JPS501326Y1 - - Google Patents
Info
- Publication number
- JPS501326Y1 JPS501326Y1 JP11110870U JP11110870U JPS501326Y1 JP S501326 Y1 JPS501326 Y1 JP S501326Y1 JP 11110870 U JP11110870 U JP 11110870U JP 11110870 U JP11110870 U JP 11110870U JP S501326 Y1 JPS501326 Y1 JP S501326Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11110870U JPS501326Y1 (2) | 1970-11-09 | 1970-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11110870U JPS501326Y1 (2) | 1970-11-09 | 1970-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS501326Y1 true JPS501326Y1 (2) | 1975-01-14 |
Family
ID=33271305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11110870U Expired JPS501326Y1 (2) | 1970-11-09 | 1970-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS501326Y1 (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009295808A (ja) * | 2008-06-05 | 2009-12-17 | Mitsubishi Electric Corp | 樹脂モールド型半導体モジュール |
| JP2010199494A (ja) * | 2009-02-27 | 2010-09-09 | Mitsubishi Electric Corp | 半導体装置及び半導体装置の製造方法 |
-
1970
- 1970-11-09 JP JP11110870U patent/JPS501326Y1/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009295808A (ja) * | 2008-06-05 | 2009-12-17 | Mitsubishi Electric Corp | 樹脂モールド型半導体モジュール |
| JP2010199494A (ja) * | 2009-02-27 | 2010-09-09 | Mitsubishi Electric Corp | 半導体装置及び半導体装置の製造方法 |