JPS4980973A - - Google Patents

Info

Publication number
JPS4980973A
JPS4980973A JP48082596A JP8259673A JPS4980973A JP S4980973 A JPS4980973 A JP S4980973A JP 48082596 A JP48082596 A JP 48082596A JP 8259673 A JP8259673 A JP 8259673A JP S4980973 A JPS4980973 A JP S4980973A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48082596A
Other languages
Japanese (ja)
Other versions
JPS5734647B2 (it
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4980973A publication Critical patent/JPS4980973A/ja
Publication of JPS5734647B2 publication Critical patent/JPS5734647B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP8259673A 1972-07-21 1973-07-20 Expired JPS5734647B2 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2235749A DE2235749C3 (de) 1972-07-21 1972-07-21 Verfahren zum Herstellen eines Leitbahnenmusters

Publications (2)

Publication Number Publication Date
JPS4980973A true JPS4980973A (it) 1974-08-05
JPS5734647B2 JPS5734647B2 (it) 1982-07-24

Family

ID=5851230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8259673A Expired JPS5734647B2 (it) 1972-07-21 1973-07-20

Country Status (6)

Country Link
JP (1) JPS5734647B2 (it)
AU (1) AU5795273A (it)
DE (1) DE2235749C3 (it)
FR (1) FR2194046B1 (it)
GB (1) GB1411864A (it)
IT (1) IT991124B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153122A (ja) * 1984-01-20 1985-08-12 Matsushita Electronics Corp 半導体装置の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
JPS55163860A (en) * 1979-06-06 1980-12-20 Toshiba Corp Manufacture of semiconductor device
DE3109801A1 (de) * 1981-03-13 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbauelementen
CN107068546B (zh) * 2015-11-06 2022-05-24 马维尔以色列(M.I.S.L.)有限公司 生产用于多功能产品的半导体晶片的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153122A (ja) * 1984-01-20 1985-08-12 Matsushita Electronics Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
AU5795273A (en) 1975-01-16
DE2235749B2 (de) 1978-12-14
GB1411864A (en) 1975-10-29
FR2194046B1 (it) 1977-02-18
JPS5734647B2 (it) 1982-07-24
FR2194046A1 (it) 1974-02-22
DE2235749C3 (de) 1979-09-20
IT991124B (it) 1975-07-30
DE2235749A1 (de) 1974-01-31

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