JPS4985961A - - Google Patents
Info
- Publication number
- JPS4985961A JPS4985961A JP47128234A JP12823472A JPS4985961A JP S4985961 A JPS4985961 A JP S4985961A JP 47128234 A JP47128234 A JP 47128234A JP 12823472 A JP12823472 A JP 12823472A JP S4985961 A JPS4985961 A JP S4985961A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47128234A JPS4985961A (mo) | 1972-12-22 | 1972-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47128234A JPS4985961A (mo) | 1972-12-22 | 1972-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4985961A true JPS4985961A (mo) | 1974-08-17 |
Family
ID=14979796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47128234A Pending JPS4985961A (mo) | 1972-12-22 | 1972-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4985961A (mo) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51154156U (mo) * | 1975-06-02 | 1976-12-08 | ||
| JPS52130670U (mo) * | 1976-03-31 | 1977-10-04 | ||
| JPS52119072A (en) * | 1976-03-31 | 1977-10-06 | Mitsubishi Electric Corp | Manufacture of resin-sealing semiconductor device |
| JPS5393781A (en) * | 1977-01-27 | 1978-08-17 | Toshiba Corp | Semiconductor device |
| JPS576251U (mo) * | 1980-06-11 | 1982-01-13 | ||
| JPS59191742U (ja) * | 1983-06-06 | 1984-12-19 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
| JPH01153647U (mo) * | 1988-04-05 | 1989-10-23 | ||
| JPH01276655A (ja) * | 1988-04-27 | 1989-11-07 | Japan Radio Co Ltd | トランスファーモールド型集積回路 |
-
1972
- 1972-12-22 JP JP47128234A patent/JPS4985961A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51154156U (mo) * | 1975-06-02 | 1976-12-08 | ||
| JPS52130670U (mo) * | 1976-03-31 | 1977-10-04 | ||
| JPS52119072A (en) * | 1976-03-31 | 1977-10-06 | Mitsubishi Electric Corp | Manufacture of resin-sealing semiconductor device |
| JPS5393781A (en) * | 1977-01-27 | 1978-08-17 | Toshiba Corp | Semiconductor device |
| JPS576251U (mo) * | 1980-06-11 | 1982-01-13 | ||
| JPS59191742U (ja) * | 1983-06-06 | 1984-12-19 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
| JPH01153647U (mo) * | 1988-04-05 | 1989-10-23 | ||
| JPH01276655A (ja) * | 1988-04-27 | 1989-11-07 | Japan Radio Co Ltd | トランスファーモールド型集積回路 |