JPS492790B1 - - Google Patents

Info

Publication number
JPS492790B1
JPS492790B1 JP44035453A JP3545369A JPS492790B1 JP S492790 B1 JPS492790 B1 JP S492790B1 JP 44035453 A JP44035453 A JP 44035453A JP 3545369 A JP3545369 A JP 3545369A JP S492790 B1 JPS492790 B1 JP S492790B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44035453A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP44035453A priority Critical patent/JPS492790B1/ja
Publication of JPS492790B1 publication Critical patent/JPS492790B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP44035453A 1969-05-07 1969-05-07 Pending JPS492790B1 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP44035453A JPS492790B1 (2) 1969-05-07 1969-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44035453A JPS492790B1 (2) 1969-05-07 1969-05-07

Publications (1)

Publication Number Publication Date
JPS492790B1 true JPS492790B1 (2) 1974-01-22

Family

ID=12442210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44035453A Pending JPS492790B1 (2) 1969-05-07 1969-05-07

Country Status (1)

Country Link
JP (1) JPS492790B1 (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108761U (ja) * 1983-01-10 1984-07-21 小沢 正樹 テ−プカツタ−
JPS6053755U (ja) * 1983-09-20 1985-04-16 前田 光 折返し付粘着テ−プカッタ−
JPS6447738U (2) * 1987-09-18 1989-03-24

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108761U (ja) * 1983-01-10 1984-07-21 小沢 正樹 テ−プカツタ−
JPS6053755U (ja) * 1983-09-20 1985-04-16 前田 光 折返し付粘着テ−プカッタ−
JPS6447738U (2) * 1987-09-18 1989-03-24

Similar Documents

Publication Publication Date Title
AU465452B2 (2)
AU429630B2 (2)
AU450150B2 (2)
AU442375B2 (2)
AU2355770A (2)
JPS492790B1 (2)
AU470301B1 (2)
AU427401B2 (2)
AU438128B2 (2)
AU442380B2 (2)
AU470661B1 (2)
AU442554B2 (2)
AU410358B2 (2)
AU414607B2 (2)
AU417208B2 (2)
AT308690B (2)
AU425297B2 (2)
AU442535B2 (2)
AU428074B2 (2)
AU442463B2 (2)
AU442357B2 (2)
AU442538B2 (2)
AU442322B2 (2)
AU442285B2 (2)
AU5598769A (2)