JPS4861337A - - Google Patents

Info

Publication number
JPS4861337A
JPS4861337A JP47114202A JP11420272A JPS4861337A JP S4861337 A JPS4861337 A JP S4861337A JP 47114202 A JP47114202 A JP 47114202A JP 11420272 A JP11420272 A JP 11420272A JP S4861337 A JPS4861337 A JP S4861337A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47114202A
Other languages
Japanese (ja)
Other versions
JPS568113B2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4861337A publication Critical patent/JPS4861337A/ja
Publication of JPS568113B2 publication Critical patent/JPS568113B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
JP11420272A 1971-11-15 1972-11-14 Expired JPS568113B2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19902871A 1971-11-15 1971-11-15
US19903671A 1971-11-15 1971-11-15

Publications (2)

Publication Number Publication Date
JPS4861337A true JPS4861337A (fr) 1973-08-28
JPS568113B2 JPS568113B2 (fr) 1981-02-21

Family

ID=26894390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11420272A Expired JPS568113B2 (fr) 1971-11-15 1972-11-14

Country Status (7)

Country Link
US (2) US3706634A (fr)
JP (1) JPS568113B2 (fr)
BE (1) BE791401A (fr)
CA (1) CA1009177A (fr)
DE (1) DE2255728C2 (fr)
FR (1) FR2160458B1 (fr)
GB (1) GB1370387A (fr)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
DE2333127C2 (de) * 1973-06-29 1982-04-15 Wabco Fahrzeugbremsen Gmbh, 3000 Hannover Blockierschutzregelsystem für druckmittelbetätigte Fahrzeugbremsen
FR2244708B1 (fr) * 1973-09-25 1977-08-12 Ugine Kuhlmann
US4193637A (en) * 1978-08-07 1980-03-18 The Robbins Company Rotary cutterhead for an earth boring machine
USRE31511E (en) 1978-08-07 1984-01-31 The Robbins Company Rotary cutterhead for an earth boring machine
US4197172A (en) * 1979-04-05 1980-04-08 American Chemical & Refining Company Incorporated Gold plating composition and method
US4265715A (en) * 1979-07-13 1981-05-05 Oxy Metal Industries Corporation Silver electrodeposition process
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
FR2538815B1 (fr) * 1983-01-03 1990-02-02 Omi Int Corp Procede pour former, par electrolyse, un revetement de cuivre sur un substrat, a partir d'un bain exempt de cyanure, et anode pour la mise en oeuvre de ce procede
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
US4935065A (en) * 1986-08-22 1990-06-19 Ecolab Inc. Phosphate-free alkaline detergent for cleaning-in-place of food processing equipment
US4904354A (en) * 1987-04-08 1990-02-27 Learonal Inc. Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
US5559035A (en) * 1992-08-24 1996-09-24 Umpqua Research Company Solid phase calibration standards
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
US5736256A (en) * 1995-05-31 1998-04-07 Howard A. Fromson Lithographic printing plate treated with organo-phosphonic acid chelating compounds and processes relating thereto
US5683568A (en) * 1996-03-29 1997-11-04 University Of Tulsa Electroplating bath for nickel-iron alloys and method
JP2943691B2 (ja) * 1996-04-25 1999-08-30 日本電気株式会社 プラズマ処理装置
US6921467B2 (en) 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
KR100695660B1 (ko) 1999-04-13 2007-03-19 세미툴 인코포레이티드 개선된 처리 유체 유동을 갖는 처리 챔버를 구비하는가공편 프로세서
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7102763B2 (en) 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
WO2003018874A2 (fr) 2001-08-31 2003-03-06 Semitool, Inc. Appareil et procedes de traitement electrochimique de pieces microelectroniques
US6974767B1 (en) * 2002-02-21 2005-12-13 Advanced Micro Devices, Inc. Chemical solution for electroplating a copper-zinc alloy thin film
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US20060076036A1 (en) * 2004-10-12 2006-04-13 Whitefield Bruce J Metal removal from solvent
RU2293144C2 (ru) * 2005-04-11 2007-02-10 Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" Электролит цинкования
RU2334830C2 (ru) * 2006-10-03 2008-09-27 Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" Способ приготовления фосфонатных электролитов и растворов
RU2334831C2 (ru) * 2006-10-31 2008-09-27 Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" Электролит меднения
EP1961840B1 (fr) * 2007-02-14 2009-12-30 Umicore Galvanotechnik GmbH Electrolyte de cuivre-étain et procédé pour le dépôt de couches de bronze
JP5554121B2 (ja) * 2010-03-31 2014-07-23 富士フイルム株式会社 研磨液及び研磨方法
DE102013021502A1 (de) * 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system
RU2762733C1 (ru) * 2021-02-18 2021-12-22 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Раствор для химического никелирования металлических изделий

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475293A (en) * 1964-09-22 1969-10-28 Monsanto Co Electrodeposition of metals

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1458492A (fr) * 1964-09-22 1966-03-04 Monsanto Co Compositions et procédé pour réactions électrochimiques notamment galvanoplastie ainsi qu'articles conformes à ceux obtenus
FR1539226A (fr) * 1966-09-16 1968-09-13 Procédé pour produire des dépôts d'or ou d'un alliage à base d'or
FR96342E (fr) * 1967-12-09 1972-06-16
DE1909144B2 (de) * 1969-02-20 1977-09-08 Schering Ag, 1000 Berlin Und 4619 Bergkamen Bad zur galvanischen abscheidung glaenzender goldlegierungsniederschlaege
CA965729A (en) * 1969-05-15 1975-04-08 Fred I. Nobel Cyanide free electroplating solutions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475293A (en) * 1964-09-22 1969-10-28 Monsanto Co Electrodeposition of metals

Also Published As

Publication number Publication date
US3706634A (en) 1972-12-19
US3706635A (en) 1972-12-19
DE2255728A1 (de) 1973-05-24
FR2160458A1 (fr) 1973-06-29
BE791401A (fr) 1973-05-14
GB1370387A (en) 1974-10-16
DE2255728C2 (de) 1982-07-01
FR2160458B1 (fr) 1975-01-03
JPS568113B2 (fr) 1981-02-21
CA1009177A (en) 1977-04-26

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