JPS4919991B1 - - Google Patents

Info

Publication number
JPS4919991B1
JPS4919991B1 JP45080963A JP8096370A JPS4919991B1 JP S4919991 B1 JPS4919991 B1 JP S4919991B1 JP 45080963 A JP45080963 A JP 45080963A JP 8096370 A JP8096370 A JP 8096370A JP S4919991 B1 JPS4919991 B1 JP S4919991B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45080963A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4919991B1 publication Critical patent/JPS4919991B1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21G—MAKING NEEDLES, PINS OR NAILS OF METAL
    • B21G1/00—Making needles used for performing operations
    • B21G1/006—Special treatments of pins or needles, e.g. annealing, straightening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP45080963A 1969-09-18 1970-09-17 Pending JPS4919991B1 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85913369A 1969-09-18 1969-09-18

Publications (1)

Publication Number Publication Date
JPS4919991B1 true JPS4919991B1 (2) 1974-05-21

Family

ID=25330131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45080963A Pending JPS4919991B1 (2) 1969-09-18 1970-09-17

Country Status (2)

Country Link
JP (1) JPS4919991B1 (2)
DE (2) DE7034755U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6291998U (2) * 1985-12-02 1987-06-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6291998U (2) * 1985-12-02 1987-06-12

Also Published As

Publication number Publication date
DE7034755U (de) 1972-04-20
DE7144271U (de) 1972-04-20

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