JPS50153795A - - Google Patents

Info

Publication number
JPS50153795A
JPS50153795A JP50053326A JP5332675A JPS50153795A JP S50153795 A JPS50153795 A JP S50153795A JP 50053326 A JP50053326 A JP 50053326A JP 5332675 A JP5332675 A JP 5332675A JP S50153795 A JPS50153795 A JP S50153795A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50053326A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50153795A publication Critical patent/JPS50153795A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/043Dual dielectric
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/051Etching

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Surface Treatment Of Glass (AREA)
  • Silicon Compounds (AREA)
  • Weting (AREA)
JP50053326A 1974-05-28 1975-05-06 Pending JPS50153795A (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742425684 DE2425684A1 (de) 1974-05-28 1974-05-28 Verfahren zum aetzen von silicium enthaltenden materialien

Publications (1)

Publication Number Publication Date
JPS50153795A true JPS50153795A (2) 1975-12-11

Family

ID=5916629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50053326A Pending JPS50153795A (2) 1974-05-28 1975-05-06

Country Status (5)

Country Link
US (1) US3971683A (2)
JP (1) JPS50153795A (2)
DE (1) DE2425684A1 (2)
FR (1) FR2273081B1 (2)
GB (1) GB1475656A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007143890A (ja) * 2005-11-28 2007-06-14 Daio Paper Corp 体液吸収性物品

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339349A (en) * 1976-09-24 1978-04-11 Asahi Glass Co Ltd Thermosetting resin molding material
JPS5370688A (en) * 1976-12-06 1978-06-23 Toshiba Corp Production of semoconductor device
US4283248A (en) * 1979-02-01 1981-08-11 Nitto Electric Industrial Co., Ltd. Etching solution for tin-nickel alloy and process for etching the same
US4465550A (en) * 1982-06-16 1984-08-14 General Signal Corporation Method and apparatus for slicing semiconductor ingots
US4713145A (en) * 1986-12-19 1987-12-15 Gulton Industries, Inc. Method of etching etch-resistant materials
DE4414925A1 (de) * 1994-04-28 1995-11-02 Wacker Chemitronic Verfahren zur Behandlung von Halbleitermaterial mit einer säurehaltigen Flüssigkeit
US6117351A (en) 1998-04-06 2000-09-12 Micron Technology, Inc. Method for etching dielectric films
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
JP2006509229A (ja) * 2002-12-03 2006-03-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ディスプレイの製造方法
US20040226506A1 (en) * 2003-05-14 2004-11-18 Lynn David Mark Coated wafer processing equipment
DE102007054484B3 (de) 2007-11-15 2009-03-12 Deutsche Cell Gmbh Strukturier-Verfahren
JP6433730B2 (ja) * 2014-09-08 2018-12-05 東芝メモリ株式会社 半導体装置の製造方法及び半導体製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715249A (en) * 1971-09-03 1973-02-06 Bell Telephone Labor Inc Etching si3n4
GB1423448A (en) * 1973-07-18 1976-02-04 Plessey Co Ltd Method of selectively etching silicon nitride

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007143890A (ja) * 2005-11-28 2007-06-14 Daio Paper Corp 体液吸収性物品

Also Published As

Publication number Publication date
DE2425684A1 (de) 1975-12-11
GB1475656A (en) 1977-06-01
US3971683A (en) 1976-07-27
FR2273081B1 (2) 1977-07-22
FR2273081A1 (2) 1975-12-26

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