JPS4917677A - - Google Patents

Info

Publication number
JPS4917677A
JPS4917677A JP47055074A JP5507472A JPS4917677A JP S4917677 A JPS4917677 A JP S4917677A JP 47055074 A JP47055074 A JP 47055074A JP 5507472 A JP5507472 A JP 5507472A JP S4917677 A JPS4917677 A JP S4917677A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47055074A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47055074A priority Critical patent/JPS4917677A/ja
Publication of JPS4917677A publication Critical patent/JPS4917677A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP47055074A 1972-06-05 1972-06-05 Pending JPS4917677A (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47055074A JPS4917677A (de) 1972-06-05 1972-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47055074A JPS4917677A (de) 1972-06-05 1972-06-05

Publications (1)

Publication Number Publication Date
JPS4917677A true JPS4917677A (de) 1974-02-16

Family

ID=12988534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47055074A Pending JPS4917677A (de) 1972-06-05 1972-06-05

Country Status (1)

Country Link
JP (1) JPS4917677A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245719A (ja) * 1985-08-23 1987-02-27 アクゾ・ナ−ムロ−ゼ・フエンノ−トシヤツプ 芳香族ポリアミドの混合物からなる繊維
JPS62239597A (ja) * 1986-04-11 1987-10-20 オ−ケ−プリント配線株式会社 電子部品取付板
US7307077B2 (en) 2001-04-27 2007-12-11 Zenyaku Kogyo Kabushiki Kaisha Heterocyclic compound and antitumor agent containing the same as effective ingredient

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245719A (ja) * 1985-08-23 1987-02-27 アクゾ・ナ−ムロ−ゼ・フエンノ−トシヤツプ 芳香族ポリアミドの混合物からなる繊維
JPS62239597A (ja) * 1986-04-11 1987-10-20 オ−ケ−プリント配線株式会社 電子部品取付板
US7307077B2 (en) 2001-04-27 2007-12-11 Zenyaku Kogyo Kabushiki Kaisha Heterocyclic compound and antitumor agent containing the same as effective ingredient

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