JPS4910465U - - Google Patents

Info

Publication number
JPS4910465U
JPS4910465U JP1972050532U JP5053272U JPS4910465U JP S4910465 U JPS4910465 U JP S4910465U JP 1972050532 U JP1972050532 U JP 1972050532U JP 5053272 U JP5053272 U JP 5053272U JP S4910465 U JPS4910465 U JP S4910465U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972050532U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972050532U priority Critical patent/JPS4910465U/ja
Publication of JPS4910465U publication Critical patent/JPS4910465U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1972050532U 1972-04-29 1972-04-29 Pending JPS4910465U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972050532U JPS4910465U (2) 1972-04-29 1972-04-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972050532U JPS4910465U (2) 1972-04-29 1972-04-29

Publications (1)

Publication Number Publication Date
JPS4910465U true JPS4910465U (2) 1974-01-29

Family

ID=27930529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972050532U Pending JPS4910465U (2) 1972-04-29 1972-04-29

Country Status (1)

Country Link
JP (1) JPS4910465U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148515A (ja) * 1999-11-22 2001-05-29 Sharp Corp 発光装置、その製造方法、及び発光装置を搭載した電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148515A (ja) * 1999-11-22 2001-05-29 Sharp Corp 発光装置、その製造方法、及び発光装置を搭載した電子機器

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