JPS4963846U - - Google Patents
Info
- Publication number
- JPS4963846U JPS4963846U JP1972107622U JP10762272U JPS4963846U JP S4963846 U JPS4963846 U JP S4963846U JP 1972107622 U JP1972107622 U JP 1972107622U JP 10762272 U JP10762272 U JP 10762272U JP S4963846 U JPS4963846 U JP S4963846U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972107622U JPS4963846U (2) | 1972-09-18 | 1972-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972107622U JPS4963846U (2) | 1972-09-18 | 1972-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4963846U true JPS4963846U (2) | 1974-06-04 |
Family
ID=28325774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972107622U Pending JPS4963846U (2) | 1972-09-18 | 1972-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4963846U (2) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4327731Y1 (2) * | 1966-01-06 | 1968-11-15 |
-
1972
- 1972-09-18 JP JP1972107622U patent/JPS4963846U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4327731Y1 (2) * | 1966-01-06 | 1968-11-15 |