JPS4870489A - - Google Patents

Info

Publication number
JPS4870489A
JPS4870489A JP47122658A JP12265872A JPS4870489A JP S4870489 A JPS4870489 A JP S4870489A JP 47122658 A JP47122658 A JP 47122658A JP 12265872 A JP12265872 A JP 12265872A JP S4870489 A JPS4870489 A JP S4870489A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47122658A
Other languages
Japanese (ja)
Other versions
JPS5329437B2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4870489A publication Critical patent/JPS4870489A/ja
Publication of JPS5329437B2 publication Critical patent/JPS5329437B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP12265872A 1971-12-20 1972-12-08 Expired JPS5329437B2 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20984671A 1971-12-20 1971-12-20

Publications (2)

Publication Number Publication Date
JPS4870489A true JPS4870489A (2) 1973-09-25
JPS5329437B2 JPS5329437B2 (2) 1978-08-21

Family

ID=22780556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12265872A Expired JPS5329437B2 (2) 1971-12-20 1972-12-08

Country Status (5)

Country Link
US (1) US3751720A (2)
JP (1) JPS5329437B2 (2)
DE (1) DE2258483C2 (2)
FR (1) FR2211750A1 (2)
GB (1) GB1372129A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139284U (2) * 1977-04-07 1978-11-04

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4958210A (en) * 1976-07-06 1990-09-18 General Electric Company High voltage integrated circuits
US4575744A (en) * 1983-09-16 1986-03-11 International Business Machines Corporation Interconnection of elements on integrated circuit substrate
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
US4731643A (en) * 1985-10-21 1988-03-15 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2668184A (en) * 1952-02-15 1954-02-02 Gen Electric Multiple photocell structure
US3221215A (en) * 1962-01-30 1965-11-30 Nippon Electric Co Device comprising a plurality of electrical components
US3287610A (en) * 1965-03-30 1966-11-22 Bendix Corp Compatible package and transistor for high frequency operation "compact"
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
US3609294A (en) * 1969-10-10 1971-09-28 Ncr Co Thermal printing head with thin film printing elements
US3606679A (en) * 1969-10-29 1971-09-21 Fairchild Camera Instr Co Method for interconnecting solid state devices such as integrated circuit chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139284U (2) * 1977-04-07 1978-11-04

Also Published As

Publication number Publication date
GB1372129A (en) 1974-10-30
DE2258483C2 (de) 1983-10-27
FR2211750A1 (2) 1974-07-19
DE2258483A1 (de) 1973-07-05
JPS5329437B2 (2) 1978-08-21
US3751720A (en) 1973-08-07

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