JPS4919023B1 - - Google Patents

Info

Publication number
JPS4919023B1
JPS4919023B1 JP45124591A JP12459170A JPS4919023B1 JP S4919023 B1 JPS4919023 B1 JP S4919023B1 JP 45124591 A JP45124591 A JP 45124591A JP 12459170 A JP12459170 A JP 12459170A JP S4919023 B1 JPS4919023 B1 JP S4919023B1
Authority
JP
Japan
Prior art keywords
areas
pad
mounting
substrate
folded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45124591A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4919023B1 publication Critical patent/JPS4919023B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP45124591A 1970-01-02 1970-12-29 Pending JPS4919023B1 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35970A 1970-01-02 1970-01-02

Publications (1)

Publication Number Publication Date
JPS4919023B1 true JPS4919023B1 (2) 1974-05-14

Family

ID=21691183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45124591A Pending JPS4919023B1 (2) 1970-01-02 1970-12-29

Country Status (4)

Country Link
JP (1) JPS4919023B1 (2)
CH (1) CH540567A (2)
DE (1) DE2064856A1 (2)
GB (1) GB1337791A (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
AT398254B (de) * 1982-08-10 1994-11-25 Dowty Electronic Components Chipträger sowie anordnung von solchen chipträgern
DE102005044001B3 (de) * 2005-09-14 2007-04-12 W.C. Heraeus Gmbh Laminiertes Substrat für die Montage von elektronischen Bauteilen

Also Published As

Publication number Publication date
CH540567A (de) 1973-08-15
GB1337791A (en) 1973-11-21
DE2064856A1 (de) 1971-07-08

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