JPH1180862A - Copper-iron alloy material for lead frame, excellent in heat resistance - Google Patents
Copper-iron alloy material for lead frame, excellent in heat resistanceInfo
- Publication number
- JPH1180862A JPH1180862A JP24401797A JP24401797A JPH1180862A JP H1180862 A JPH1180862 A JP H1180862A JP 24401797 A JP24401797 A JP 24401797A JP 24401797 A JP24401797 A JP 24401797A JP H1180862 A JPH1180862 A JP H1180862A
- Authority
- JP
- Japan
- Prior art keywords
- alloy material
- mass
- grains
- lead frame
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000956 alloy Substances 0.000 title claims abstract description 22
- 229910000640 Fe alloy Inorganic materials 0.000 title 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 239000002245 particle Substances 0.000 claims description 14
- 229910017827 Cu—Fe Inorganic materials 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 34
- 238000010438 heat treatment Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 8
- 238000000137 annealing Methods 0.000 abstract description 5
- 238000005098 hot rolling Methods 0.000 abstract description 5
- 238000001556 precipitation Methods 0.000 abstract description 4
- 238000005097 cold rolling Methods 0.000 abstract description 3
- 238000009749 continuous casting Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- VAKIVKMUBMZANL-UHFFFAOYSA-N iron phosphide Chemical compound P.[Fe].[Fe].[Fe] VAKIVKMUBMZANL-UHFFFAOYSA-N 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、耐熱性に優れたリ
ードフレーム用Cu−Fe系合金材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Cu-Fe alloy material for lead frames having excellent heat resistance.
【０００２】[0002]
【従来の技術】電子機器に用いられる半導体装置の大容
量、小型、高機能化にともない、半導体装置に使用され
るリードフレームの小断面積化が進み一層の強度、導電
性、熱伝導性が要求されている。一方、従来より半導体
リードフレーム用銅合金としてはFeを含む銅合金が広く
用いられており、特にFe： 2.1〜 2.6質量％、 P：0.01
5 〜0.15質量％、Zn：0.05〜0.20質量％を含有する銅合
金（CDA194合金）は、銅合金の内でも強度、導電性、熱
伝導性に優れていることから多く用いられている。2. Description of the Related Art As semiconductor devices used in electronic equipment have become larger in capacity, smaller in size, and more sophisticated, lead frames used in semiconductor devices have become smaller and smaller in cross-sectional area. Has been requested. On the other hand, conventionally, a copper alloy containing Fe has been widely used as a copper alloy for a semiconductor lead frame. In particular, Fe: 2.1 to 2.6 mass%, P: 0.01
A copper alloy (CDA194 alloy) containing 5 to 0.15% by mass and Zn: 0.05 to 0.20% by mass is widely used among copper alloys because of its excellent strength, electrical conductivity, and thermal conductivity.
【０００３】[0003]
【発明が解決しようとする課題】ところで、半導体装置
は上記したように大容量、小型、高機能化が要求されて
きていることから、半導体製品の多ピン化、薄肉化がな
されつつあり、これに伴って、リードフレーム素材から
リードフレームへの打ち抜き加工の際に生じるひずみが
大きくなってきており、そのひずみを除去するために加
熱が必要になる。しかし、ひずみ除去の加熱をすると強
度が低下することが懸念され、特に上記のCu−Fe系合金
からなるリードフレームではひずみ取りのための加熱に
より強度が低下し、素材の段階で有している高強度をリ
ードフレームとなったときに維持できないと言った問題
がある。Since the semiconductor device is required to have a large capacity, a small size, and a high function as described above, the number of pins and the thickness of the semiconductor product are being reduced. As a result, the strain generated during the punching process from the lead frame material to the lead frame is increasing, and heating is required to remove the strain. However, there is a concern that the strength may decrease when heating for strain removal is performed, and in particular, in the lead frame made of the above-described Cu-Fe alloy, the strength is reduced by heating for strain removal, and the material has a material stage. There is a problem that high strength cannot be maintained when it becomes a lead frame.
【０００４】本発明は、上記の問題点に鑑みてなされた
ものであって、その目的は、ひずみ除去の加熱をしても
強度の低下が比較的少ない、すなわち耐熱性に優れたリ
ードフレーム用Cu−Fe系合金材を提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to reduce the strength of a lead frame even when heating for strain removal, that is, for a lead frame having excellent heat resistance. It is intended to provide a Cu-Fe alloy material.
【０００５】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明に係る耐熱性に優れたリードフレーム用Cu
−Fe系合金材は、Fe： 1.5〜 2.6質量％、 P：0.01〜
0.1質量％、Zn：0.01〜0.2質量％を含有し、残部Cu及び
不可避不純物からなるリードフレーム用Cu−Fe系合金材
であって、その内部組織が、析出したFe粒子のうち直径
が40nm以下のFe粒子の合金中の体積分率が 0.2％以上と
するものである。In order to achieve the above object, the present invention relates to a heat-resistant Cu for lead frame according to the present invention.
-Fe-based alloy material: Fe: 1.5 to 2.6 mass%, P: 0.01 to
A Cu-Fe alloy material for lead frames containing 0.1% by mass and Zn: 0.01 to 0.2% by mass, the balance being Cu and unavoidable impurities, the internal structure of which is 40 nm or less in diameter of precipitated Fe particles. The volume fraction of the Fe particles in the alloy is set to 0.2% or more.
【０００６】以下本発明における化学成分並びに析出し
たFe粒子の直径とその体積分率の限定理由を説明する。
まず、化学成分の限定理由について、The reasons for limiting the chemical components and the diameter of the precipitated Fe particles and the volume fraction thereof in the present invention are described below.
First, regarding the reasons for limiting chemical components,
【０００７】Feは、強度を向上させる元素であるが、含
有量が 1.5質量％未満では微細析出Fe粒子の生成量が少
なく、導電性の向上は満たされるものの、強度向上への
寄与が不足する。一方、含有量が 2.6質量％を超えると
導電性が低下するとともに、鋳塊製造時に生成する粗大
な晶出物量が多くなり、最終製品（リードフレーム）で
の延性が低下する。また、鋳塊からリードフレーム素材
に圧延加工する際に、熱間圧延前の加熱あるいは中間焼
鈍においてFeの巨大析出物が生成し、圧延加工性が劣化
する上に、そのFeの巨大析出物が最終製品にも残ること
になり、耐熱性の低下を招くことになる。従って、Feの
含有量は 1.5〜 2.6質量％とする。[0007] Fe is an element for improving the strength. If the content is less than 1.5% by mass, the amount of finely precipitated Fe particles is small, and the improvement in conductivity is satisfied, but the contribution to the improvement in strength is insufficient. . On the other hand, when the content exceeds 2.6% by mass, the conductivity is reduced, and the amount of coarse crystallized substances generated during ingot production is increased, and the ductility in the final product (lead frame) is reduced. In addition, when rolling from an ingot to a lead frame material, a giant precipitate of Fe is generated in heating or intermediate annealing before hot rolling, which deteriorates rolling workability, and a giant precipitate of Fe is formed. It will also remain in the final product, leading to a decrease in heat resistance. Therefore, the content of Fe is set to 1.5 to 2.6% by mass.
【０００８】Pは、脱酸作用があるほか、Feと金属間化
合物を形成し、Feを析出強化させる元素であるが、含有
量が0.01質量％未満ではFeが 1.5〜 2.6質量％存在して
も析出強化に寄与しない。一方、含有量が 0.1質量％を
超えると導電性が低下するとともに、Feの固溶限が低下
し、鋳塊製造時に粗大な晶出物量が多くなり、その晶出
物がひずみ除去加熱の際の回復現象の核になり最終製品
で耐熱性が低下する。従って、 Pの含有量を0.01〜 0.1
質量％とする。[0008] P is an element that has a deoxidizing effect, forms an intermetallic compound with Fe, and precipitates and strengthens Fe. If the content is less than 0.01% by mass, 1.5 to 2.6% by mass of Fe is present. Also does not contribute to precipitation strengthening. On the other hand, if the content exceeds 0.1% by mass, the conductivity decreases, the solid solubility limit of Fe decreases, and the amount of coarse crystallized substances increases during ingot production. The core of the recovery phenomenon, the heat resistance of the final product decreases. Therefore, the content of P is 0.01 to 0.1
% By mass.
【０００９】Znは、 Pと同様に脱酸作用があるが、含有
量が0.01質量％未満では脱酸の効果が期待できない。一
方、含有量が 0.2質量％を超えると脱酸作用が飽和して
しまい、導電率も低下する。従って、Znの含有量を0.01
〜 0.2質量％とする。[0009] Zn has a deoxidizing effect like P, but if its content is less than 0.01% by mass, no deoxidizing effect can be expected. On the other hand, when the content exceeds 0.2% by mass, the deoxidizing action is saturated, and the electric conductivity is lowered. Therefore, the content of Zn is 0.01
To 0.2% by mass.
【００１０】次に、析出Fe粒子の直径とその体積分率の
限定理由について、微細析出物の直径を40nm以下に限定
するのは、直径が40nmを超える大きさでは転位の移動・
消滅ならびにピン止め効果による再結晶粒の成長を妨ぐ
には有効ではなく、リードフレーム素材から最終製品
（リードフレーム）への打ち抜き加工の際に生じるひず
みを除去するための加熱の際に、回復及び再結晶粒の成
長を抑制できずに、耐熱性が低下するためである。Next, regarding the reasons for limiting the diameter of the precipitated Fe particles and the volume fraction thereof, limiting the diameter of the fine precipitate to 40 nm or less is because the size of the fine particles exceeds 40 nm.
It is not effective in preventing the extinction and the growth of recrystallized grains due to the pinning effect. It is not effective to recover and re-heat during heating to remove the strain generated during punching from the lead frame material to the final product (lead frame). This is because the growth of crystal grains cannot be suppressed and the heat resistance decreases.
【００１１】直径を40nm以下の微細析出物の体積分率を
0.2％以上に限定するのは、微細析出物の直径が上記の
ように40nm以下であっても、その体積分率が 0.2％以下
では転位の移動・消滅ならびにピン止め効果による再結
晶粒の成長を妨ぐためには不十分な量であって、上記ひ
ずみを除去するための加熱の際に、回復及び再結晶粒の
生成・成長を抑制できずに、耐熱性が低下するためであ
る。従って、本発明では析出したFe粒子のうち直径が40
nm以下のFe粒子の合金中の体積分率を 0.2％以上とする
ものである。The volume fraction of fine precipitates having a diameter of 40 nm or less
The reason for limiting to 0.2% or more is that even if the diameter of the fine precipitates is 40 nm or less as described above, the dislocation migration / disappearance and the growth of recrystallized grains due to the pinning effect if the volume fraction is 0.2% or less. This is because the amount is insufficient to prevent the occurrence of heat, and during heating for removing the strain, the recovery and the generation and growth of recrystallized grains cannot be suppressed, and the heat resistance decreases. Therefore, in the present invention, the diameter of the precipitated Fe particles is 40
The volume fraction in the alloy of Fe particles of nm or less is set to 0.2% or more.
【００１２】[0012]
【発明の実施の形態】Cu−Fe系合金材の化学成分がFe：
1.5〜 2.6質量％、 P：0.01〜 0.1質量％、Zn：0.01〜
0.2質量％となるように銅合金を溶解し、半連続鋳造法
にて造塊し、この後、得られた鋳塊を加熱し所定の厚み
まで熱間圧延する。更に、面削後、冷間圧延と中間焼鈍
を繰り返して、所定厚み（約 0.2mm程度）のリードフレ
ーム用Cu−Fe系合金材に製造する。なお、この製造過程
で、熱間圧延を比較的高い温度で終了させ、その後速や
かに水冷するとよく、これにより粗大なFeあるいはリン
化鉄（Fe-P）の析出が抑制される。BEST MODE FOR CARRYING OUT THE INVENTION The chemical composition of a Cu-Fe alloy material is Fe:
1.5 to 2.6 mass%, P: 0.01 to 0.1 mass%, Zn: 0.01 to
The copper alloy is melted so as to have a concentration of 0.2% by mass, and ingot is formed by a semi-continuous casting method. Thereafter, the obtained ingot is heated and hot-rolled to a predetermined thickness. Further, after the surface grinding, cold rolling and intermediate annealing are repeated to produce a Cu-Fe alloy material for a lead frame having a predetermined thickness (about 0.2 mm). In this manufacturing process, hot rolling may be terminated at a relatively high temperature, and then quickly cooled with water, thereby suppressing the precipitation of coarse Fe or iron phosphide (Fe-P).
【００１３】[0013]
【実施例】表１に示す化学成分を有する銅合金をコアレ
ス炉にて溶解し、厚さ 150mm×幅600mm×長さ4000mmの
鋳塊を半連続鋳造法にて造塊した。これら各化学成分の
鋳塊を加熱後、熱間圧延にて厚さ16mmまで圧延した。そ
して更に面削後、冷間圧延と中間焼鈍を繰り返して、厚
さ約 0.2mmのリードフレーム用Cu−Fe系合金材を製造し
た。EXAMPLE A copper alloy having the chemical components shown in Table 1 was melted in a coreless furnace, and an ingot having a thickness of 150 mm, a width of 600 mm and a length of 4000 mm was formed by a semi-continuous casting method. After heating the ingot of each of these chemical components, it was rolled to a thickness of 16 mm by hot rolling. Then, after further surface grinding, cold rolling and intermediate annealing were repeated to produce a Cu-Fe alloy material for a lead frame having a thickness of about 0.2 mm.
【００１４】[0014]
【表１】 [Table 1]
【００１５】上記で得たリードフレーム用Cu−Fe系合金
材より試験材を取り出し、その試験材を用いて、引張試
験、硬さ測定、導電率測定を行った。また、ひずみ除去
加熱後の強度測定の代わりに温度 450℃で 3分間加熱し
た後の硬さ測定を行った。これらの測定結果を表２に示
す。なお、表２に示す微細析出Fe粒子の直径は、透過型
電子顕微鏡（ＴＥＭ）で観察、撮影した写真を用いて 1
個 1個測定しその平均を求めたものである。また、体積
分率は、観察時に測定した膜厚より観察体積を求め、そ
れと写真から求めた粒子の直径と数から求めた粒子の体
積との比率で求めたものである。また、表２に示す引張
強さ、硬さ、導電率等の目標値はこのリードフレーム用
Cu−Fe系合金材に要求されているものである。A test material was taken out of the Cu-Fe alloy material for a lead frame obtained above, and a tensile test, hardness measurement, and conductivity measurement were performed using the test material. Also, instead of measuring the strength after heating to remove strain, hardness was measured after heating at 450 ° C for 3 minutes. Table 2 shows the measurement results. The diameter of the finely precipitated Fe particles shown in Table 2 was determined using a photograph observed and photographed with a transmission electron microscope (TEM).
This is the result of measuring one piece and calculating the average. In addition, the volume fraction is obtained by calculating the observation volume from the film thickness measured at the time of observation, and calculating the ratio of the particle volume obtained from the photograph to the particle volume obtained from the number. The target values such as tensile strength, hardness and conductivity shown in Table 2 are for the lead frame.
This is required for Cu-Fe based alloy materials.
【００１６】[0016]
【表２】 [Table 2]
【００１７】表２から明らかなように、本発明例No.1〜
3 は、引張特性、硬さ、導電率等が目標値を上回り、特
に耐熱性を示す 450℃× 3分加熱後硬さも高く、高強度
・高導電率を備えると共に高耐熱性を有していることが
分かる。As is apparent from Table 2, the present invention examples No. 1 to No. 1
3) Tensile properties, hardness, conductivity, etc. exceed target values, especially high heat resistance 450 ° C × 3 minutes after heating for 3 minutes, high strength, high conductivity and high heat resistance You can see that there is.
【００１８】上記本発明例に対して、比較例No.4では、
Fe量が 1.4質量％と僅かに少なかったために、微細析出
Fe粒子の量、すなわち体積分率が0.18％と小さくなり、
結果、導電率と伸びが高くなったものの、引張強さ、耐
力、硬さが目標値を下回り、特に 450℃× 3分加熱にお
いて転位の移動・消滅を抑制することができず、回復現
象が進行し、加熱後の硬さが低くなり耐熱性が著しく劣
るものとなった。In contrast to the above-mentioned example of the present invention, Comparative Example No. 4
Fine precipitation due to slightly lower Fe content of 1.4% by mass
The amount of Fe particles, that is, the volume fraction is reduced to 0.18%,
As a result, although the conductivity and elongation were increased, the tensile strength, proof stress, and hardness were below the target values, and especially at 450 ° C for 3 minutes, the dislocation movement and disappearance could not be suppressed. The hardness after heating decreased, and the heat resistance became extremely poor.
【００１９】また、比較例No.5では、Fe量が 2.7質量％
と僅かに多かったために、鋳塊製造時に粗大な晶出物が
生成し、結果、引張強さ、耐力、硬さが目標値を上回っ
たものの、伸びが目標値を下回った。また、巨大な晶出
物、及び熱間圧延前の加熱あるいは中間焼鈍において生
成する巨大な析出物は、 450℃× 3分加熱において回復
現象の進行を妨げることができずに耐熱性が劣るものと
なった。In Comparative Example No. 5, the Fe content was 2.7% by mass.
, A coarse crystallized product was produced during the production of the ingot, and as a result, the tensile strength, the proof stress and the hardness exceeded the target values, but the elongation was lower than the target values. In addition, giant precipitates and giant precipitates formed during heating before hot rolling or during intermediate annealing cannot be prevented from progressing the recovery phenomenon at 450 ° C x 3 minutes and have poor heat resistance. It became.
【００２０】また、比較例No.6では、 P量が0.12質量％
と多かったために、 Pが固溶すると共にこの Pの固溶に
よりFeの固溶限が低下し、微細析出Fe粒子の直径とその
体積分率は満たすものの、特に 450℃× 3分加熱におい
て、鋳塊製造時に生成した晶出物が回復現象の核となっ
て進行し、加熱後の硬さが低くなり耐熱性が著しく劣る
ものとなった。In Comparative Example No. 6, the P content was 0.12% by mass.
Therefore, the solid solution of P and the solid solution of P lower the solid solubility limit of Fe, and the diameter and the volume fraction of finely precipitated Fe particles are satisfied, but especially at 450 ° C × 3 minutes heating, Crystallized matter produced during the production of the ingot proceeded as a nucleus of the recovery phenomenon, and the hardness after heating was reduced, resulting in significantly poor heat resistance.
【００２１】また、比較例No.7では、Zn量が0.25質量％
と多かったために、導電率が低下した。In Comparative Example No. 7, the Zn content was 0.25% by mass.
, The conductivity decreased.
【００２２】[0022]
【発明の効果】以上説明したように、本発明によれば、
半導体用リードフレームとして加熱後も強度低下の小さ
い、耐熱性に優れたリードフレーム用Cu−Fe系合金材を
提供することができる。As described above, according to the present invention,
It is possible to provide a lead-frame Cu-Fe-based alloy material having a small strength decrease even after heating and excellent in heat resistance as a semiconductor lead frame.
Claims (1)
質量％、Zn：0.01〜0.2質量％を含有し、残部Cu及び不
可避不純物からなるリードフレーム用Cu−Fe系合金材で
あって、その内部組織が、析出したFe粒子のうち直径が
40nm以下のFe粒子の合金中の体積分率が 0.2％以上であ
ることを特徴とする耐熱性に優れたリードフレーム用Cu
−Fe系合金材。1. Fe: 1.5 to 2.6 mass%, P: 0.01 to 0.1
Mass%, Zn: 0.01 to 0.2 mass%, a Cu-Fe alloy material for a lead frame comprising the balance Cu and unavoidable impurities, the internal structure of which has a diameter of precipitated Fe particles having a diameter of
Cu for lead frames with excellent heat resistance, characterized in that the volume fraction of Fe particles of 40 nm or less in the alloy is 0.2% or more.
-Fe-based alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24401797A JPH1180862A (en) | 1997-09-09 | 1997-09-09 | Copper-iron alloy material for lead frame, excellent in heat resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24401797A JPH1180862A (en) | 1997-09-09 | 1997-09-09 | Copper-iron alloy material for lead frame, excellent in heat resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1180862A true JPH1180862A (en) | 1999-03-26 |
Family
ID=17112479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24401797A Pending JPH1180862A (en) | 1997-09-09 | 1997-09-09 | Copper-iron alloy material for lead frame, excellent in heat resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1180862A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6344171B1 (en) * | 1999-08-25 | 2002-02-05 | Kobe Steel, Ltd. | Copper alloy for electrical or electronic parts |
| JP2002294364A (en) * | 2001-03-30 | 2002-10-09 | Kobe Steel Ltd | Copper alloy sheet or strip for electronic and electric parts and method for producing the same |
| US7727344B2 (en) | 2000-04-28 | 2010-06-01 | The Furukawa Electric Co., Ltd. | Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate |
| JP4527198B1 (en) * | 2009-08-20 | 2010-08-18 | 三菱伸銅株式会社 | Method for producing copper alloy for electronic equipment |
| JP2012107297A (en) * | 2010-11-18 | 2012-06-07 | Hitachi Cable Ltd | Copper alloy for electric and electronic components, and method of manufacturing the same |
| JP2012136746A (en) * | 2010-12-27 | 2012-07-19 | Hitachi Cable Ltd | Copper alloy for electric and electronic parts, and method for manufacturing the same |
| CN104928521A (en) * | 2014-03-18 | 2015-09-23 | 株式会社神户制钢所 | Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility |
| CN110453106A (en) * | 2019-07-29 | 2019-11-15 | 西安斯瑞先进铜合金科技有限公司 | A kind of production process of non-vacuum lead-casting copper-iron alloy slab |
-
1997
- 1997-09-09 JP JP24401797A patent/JPH1180862A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6344171B1 (en) * | 1999-08-25 | 2002-02-05 | Kobe Steel, Ltd. | Copper alloy for electrical or electronic parts |
| US7727344B2 (en) | 2000-04-28 | 2010-06-01 | The Furukawa Electric Co., Ltd. | Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate |
| JP2002294364A (en) * | 2001-03-30 | 2002-10-09 | Kobe Steel Ltd | Copper alloy sheet or strip for electronic and electric parts and method for producing the same |
| JP4527198B1 (en) * | 2009-08-20 | 2010-08-18 | 三菱伸銅株式会社 | Method for producing copper alloy for electronic equipment |
| WO2011021245A1 (en) * | 2009-08-20 | 2011-02-24 | 三菱伸銅株式会社 | Copper alloy and lead frame material for electronic equipment |
| KR20120048591A (en) | 2009-08-20 | 2012-05-15 | 미츠비시 신도 가부시키가이샤 | Copper alloy and lead frame material for electronic equipment |
| JP2012107297A (en) * | 2010-11-18 | 2012-06-07 | Hitachi Cable Ltd | Copper alloy for electric and electronic components, and method of manufacturing the same |
| JP2012136746A (en) * | 2010-12-27 | 2012-07-19 | Hitachi Cable Ltd | Copper alloy for electric and electronic parts, and method for manufacturing the same |
| CN104928521A (en) * | 2014-03-18 | 2015-09-23 | 株式会社神户制钢所 | Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility |
| CN110453106A (en) * | 2019-07-29 | 2019-11-15 | 西安斯瑞先进铜合金科技有限公司 | A kind of production process of non-vacuum lead-casting copper-iron alloy slab |
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