JPS4939377A - - Google Patents
Info
- Publication number
- JPS4939377A JPS4939377A JP47080571A JP8057172A JPS4939377A JP S4939377 A JPS4939377 A JP S4939377A JP 47080571 A JP47080571 A JP 47080571A JP 8057172 A JP8057172 A JP 8057172A JP S4939377 A JPS4939377 A JP S4939377A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47080571A JPS4939377A (ja) | 1972-08-11 | 1972-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47080571A JPS4939377A (ja) | 1972-08-11 | 1972-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4939377A true JPS4939377A (ja) | 1974-04-12 |
Family
ID=13722008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47080571A Pending JPS4939377A (ja) | 1972-08-11 | 1972-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4939377A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166879A (ja) * | 1987-12-23 | 1989-06-30 | Hitachi Ltd | 溶湯急冷設備の注湯制御装置 |
-
1972
- 1972-08-11 JP JP47080571A patent/JPS4939377A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166879A (ja) * | 1987-12-23 | 1989-06-30 | Hitachi Ltd | 溶湯急冷設備の注湯制御装置 |