JPS48105467U - - Google Patents

Info

Publication number
JPS48105467U
JPS48105467U JP1972030377U JP3037772U JPS48105467U JP S48105467 U JPS48105467 U JP S48105467U JP 1972030377 U JP1972030377 U JP 1972030377U JP 3037772 U JP3037772 U JP 3037772U JP S48105467 U JPS48105467 U JP S48105467U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972030377U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972030377U priority Critical patent/JPS48105467U/ja
Publication of JPS48105467U publication Critical patent/JPS48105467U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/921Structures or relative sizes of bond pads
    • H10W72/923Bond pads having multiple stacked layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/934Cross-sectional shape, i.e. in side view

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1972030377U 1972-03-15 1972-03-15 Pending JPS48105467U (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972030377U JPS48105467U (mo) 1972-03-15 1972-03-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972030377U JPS48105467U (mo) 1972-03-15 1972-03-15

Publications (1)

Publication Number Publication Date
JPS48105467U true JPS48105467U (mo) 1973-12-07

Family

ID=27892615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972030377U Pending JPS48105467U (mo) 1972-03-15 1972-03-15

Country Status (1)

Country Link
JP (1) JPS48105467U (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609160A (ja) * 1983-06-28 1985-01-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609160A (ja) * 1983-06-28 1985-01-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

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