JPS495597B1 - - Google Patents
Info
- Publication number
- JPS495597B1 JPS495597B1 JP44082769A JP8276969A JPS495597B1 JP S495597 B1 JPS495597 B1 JP S495597B1 JP 44082769 A JP44082769 A JP 44082769A JP 8276969 A JP8276969 A JP 8276969A JP S495597 B1 JPS495597 B1 JP S495597B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44082769A JPS495597B1 (2) | 1969-10-17 | 1969-10-17 | |
| US81464A US3663868A (en) | 1969-10-17 | 1970-10-16 | Hermetically sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44082769A JPS495597B1 (2) | 1969-10-17 | 1969-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS495597B1 true JPS495597B1 (2) | 1974-02-07 |
Family
ID=13783627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP44082769A Pending JPS495597B1 (2) | 1969-10-17 | 1969-10-17 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3663868A (2) |
| JP (1) | JPS495597B1 (2) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5523531U (2) * | 1978-07-28 | 1980-02-15 | ||
| JPS57105901A (en) * | 1980-12-24 | 1982-07-01 | Masahiro Kagaya | Shade for illuminator of which cloth and paper functioning as pattern are exchanged |
| JPS637695U (2) * | 1986-06-28 | 1988-01-19 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916434A (en) * | 1972-11-30 | 1975-10-28 | Power Hybrids Inc | Hermetically sealed encapsulation of semiconductor devices |
| US3898594A (en) * | 1973-11-02 | 1975-08-05 | Trw Inc | Microwave semiconductor device package |
| US4262300A (en) * | 1978-11-03 | 1981-04-14 | Isotronics, Inc. | Microcircuit package formed of multi-components |
| JPS5875859A (ja) * | 1981-10-30 | 1983-05-07 | Fujitsu Ltd | 半導体装置 |
| EP0131004A1 (en) * | 1982-12-24 | 1985-01-16 | Plessey Overseas Limited | Microwave packages |
| US4639631A (en) * | 1985-07-01 | 1987-01-27 | Motorola, Inc. | Electrostatically sealed piezoelectric device |
| US5126827A (en) * | 1991-01-17 | 1992-06-30 | Avantek, Inc. | Semiconductor chip header having particular surface metallization |
| US5360992A (en) * | 1991-12-20 | 1994-11-01 | Micron Technology, Inc. | Two piece assembly for the selection of pinouts and bond options on a semiconductor device |
| US5463250A (en) * | 1994-04-29 | 1995-10-31 | Westinghouse Electric Corp. | Semiconductor component package |
| EP0764393B1 (en) * | 1995-03-02 | 2001-07-04 | Circuit Components, Incorporated | A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| US6114770A (en) * | 1998-07-22 | 2000-09-05 | Micron Technology, Inc. | Low profile semiconductor package |
| WO2000042636A2 (en) * | 1999-01-12 | 2000-07-20 | Teledyne Technologies Incorporated | Micromachined device and method of forming the micromachined device |
| KR101243691B1 (ko) * | 2004-10-22 | 2013-03-14 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 열싱크가 향상된 반도체 발광 장치 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB785971A (en) * | 1956-05-09 | 1957-11-06 | Standard Telephones Cables Ltd | Improvements in or relating to the mounting of electronic circuit components |
| US3202888A (en) * | 1962-02-09 | 1965-08-24 | Hughes Aircraft Co | Micro-miniature semiconductor devices |
| US3303265A (en) * | 1962-05-17 | 1967-02-07 | Texas Instruments Inc | Miniature semiconductor enclosure |
| US3195026A (en) * | 1962-09-21 | 1965-07-13 | Westinghouse Electric Corp | Hermetically enclosed semiconductor device |
| US3234320A (en) * | 1963-06-11 | 1966-02-08 | United Carr Inc | Integrated circuit package |
| US3478161A (en) * | 1968-03-13 | 1969-11-11 | Rca Corp | Strip-line power transistor package |
-
1969
- 1969-10-17 JP JP44082769A patent/JPS495597B1/ja active Pending
-
1970
- 1970-10-16 US US81464A patent/US3663868A/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5523531U (2) * | 1978-07-28 | 1980-02-15 | ||
| JPS57105901A (en) * | 1980-12-24 | 1982-07-01 | Masahiro Kagaya | Shade for illuminator of which cloth and paper functioning as pattern are exchanged |
| JPS637695U (2) * | 1986-06-28 | 1988-01-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| US3663868A (en) | 1972-05-16 |