシート1の端辺を定盤2の位置決め
辺2aに当接させることにより位置決めされる。前記基
準ピン5は図2に示すように昇降駆動装置6に取り付け
られ、レーザー加工機へのセット時には上昇位置にあ
り、位置決め時に下降して図示する所定位置に固定され
る。
The reference pin 5 serves as a reference point for positioning the sheet 1 placed on the surface plate 2 in the X-axis direction in the figure, and serves as a reference end for positioning the sheet 1 in the X-axis direction. By bringing the end portions into contact, positioning in the X-axis direction is performed. The positioning in the Y-axis direction is performed by bringing an end side of the sheet 1 carried into the surface plate 2 from the Y-axis direction into contact with a positioning side 2a of the surface plate 2. The reference pin 5 is attached to a lifting drive 6 as shown in FIG. 2 and is at a raised position when set on a laser beam machine, lowered during positioning and fixed at a predetermined position shown in the figure.

【0012】位置決め操作部10は、押出ピン7、7を
図2に示す直線駆動装置8によりX軸方向に移動させる
ことにより、定盤2上に載置されたシート1を前記基準
ピン5側に押し出してシート1の基準端を基準ピン5に
当接させることにより位置決めできるように構成され、
回動アーム7a、7aの先端部に取り付けられた各押出
ピン7、7は、それぞれバネ9、9が回動アーム7a、
7aの後端を引っ張り方向に付勢することによって所定
圧力でシート1に当接するように構成されている。
The positioning operation unit 10 moves the sheet 1 placed on the surface plate 2 to the reference pin 5 side by moving the push pins 7, 7 in the X-axis direction by a linear drive device 8 shown in FIG. And the reference end of the sheet 1 is brought into contact with the reference pin 5 so as to be positioned.
Each of the push pins 7, 7 attached to the distal ends of the rotating arms 7a, 7a has a spring 9, 9, respectively.
The rear end 7a is configured to contact the sheet 1 at a predetermined pressure by urging the rear end in the pulling direction.

【0013】湾曲防止部16は、前記位置決め操作部1
0側に一対の湾曲防止部16a、16b、前記基準ピン
5側に一対の湾曲防止部16c、16dとして設けられ
ている。図3は、湾曲防止部16aを側面図として示す
もので、他の湾曲防止部16b〜16dも同様に構成さ
れている。図示するように先端に挟持ピン11、後端に
カムフォロア13が取り付けられた一対のレバー25、
25は、支持軸12位置で交差して支持軸12に回動自
在に軸支されている。この回動軸12はシリンダ15に
連結されており、シリンダ15の動作により支持軸12
が定盤2側に押し出されると、所定位置に固定されたカ
ム14の傾斜面上に載ったカムフォロア13、13の間
隔が広がるため、図示するように挟持ピン11、11間
が閉じてシート1の端部を挟み、前記位置決め操作部1
0によってシート1の端部が押されたときにシート1が
湾曲してしまうことを防止する。前記挟持ピン11によ
るシート1の挟持は、シート1が湾曲しないように挟持
しているだけでよいので、挟圧する必要はなくシート1
との間に僅かな隙間を設けた状態で挟み、シート1がX
軸方向に自由に移動できるように保持する。この湾曲防
止部16a〜16dはX軸方向の両側に設けられている
ので、それぞれがシート1の両端辺を挟んでいることに
よってロール状態にあったときのカール状態が残存して
いるシート1を湾曲しないように保持することができ
る。
The bending prevention section 16 is provided with the positioning operation section 1.
A pair of bending prevention portions 16a and 16b are provided on the 0 side, and a pair of bending prevention portions 16c and 16d are provided on the reference pin 5 side. FIG. 3 is a side view of the bending prevention unit 16a, and the other bending prevention units 16b to 16d have the same configuration. As shown in the figure, a pair of levers 25 each having a holding pin 11 at a front end and a cam follower 13 at a rear end,
Reference numeral 25 intersects at the position of the support shaft 12 and is rotatably supported by the support shaft 12. The rotation shaft 12 is connected to a cylinder 15, and the operation of the cylinder 15 causes the support shaft 12 to rotate.
When the sheet is pushed out toward the platen 2, the interval between the cam followers 13, 13 placed on the inclined surface of the cam 14 fixed at a predetermined position is widened. Of the positioning operation unit 1
0 prevents the sheet 1 from bending when the end of the sheet 1 is pressed. The sheet 1 can be held by the holding pins 11 only by holding the sheet 1 so that the sheet 1 does not bend.
The sheet 1 is sandwiched with a small gap between
Hold so that it can move freely in the axial direction. Since the curving prevention portions 16a to 16d are provided on both sides in the X-axis direction, the curl state when the sheet 1 is in a rolled state by sandwiching both sides of the sheet 1 remains. It can be held without bending.

【0014】次に、上記構成によりシート1を所定位置
に位置決めする動作について説明する。
Next, an operation of positioning the sheet 1 at a predetermined position by the above configuration will be described.

【0015】まず、定盤2上にシート1が搬入される
と、定盤2の開口部3から空気を排出してシート1を僅
かに浮上させ、シート1の位置移動が容易にできるよう
にする。シート1は樹脂製なので静電気を帯びやすく、
その静電気により定盤2に付着してしまうと移動が困難
になるが、開口部3からの排気により浮上させておくと
移動が円滑になされる。
First, when the sheet 1 is carried into the surface plate 2, air is discharged from the opening 3 of the surface plate 2 to slightly float the sheet 1 so that the position of the sheet 1 can be easily moved. I do. Since the sheet 1 is made of resin, it is easily charged with static electricity.
If the static electricity adheres to the surface plate 2, the movement becomes difficult. If the surface is floated by the exhaust air from the opening 3, the movement is smooth.

【0016】次いで、基準ピン5が昇降駆動装置6によ
り下降して所定位置にセットされる。更に、シリンダ1
5の動作により各湾曲防止部16a〜16dが動作して
シート1のX軸方向の両端部を挟持ピン11で挟持した
状態にして、直線駆動装置8の動作により押出ピン7、
7を基準ピン5側に移動させることにより、定盤2上に
載置されたシート1を押し出し、シート1の基準端側の
端辺を基準ピン5に当接させて位置決めする。
Next, the reference pin 5 is lowered by the lifting drive device 6 and set at a predetermined position. Furthermore, cylinder 1
5, the respective bending prevention portions 16a to 16d are operated to hold both ends of the sheet 1 in the X-axis direction by the holding pins 11, and the push-out pins 7,
The sheet 1 placed on the surface plate 2 is pushed out by moving the sheet 7 to the reference pin 5 side, and the edge of the sheet 1 on the reference end side is brought into contact with the reference pin 5 for positioning.

【0017】シート1の位置決めがなされると、吸排気
切替器4を吸気に切り換えることにより定盤2の開口部
3から吸気して、位置決めされたシート1を定盤2上に
吸着保持する。この後、位置決め操作部10、湾曲防止
部16、基準ピン5は、それぞれ定盤2の両側から退
き、待機位置に移動する。
When the position of the sheet 1 is determined, the air intake / exhaust switch 4 is switched to the intake air to suck air from the opening 3 of the surface plate 2, and the positioned sheet 1 is suction-held on the surface plate 2. Thereafter, the positioning operation unit 10, the bending prevention unit 16, and the reference pin 5 retreat from both sides of the surface plate 2, respectively, and move to the standby position.

【0018】図4はレーザー加工機の構成を示し、X軸
テーブル18及びY軸テーブル19上にシート把持部1
7を備えて構成されている。上記位置決め装置20は、
このレーザー加工機のシート把持部17のY軸方向位置
に隣接して配置されているので、位置決めされた状態で
定盤2上に保持されているシート1は、前記Y軸テーブ
ル18の動作により定盤2の位置に移動したシート把持
部17によって、その両端辺が把持され、レーザー加工
位置に移動する。シート1はその両端を把持された状態
でレーザー50の照射による加工がなされる。
FIG. 4 shows the structure of the laser beam machine. The sheet gripper 1 is placed on an X-axis table 18 and a Y-axis table 19.
7 is provided. The positioning device 20 includes:
Since the sheet 1 held on the surface plate 2 in the positioned state is arranged by the operation of the Y-axis table 18 because the sheet 1 is disposed adjacent to the position of the sheet gripping portion 17 of the laser processing machine in the Y-axis direction. Both sides are gripped by the sheet gripper 17 moved to the position of the platen 2 and moved to the laser processing position. The sheet 1 is processed by irradiating the laser 50 with both ends held.

【0019】[0019]

【発明の効果】以上の説明の通り本発明によれば、定盤
上に搬入されたシート状の被加工物を定盤に形成された
空気流通孔からの排気により僅かに浮上させ、その移動
が円滑にできる状態にして、更に、被加工物の基準端側
とその反対側との両面を湾曲防止手段により挟んでおく
ことにより被加工物が湾曲状態に変形しないようにし
て、位置決め操作部により被加工物を基準ピン側に押し
出すことにより、被加工物の基準端を基準ピンに当接さ
せて位置決めする。位置決めされた被加工物は定盤の空
気流通孔を吸気に切り換えることにより定盤上に吸着し
て位置決めされた状態に保持する。この構成により被加
工物がロール状態であったときのカール形状が残存して
いたり、静電気の帯電による定盤への付着により位置決
めの動作が円滑且つ正確になされない状態は解決され、
被加工物の位置決め精度が向上して精密なレーザー加工
を実施することができる。
As described above, according to the present invention, the sheet-like workpiece carried on the surface plate is slightly lifted by the exhaust air from the air flow holes formed in the surface plate, and the surface is moved. Can be smoothly moved, and furthermore, the workpiece is prevented from being deformed into a curved state by sandwiching both sides of the reference end side and the opposite side of the workpiece with the bending prevention means, so that the positioning operation unit By pushing the workpiece to the reference pin side, the reference end of the workpiece is brought into contact with the reference pin for positioning. The positioned workpiece is sucked onto the surface plate by switching the air flow holes of the surface plate to intake air, and is maintained in a positioned state. This configuration solves the problem that the curl shape when the workpiece is in a roll state remains or the positioning operation is not performed smoothly and accurately due to adhesion to the surface plate due to electrostatic charging,
The positioning accuracy of the workpiece is improved, and precise laser processing can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施形態に係る位置決め装置の構成を
示す平面図。
FIG. 1 is a plan view showing a configuration of a positioning device according to an embodiment of the present invention.

【図2】図1のA−A線矢視方向での位置決め装置の構
成を示す側面図。
FIG. 2 is a side view showing the configuration of the positioning device in the direction of arrows AA in FIG. 1;

【図3】実施形態に係る湾曲防止部の構成を示す側面
図。
FIG. 3 is a side view illustrating a configuration of a bending prevention unit according to the embodiment.

【図4】レーザー加工機の構成を示す側面図。FIG. 4 is a side view showing the configuration of the laser beam machine.

【図5】従来例に係る位置決め装置の構成を示す側面
図。
FIG. 5 is a side view showing a configuration of a positioning device according to a conventional example.

【符号の説明】 1 シート(被加工物) 2 定盤 3 開口部(空気流通孔) 5 基準ピン 10 位置決め操作部 16 湾曲防止部 20 位置決め装置[Description of Signs] 1 Sheet (workpiece) 2 Surface plate 3 Opening (air flow hole) 5 Reference pin 10 Positioning operation unit 16 Bending prevention unit 20 Positioning device

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 シート状の被加工物をレーザー加工機の
所定位置に位置決めするレーザー加工機の被加工物位置
決め装置において、 前記被加工物が載置される載置面に形成された空気流通
孔への吸気と排気とを切り換えることにより載置された
被加工物を吸着または浮上させ、浮上させて被加工物の
位置決め移動を容易にし、吸着して位置決めされた被加
工物を平面状態に保持する定盤と、前記定盤上に載置さ
れた被加工物の基準端の位置を規制する基準ピンと、前
記定盤上に載置されたシート状の被加工物の基準端側及
びその反対側を両面から挟んで被加工物の湾曲を防止す
る湾曲防止手段と、前記被加工物を前記基準ピン側に押
し出して被加工物の基準端を基準ピンに当接させる位置
決め操作部とを具備してなることを特徴とするレーザー
加工機の被加工物位置決め装置。
1. A workpiece positioning device for a laser beam machine for positioning a sheet-shaped workpiece at a predetermined position of a laser beam machine, wherein an air flow formed on a mounting surface on which the workpiece is mounted. The placed workpiece is sucked or floated by switching between intake and exhaust to the hole, making it easier to move the workpiece by floating, and bringing the workpiece positioned by suction into a planar state. A holding surface plate, a reference pin for regulating a position of a reference end of the workpiece placed on the surface plate, and a reference end side of a sheet-like workpiece placed on the surface plate and the reference pin. A bending prevention means for preventing bending of the workpiece by sandwiching the opposite side from both sides, and a positioning operation unit for extruding the workpiece to the reference pin side and abutting the reference end of the workpiece on the reference pin. Laser characterized by comprising Workpiece positioning apparatus of the working machine.
JP15380697A 1997-06-11 1997-06-11 Workpiece positioning device for laser beam machine Expired - Fee Related JP3727441B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15380697A JP3727441B2 (en) 1997-06-11 1997-06-11 Workpiece positioning device for laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15380697A JP3727441B2 (en) 1997-06-11 1997-06-11 Workpiece positioning device for laser beam machine

Publications (2)

Publication Number Publication Date
JPH11785A true JPH11785A (en) 1999-01-06
JP3727441B2 JP3727441B2 (en) 2005-12-14

Family

ID=15570533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15380697A Expired - Fee Related JP3727441B2 (en) 1997-06-11 1997-06-11 Workpiece positioning device for laser beam machine

Country Status (1)

Country Link
JP (1) JP3727441B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692626A (en) * 1984-06-20 1987-09-08 Westphal Georg P Nuclear and X-ray spectrometry and low-pass filter and filtering method therefor
WO2009081621A1 (en) * 2007-12-21 2009-07-02 Mitsuboshi Diamond Industrial Co., Ltd. Laser processing apparatus and laser processing method
WO2009084276A1 (en) * 2007-12-27 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. Laser processing apparatus
WO2010101060A1 (en) * 2009-03-03 2010-09-10 日立ビアメカニクス株式会社 Method of working thin layer on work and thin layor working apparatus
WO2010088501A3 (en) * 2009-02-02 2011-05-12 Corning Incorporated Material sheet handling system and processing methods
JP2011147996A (en) * 2009-12-25 2011-08-04 Shibaura Mechatronics Corp Can sealer
JP5221560B2 (en) * 2007-11-27 2013-06-26 三星ダイヤモンド工業株式会社 Laser processing equipment
TWI421141B (en) * 2009-12-24 2014-01-01 Hitachi High Tech Corp Laser processing method and laser processing device and solar panel manufacturing method
CN115551790A (en) * 2021-04-21 2022-12-30 空气及水麻吉股份有限公司 Elastic sheet handling device and elastic sheet punching system

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692626A (en) * 1984-06-20 1987-09-08 Westphal Georg P Nuclear and X-ray spectrometry and low-pass filter and filtering method therefor
JP5221560B2 (en) * 2007-11-27 2013-06-26 三星ダイヤモンド工業株式会社 Laser processing equipment
WO2009081621A1 (en) * 2007-12-21 2009-07-02 Mitsuboshi Diamond Industrial Co., Ltd. Laser processing apparatus and laser processing method
CN101903129A (en) * 2007-12-21 2010-12-01 三星钻石工业股份有限公司 Laser processing device and laser processing method
JP5070299B2 (en) * 2007-12-21 2012-11-07 三星ダイヤモンド工業株式会社 Laser processing apparatus and laser processing method
WO2009084276A1 (en) * 2007-12-27 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. Laser processing apparatus
JP5374385B2 (en) * 2007-12-27 2013-12-25 三星ダイヤモンド工業株式会社 Laser processing equipment
CN101909806A (en) * 2007-12-27 2010-12-08 三星钻石工业股份有限公司 Laser processing device
TWI413563B (en) * 2007-12-27 2013-11-01 Mitsuboshi Diamond Ind Co Ltd Laser processing device
WO2010088501A3 (en) * 2009-02-02 2011-05-12 Corning Incorporated Material sheet handling system and processing methods
US8528886B2 (en) 2009-02-02 2013-09-10 Corning Incorporated Material sheet handling system and processing methods
WO2010101060A1 (en) * 2009-03-03 2010-09-10 日立ビアメカニクス株式会社 Method of working thin layer on work and thin layor working apparatus
TWI421141B (en) * 2009-12-24 2014-01-01 Hitachi High Tech Corp Laser processing method and laser processing device and solar panel manufacturing method
JP2011147996A (en) * 2009-12-25 2011-08-04 Shibaura Mechatronics Corp Can sealer
CN115551790A (en) * 2021-04-21 2022-12-30 空气及水麻吉股份有限公司 Elastic sheet handling device and elastic sheet punching system

Also Published As

Publication number Publication date
JP3727441B2 (en) 2005-12-14

Similar Documents

Publication Publication Date Title
JP3119369B2 (en) Plate making equipment for color printing
TWI796534B (en) Peel-off device
CN103963421B (en) Stripping device and stripping method
TWI226097B (en) Method and apparatus for transferring a thin plate, and manufacturing method of substrate using the same
JPH0899769A (en) Film peeling method and apparatus
JP7823671B2 (en) Electrode sheet notching device and notching method
JPH11785A (en) Workpiece positioning device for laser beam machine
CN112421126A (en) Laminate holding device
JP2004083180A (en) Transfer device and transfer method for sheet-like substrate
JP2000001261A (en) Automatic stacking device
JP2866771B2 (en) Single-sheet unit
JP4394797B2 (en) Substrate transfer device
JP4854256B2 (en) Panel processing apparatus and processing method
JPH0555785A (en) Substrate supply device
JPH0527375Y2 (en)
JP7306936B2 (en) Work receiving support device
JP4307653B2 (en) Substrate support device and substrate transfer mechanism
JP2637994B2 (en) Screen printing machine
JP2003251714A (en) Sheet processing method and apparatus
CN221103653U (en) Stripping apparatus
JP3082668U (en) Laminator
JP2575580Y2 (en) Circuit board support device
WO2008032623A1 (en) Seat folding device
JP3330447B2 (en) Substrate positioning method and substrate positioning device
JPH0687960U (en) Edge peeling device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040611

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050906

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050920

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050928

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091007

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees