JPS498760A - - Google Patents

Info

Publication number
JPS498760A
JPS498760A JP5072672A JP5072672A JPS498760A JP S498760 A JPS498760 A JP S498760A JP 5072672 A JP5072672 A JP 5072672A JP 5072672 A JP5072672 A JP 5072672A JP S498760 A JPS498760 A JP S498760A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5072672A
Other languages
Japanese (ja)
Other versions
JPS5237586B2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5072672A priority Critical patent/JPS5237586B2/ja
Publication of JPS498760A publication Critical patent/JPS498760A/ja
Publication of JPS5237586B2 publication Critical patent/JPS5237586B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP5072672A 1972-05-24 1972-05-24 Expired JPS5237586B2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5072672A JPS5237586B2 (cs) 1972-05-24 1972-05-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5072672A JPS5237586B2 (cs) 1972-05-24 1972-05-24

Publications (2)

Publication Number Publication Date
JPS498760A true JPS498760A (cs) 1974-01-25
JPS5237586B2 JPS5237586B2 (cs) 1977-09-22

Family

ID=12866852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5072672A Expired JPS5237586B2 (cs) 1972-05-24 1972-05-24

Country Status (1)

Country Link
JP (1) JPS5237586B2 (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145762A (en) * 1974-10-18 1976-04-19 Matsushita Electric Industrial Co Ltd Insatsudenkyokuhimaku
JPS54105772A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming electrode of thin film circuit
JPS57168235U (cs) * 1981-04-20 1982-10-23
JPS5858675U (ja) * 1982-07-08 1983-04-20 富士通株式会社 マルチ券発売機
JPS6316444U (cs) * 1986-07-18 1988-02-03

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145762A (en) * 1974-10-18 1976-04-19 Matsushita Electric Industrial Co Ltd Insatsudenkyokuhimaku
JPS54105772A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming electrode of thin film circuit
JPS57168235U (cs) * 1981-04-20 1982-10-23
JPS5858675U (ja) * 1982-07-08 1983-04-20 富士通株式会社 マルチ券発売機
JPS6316444U (cs) * 1986-07-18 1988-02-03

Also Published As

Publication number Publication date
JPS5237586B2 (cs) 1977-09-22

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