JPS4896075A - - Google Patents

Info

Publication number
JPS4896075A
JPS4896075A JP47028271A JP2827172A JPS4896075A JP S4896075 A JPS4896075 A JP S4896075A JP 47028271 A JP47028271 A JP 47028271A JP 2827172 A JP2827172 A JP 2827172A JP S4896075 A JPS4896075 A JP S4896075A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47028271A
Other languages
Japanese (ja)
Other versions
JPS5113614B2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47028271A priority Critical patent/JPS5113614B2/ja
Publication of JPS4896075A publication Critical patent/JPS4896075A/ja
Publication of JPS5113614B2 publication Critical patent/JPS5113614B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Weting (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP47028271A 1972-03-21 1972-03-21 Expired JPS5113614B2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47028271A JPS5113614B2 (2) 1972-03-21 1972-03-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47028271A JPS5113614B2 (2) 1972-03-21 1972-03-21

Publications (2)

Publication Number Publication Date
JPS4896075A true JPS4896075A (2) 1973-12-08
JPS5113614B2 JPS5113614B2 (2) 1976-05-01

Family

ID=12243905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47028271A Expired JPS5113614B2 (2) 1972-03-21 1972-03-21

Country Status (1)

Country Link
JP (1) JPS5113614B2 (2)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910672A (2) * 1972-05-24 1974-01-30
JPS5052980A (2) * 1973-09-10 1975-05-10
JP2003037237A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037234A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037235A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003051574A (ja) * 2001-08-07 2003-02-21 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2009054690A (ja) * 2007-08-24 2009-03-12 Denso Corp リードフレーム構造体
JP2016021515A (ja) * 2014-07-15 2016-02-04 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP2017168691A (ja) * 2016-03-16 2017-09-21 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3046192U (ja) * 1997-08-11 1998-02-24 株式会社金子製作所 コンクリート製品用の鉄筋構造

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910672A (2) * 1972-05-24 1974-01-30
JPS5052980A (2) * 1973-09-10 1975-05-10
JP2003037237A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037234A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037235A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003051574A (ja) * 2001-08-07 2003-02-21 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2009054690A (ja) * 2007-08-24 2009-03-12 Denso Corp リードフレーム構造体
JP2016021515A (ja) * 2014-07-15 2016-02-04 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP2017168691A (ja) * 2016-03-16 2017-09-21 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法

Also Published As

Publication number Publication date
JPS5113614B2 (2) 1976-05-01

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