JPS50159506A - - Google Patents
Info
- Publication number
- JPS50159506A JPS50159506A JP6940174A JP6940174A JPS50159506A JP S50159506 A JPS50159506 A JP S50159506A JP 6940174 A JP6940174 A JP 6940174A JP 6940174 A JP6940174 A JP 6940174A JP S50159506 A JPS50159506 A JP S50159506A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6940174A JPS5730833B2 (de) | 1974-06-17 | 1974-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6940174A JPS5730833B2 (de) | 1974-06-17 | 1974-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50159506A true JPS50159506A (de) | 1975-12-24 |
| JPS5730833B2 JPS5730833B2 (de) | 1982-07-01 |
Family
ID=13401532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6940174A Expired JPS5730833B2 (de) | 1974-06-17 | 1974-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5730833B2 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317265A (en) * | 1976-08-02 | 1978-02-17 | Hitachi Ltd | Tight adhesion method between metallic part and insulating material |
| US5155665A (en) * | 1988-03-30 | 1992-10-13 | Kabushiki Kaisha Toshiba | Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof |
-
1974
- 1974-06-17 JP JP6940174A patent/JPS5730833B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5317265A (en) * | 1976-08-02 | 1978-02-17 | Hitachi Ltd | Tight adhesion method between metallic part and insulating material |
| US5155665A (en) * | 1988-03-30 | 1992-10-13 | Kabushiki Kaisha Toshiba | Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5730833B2 (de) | 1982-07-01 |