JPS4916862A - - Google Patents
Info
- Publication number
- JPS4916862A JPS4916862A JP5862972A JP5862972A JPS4916862A JP S4916862 A JPS4916862 A JP S4916862A JP 5862972 A JP5862972 A JP 5862972A JP 5862972 A JP5862972 A JP 5862972A JP S4916862 A JPS4916862 A JP S4916862A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5862972A JPS4916862A (2) | 1972-06-14 | 1972-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5862972A JPS4916862A (2) | 1972-06-14 | 1972-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4916862A true JPS4916862A (2) | 1974-02-14 |
Family
ID=13089863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5862972A Pending JPS4916862A (2) | 1972-06-14 | 1972-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4916862A (2) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54121250U (2) * | 1978-02-15 | 1979-08-24 | ||
| US4618683A (en) * | 1982-06-01 | 1986-10-21 | Abbott Laboratories | Tetrahydro-6,7-dimethoxy-1H-benz[e]isoinodolines useful in the treatment of hypertension and as sedatives |
| US5318967A (en) * | 1991-12-20 | 1994-06-07 | Hoffmann-La Roche Inc. | 2,3,3a,4,5,9b-hexahydro-1H-benzo[e]indole derivatives |
-
1972
- 1972-06-14 JP JP5862972A patent/JPS4916862A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54121250U (2) * | 1978-02-15 | 1979-08-24 | ||
| US4618683A (en) * | 1982-06-01 | 1986-10-21 | Abbott Laboratories | Tetrahydro-6,7-dimethoxy-1H-benz[e]isoinodolines useful in the treatment of hypertension and as sedatives |
| US5318967A (en) * | 1991-12-20 | 1994-06-07 | Hoffmann-La Roche Inc. | 2,3,3a,4,5,9b-hexahydro-1H-benzo[e]indole derivatives |