JPS49116594A - - Google Patents
Info
- Publication number
- JPS49116594A JPS49116594A JP48030312A JP3031273A JPS49116594A JP S49116594 A JPS49116594 A JP S49116594A JP 48030312 A JP48030312 A JP 48030312A JP 3031273 A JP3031273 A JP 3031273A JP S49116594 A JPS49116594 A JP S49116594A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Non-Adjustable Resistors (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48030312A JPS49116594A (cs) | 1973-03-14 | 1973-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48030312A JPS49116594A (cs) | 1973-03-14 | 1973-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49116594A true JPS49116594A (cs) | 1974-11-07 |
Family
ID=12300253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48030312A Pending JPS49116594A (cs) | 1973-03-14 | 1973-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49116594A (cs) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51146538A (en) * | 1975-06-11 | 1976-12-16 | Hitachi Ltd | An electroconductive adhesive material |
| JPS5868803A (ja) * | 1981-10-21 | 1983-04-23 | ティーディーケイ株式会社 | 導電性ペ−スト組成物 |
| JPS5873904A (ja) * | 1981-08-03 | 1983-05-04 | ジヨンソン・マシ−・インコ−ポレ−テツド | 銀充填ガラス |
| JPS5879837A (ja) * | 1981-10-31 | 1983-05-13 | Tdk Corp | 磁器コンデンサ |
| JPS5967241A (ja) * | 1982-10-08 | 1984-04-16 | Kureha Chem Ind Co Ltd | 魚油中のエイコサペンタエン酸の濃縮方法 |
| JPH02106954A (ja) * | 1988-10-17 | 1990-04-19 | Semiconductor Energy Lab Co Ltd | 電子装置 |
| WO2006062208A1 (ja) * | 2004-12-09 | 2006-06-15 | Asahi Co., Ltd | 成型金型の補修方法、耐熱性無機接着剤、成型金型及び成型製品 |
| JP4726803B2 (ja) * | 2004-12-09 | 2011-07-20 | 株式会社 旭 | 成型金型の補修方法、成型金型及び成型製品 |
| JP2014012840A (ja) * | 2013-07-16 | 2014-01-23 | Univ Of Tokyo | 接着材組成物 |
-
1973
- 1973-03-14 JP JP48030312A patent/JPS49116594A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51146538A (en) * | 1975-06-11 | 1976-12-16 | Hitachi Ltd | An electroconductive adhesive material |
| JPS5873904A (ja) * | 1981-08-03 | 1983-05-04 | ジヨンソン・マシ−・インコ−ポレ−テツド | 銀充填ガラス |
| JPS5868803A (ja) * | 1981-10-21 | 1983-04-23 | ティーディーケイ株式会社 | 導電性ペ−スト組成物 |
| JPS5879837A (ja) * | 1981-10-31 | 1983-05-13 | Tdk Corp | 磁器コンデンサ |
| JPS5967241A (ja) * | 1982-10-08 | 1984-04-16 | Kureha Chem Ind Co Ltd | 魚油中のエイコサペンタエン酸の濃縮方法 |
| JPH02106954A (ja) * | 1988-10-17 | 1990-04-19 | Semiconductor Energy Lab Co Ltd | 電子装置 |
| WO2006062208A1 (ja) * | 2004-12-09 | 2006-06-15 | Asahi Co., Ltd | 成型金型の補修方法、耐熱性無機接着剤、成型金型及び成型製品 |
| JP4726803B2 (ja) * | 2004-12-09 | 2011-07-20 | 株式会社 旭 | 成型金型の補修方法、成型金型及び成型製品 |
| JP2014012840A (ja) * | 2013-07-16 | 2014-01-23 | Univ Of Tokyo | 接着材組成物 |