JPS482463U - - Google Patents
Info
- Publication number
- JPS482463U JPS482463U JP1971041296U JP4129671U JPS482463U JP S482463 U JPS482463 U JP S482463U JP 1971041296 U JP1971041296 U JP 1971041296U JP 4129671 U JP4129671 U JP 4129671U JP S482463 U JPS482463 U JP S482463U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/076—Connecting or disconnecting of strap connectors
- H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971041296U JPS482463U (mo) | 1971-05-21 | 1971-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971041296U JPS482463U (mo) | 1971-05-21 | 1971-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS482463U true JPS482463U (mo) | 1973-01-12 |
Family
ID=27913144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971041296U Pending JPS482463U (mo) | 1971-05-21 | 1971-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS482463U (mo) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54974U (mo) * | 1977-06-05 | 1979-01-06 | ||
| JPS541977A (en) * | 1977-06-05 | 1979-01-09 | Meiji Nat Kougiyou Kk | Device for firing discharge lamp with two illuminations |
| JPS57153457A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Semiconductor mounting apparatus |
| JP2009530826A (ja) * | 2006-03-17 | 2009-08-27 | インターナショナル レクティファイアー コーポレイション | 改良されたチップスケールパッケージ |
-
1971
- 1971-05-21 JP JP1971041296U patent/JPS482463U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54974U (mo) * | 1977-06-05 | 1979-01-06 | ||
| JPS541977A (en) * | 1977-06-05 | 1979-01-09 | Meiji Nat Kougiyou Kk | Device for firing discharge lamp with two illuminations |
| JPS57153457A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Semiconductor mounting apparatus |
| JP2009530826A (ja) * | 2006-03-17 | 2009-08-27 | インターナショナル レクティファイアー コーポレイション | 改良されたチップスケールパッケージ |