JPS4919785A - - Google Patents
Info
- Publication number
- JPS4919785A JPS4919785A JP2058172A JP2058172A JPS4919785A JP S4919785 A JPS4919785 A JP S4919785A JP 2058172 A JP2058172 A JP 2058172A JP 2058172 A JP2058172 A JP 2058172A JP S4919785 A JPS4919785 A JP S4919785A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2058172A JPS4919785A (ja) | 1972-03-01 | 1972-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2058172A JPS4919785A (ja) | 1972-03-01 | 1972-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4919785A true JPS4919785A (ja) | 1974-02-21 |
Family
ID=12031166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2058172A Pending JPS4919785A (ja) | 1972-03-01 | 1972-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4919785A (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5156784A (en) * | 1974-11-14 | 1976-05-18 | Kenkichi Tsukamoto | Kendakuekichuno kendakutaino gyoshuseigyoho |
| JPS524480A (en) * | 1975-06-30 | 1977-01-13 | Ebara Infilco Co Ltd | Membrane separating process |
| JPS53104772A (en) * | 1977-02-19 | 1978-09-12 | Satoron Fuuzu Yuugen | Controlling of food flavor |
| JPS53157140U (ja) * | 1977-05-16 | 1978-12-09 | ||
| JPS5427259A (en) * | 1977-08-02 | 1979-03-01 | Tdk Electronics Co Ltd | Method of treating waste water |
| JPH0738148A (ja) * | 1993-07-19 | 1995-02-07 | Hitachi Cable Ltd | 化合物半導体光素子、発光ダイオード及び発光ダイオードの製造方法 |
| JPH11163417A (ja) * | 1997-09-26 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
-
1972
- 1972-03-01 JP JP2058172A patent/JPS4919785A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5156784A (en) * | 1974-11-14 | 1976-05-18 | Kenkichi Tsukamoto | Kendakuekichuno kendakutaino gyoshuseigyoho |
| JPS524480A (en) * | 1975-06-30 | 1977-01-13 | Ebara Infilco Co Ltd | Membrane separating process |
| JPS53104772A (en) * | 1977-02-19 | 1978-09-12 | Satoron Fuuzu Yuugen | Controlling of food flavor |
| JPS53157140U (ja) * | 1977-05-16 | 1978-12-09 | ||
| JPS5427259A (en) * | 1977-08-02 | 1979-03-01 | Tdk Electronics Co Ltd | Method of treating waste water |
| JPH0738148A (ja) * | 1993-07-19 | 1995-02-07 | Hitachi Cable Ltd | 化合物半導体光素子、発光ダイオード及び発光ダイオードの製造方法 |
| JPH11163417A (ja) * | 1997-09-26 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 発光ダイオード |