JPS4885079A - - Google Patents

Info

Publication number
JPS4885079A
JPS4885079A JP48012828A JP1282873A JPS4885079A JP S4885079 A JPS4885079 A JP S4885079A JP 48012828 A JP48012828 A JP 48012828A JP 1282873 A JP1282873 A JP 1282873A JP S4885079 A JPS4885079 A JP S4885079A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48012828A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4885079A publication Critical patent/JPS4885079A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
JP48012828A 1972-01-31 1973-01-31 Pending JPS4885079A (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2204490A DE2204490A1 (de) 1972-01-31 1972-01-31 Halbleiterbauelement mit druckkontakt

Publications (1)

Publication Number Publication Date
JPS4885079A true JPS4885079A (cs) 1973-11-12

Family

ID=5834583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48012828A Pending JPS4885079A (cs) 1972-01-31 1973-01-31

Country Status (7)

Country Link
JP (1) JPS4885079A (cs)
CH (1) CH541869A (cs)
DE (1) DE2204490A1 (cs)
FR (1) FR2169819B1 (cs)
GB (1) GB1397430A (cs)
IT (1) IT972620B (cs)
NL (1) NL7217019A (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (de) * 1977-06-16 1979-01-04 Nippon Electric Co Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
JPS5871633A (ja) * 1981-10-23 1983-04-28 Toshiba Corp 圧接型半導体装置
DE10330053A1 (de) * 2003-07-03 2005-02-10 Infineon Technologies Ag Halbleiterbauelement mit einem Druckkontakt und Ronde für einen Druckkontakt eines Halbleiterbauelements
DE102004059389B4 (de) * 2004-12-09 2012-02-23 Infineon Technologies Ag Halbleiterbauelement mit Ausgleichsmetallisierung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (cs) * 1965-01-02 1966-02-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (cs) * 1965-01-02 1966-02-23

Also Published As

Publication number Publication date
IT972620B (it) 1974-05-31
CH541869A (de) 1973-09-15
GB1397430A (en) 1975-06-11
FR2169819A1 (cs) 1973-09-14
NL7217019A (cs) 1973-08-02
DE2204490A1 (de) 1973-08-09
FR2169819B1 (cs) 1977-12-30

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