JPS496880A - - Google Patents

Info

Publication number
JPS496880A
JPS496880A JP48031551A JP3155173A JPS496880A JP S496880 A JPS496880 A JP S496880A JP 48031551 A JP48031551 A JP 48031551A JP 3155173 A JP3155173 A JP 3155173A JP S496880 A JPS496880 A JP S496880A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48031551A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS496880A publication Critical patent/JPS496880A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/15Containers comprising an insulating or insulated base
    • H10W76/153Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
JP48031551A 1972-03-22 1973-03-20 Pending JPS496880A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2213915A DE2213915A1 (de) 1972-03-22 1972-03-22 Gehaeuse fuer halbleitersysteme

Publications (1)

Publication Number Publication Date
JPS496880A true JPS496880A (de) 1974-01-22

Family

ID=5839779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48031551A Pending JPS496880A (de) 1972-03-22 1973-03-20

Country Status (9)

Country Link
JP (1) JPS496880A (de)
AT (1) AT327989B (de)
CA (1) CA979122A (de)
CH (1) CH548109A (de)
DE (1) DE2213915A1 (de)
FR (1) FR2176661B1 (de)
GB (1) GB1397330A (de)
IT (1) IT982542B (de)
NL (1) NL7302989A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages

Also Published As

Publication number Publication date
CH548109A (de) 1974-04-11
CA979122A (en) 1975-12-02
AT327989B (de) 1976-02-25
FR2176661A1 (de) 1973-11-02
IT982542B (it) 1974-10-21
FR2176661B1 (de) 1977-12-30
DE2213915A1 (de) 1973-10-04
ATA1012972A (de) 1975-05-15
NL7302989A (de) 1973-09-25
GB1397330A (en) 1975-06-11

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