JPS4846867A - - Google Patents

Info

Publication number: JPS4846867A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP47102824A

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1971-10-15

Filing date

1972-10-16

Publication date

1973-07-04

1972-10-16 Application filed filed Critical

1973-07-04 Publication of JPS4846867A publication Critical patent/JPS4846867A/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Manufacturing Of Printed Wiring (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

JP47102824A 1971-10-15 1972-10-16 Pending JPS4846867A (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR7137163A FR2166417A5 (it)	1971-10-15	1971-10-15

Publications (1)

Publication Number	Publication Date
JPS4846867A true JPS4846867A (it)	1973-07-04

Family

ID=9084457

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP47102824A Pending JPS4846867A (it)	1971-10-15	1972-10-16

Country Status (6)

Country	Link
US (1)	US3859177A (it)
JP (1)	JPS4846867A (it)
DE (1)	DE2250031A1 (it)
FR (1)	FR2166417A5 (it)
GB (1)	GB1410509A (it)
IT (1)	IT972371B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5301420A (en) *	1993-07-06	1994-04-12	Motorola, Inc.	Method for manufacturing a light weight circuit module
DE19633449A1 (de) *	1996-08-20	1998-02-26	Univ Dresden Tech	Räumliche Gitternetzstruktur aus Funktionselementen und Verfahren zu deren Herstellung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR1537780A (fr) *	1967-07-04	1968-08-30	Csf	Nouveaux éléments de circuits magnétiques
FR1541719A (fr) *	1967-07-17	1968-10-11	Csf	éléments magnétiques intégrés à structure feuilletée
FR1601312A (it) *	1968-07-25	1970-08-17
FR1602464A (it) *	1968-12-10	1971-01-08
US3721612A (en) *	1969-11-07	1973-03-20	Thomson Csf	Method of making magnetic circuit elements

1971
- 1971-10-15 FR FR7137163A patent/FR2166417A5/fr not_active Expired
1972
- 1972-09-19 US US290357A patent/US3859177A/en not_active Expired - Lifetime
- 1972-10-12 GB GB4720472A patent/GB1410509A/en not_active Expired
- 1972-10-12 DE DE2250031A patent/DE2250031A1/de active Pending
- 1972-10-13 IT IT53371/72A patent/IT972371B/it active
- 1972-10-16 JP JP47102824A patent/JPS4846867A/ja active Pending

Also Published As

Publication number	Publication date
FR2166417A5 (it)	1973-08-17
DE2250031A1 (de)	1973-04-19
US3859177A (en)	1975-01-07
IT972371B (it)	1974-05-20
GB1410509A (en)	1975-10-15

Publication	Publication Date	Title
CS156532B2 (it)	1974-07-24
CS153120B1 (it)	1974-02-25
FR2114962A5 (it)	1972-06-30
CS176209B2 (it)	1977-06-30
FR2121501A1 (it)	1972-08-25
FR2121719A1 (it)	1972-08-25
CS168008B2 (it)	1976-05-28
FR2166417A5 (it)	1973-08-17
FR2124373B1 (it)	1974-08-02
FR2126547A5 (it)	1972-10-06
FR2124844A6 (it)	1972-09-22
FR2094903A5 (it)	1972-02-04
FR2125448A1 (it)	1972-09-29
DE2140669C3 (it)	1974-09-26
FR2121963A5 (it)	1972-08-25
FI51159B (it)	1976-08-02
AU454426B2 (it)	1974-10-31
FR2125712A5 (it)	1972-09-29
CS149166B1 (it)	1973-05-24
CS156745B1 (it)	1974-08-23
AU2399971A (it)	1972-07-06
CS149819B1 (it)	1973-08-23
CS149234B1 (it)	1973-05-24
FR2124125A1 (it)	1972-09-22
CS172962B2 (it)	1977-01-28