JPS50107462A - - Google Patents

Info

Publication number
JPS50107462A
JPS50107462A JP49011787A JP1178774A JPS50107462A JP S50107462 A JPS50107462 A JP S50107462A JP 49011787 A JP49011787 A JP 49011787A JP 1178774 A JP1178774 A JP 1178774A JP S50107462 A JPS50107462 A JP S50107462A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49011787A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49011787A priority Critical patent/JPS50107462A/ja
Publication of JPS50107462A publication Critical patent/JPS50107462A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP49011787A 1974-01-30 1974-01-30 Pending JPS50107462A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49011787A JPS50107462A (fr) 1974-01-30 1974-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49011787A JPS50107462A (fr) 1974-01-30 1974-01-30

Publications (1)

Publication Number Publication Date
JPS50107462A true JPS50107462A (fr) 1975-08-23

Family

ID=11787629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49011787A Pending JPS50107462A (fr) 1974-01-30 1974-01-30

Country Status (1)

Country Link
JP (1) JPS50107462A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254044A (ja) * 1985-05-03 1986-11-11 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 回転電気機械の回転子の接続部及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254044A (ja) * 1985-05-03 1986-11-11 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 回転電気機械の回転子の接続部及びその製造方法

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