JPS4875566U - - Google Patents
Info
- Publication number
- JPS4875566U JPS4875566U JP1971120449U JP12044971U JPS4875566U JP S4875566 U JPS4875566 U JP S4875566U JP 1971120449 U JP1971120449 U JP 1971120449U JP 12044971 U JP12044971 U JP 12044971U JP S4875566 U JPS4875566 U JP S4875566U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971120449U JPS4875566U (mo) | 1971-12-20 | 1971-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971120449U JPS4875566U (mo) | 1971-12-20 | 1971-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4875566U true JPS4875566U (mo) | 1973-09-19 |
Family
ID=28032348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971120449U Pending JPS4875566U (mo) | 1971-12-20 | 1971-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4875566U (mo) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54141564A (en) * | 1978-04-25 | 1979-11-02 | Nec Corp | Semiconductor device |
| JPS6095944A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
| JPS62244156A (ja) * | 1986-04-16 | 1987-10-24 | Ibiden Co Ltd | 表面実装用パツケ−ジ |
-
1971
- 1971-12-20 JP JP1971120449U patent/JPS4875566U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54141564A (en) * | 1978-04-25 | 1979-11-02 | Nec Corp | Semiconductor device |
| JPS6095944A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
| JPS62244156A (ja) * | 1986-04-16 | 1987-10-24 | Ibiden Co Ltd | 表面実装用パツケ−ジ |