JPS5019173B1 - - Google Patents

Info

Publication number
JPS5019173B1
JPS5019173B1 JP45007636A JP763670A JPS5019173B1 JP S5019173 B1 JPS5019173 B1 JP S5019173B1 JP 45007636 A JP45007636 A JP 45007636A JP 763670 A JP763670 A JP 763670A JP S5019173 B1 JPS5019173 B1 JP S5019173B1
Authority
JP
Japan
Prior art keywords
boards
holes
vacuum
plated
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45007636A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5019173B1 publication Critical patent/JPS5019173B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Switches (AREA)
JP45007636A 1969-01-28 1970-01-28 Pending JPS5019173B1 (2)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79468669A 1969-01-28 1969-01-28
US201970A 1970-01-12 1970-01-12

Publications (1)

Publication Number Publication Date
JPS5019173B1 true JPS5019173B1 (2) 1975-07-04

Family

ID=26669799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45007636A Pending JPS5019173B1 (2) 1969-01-28 1970-01-28

Country Status (6)

Country Link
US (1) US3755890A (2)
JP (1) JPS5019173B1 (2)
BE (1) BE745068A (2)
DE (1) DE2003473A1 (2)
FR (1) FR2029549A1 (2)
GB (1) GB1302514A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146661U (2) * 1975-05-19 1976-11-25

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3836388A (en) * 1972-10-18 1974-09-17 Western Electric Co Distributing a fluid evenly over the surface of an article
US3895137A (en) * 1973-12-03 1975-07-15 Fmc Corp Method of plating articles having small clearances or crevices
US3934060A (en) * 1973-12-19 1976-01-20 Motorola, Inc. Method for forming a deposited silicon dioxide layer on a semiconductor wafer
DE2537444C2 (de) * 1974-09-16 1982-10-21 International Business Machines Corp., 10504 Armonk, N.Y. Verfahren zum Stabilisieren von Laminaten
US4402998A (en) * 1982-01-04 1983-09-06 Western Electric Co., Inc. Method for providing an adherent electroless metal coating on an epoxy surface
KR900003157B1 (ko) * 1986-04-02 1990-05-09 가부시끼가이샤 히다찌세이샤꾸쇼 스루호울 도금의 전처리 방법
GB2210818A (en) * 1987-10-10 1989-06-21 Plessey Co Plc A process for soldering a component to a printed circuit board
US5447758A (en) * 1993-10-18 1995-09-05 Pelletier; Andree PVC sheet screen printing process
US6051169A (en) * 1997-08-27 2000-04-18 International Business Machines Corporation Vacuum baking process
US6187652B1 (en) * 1998-09-14 2001-02-13 Fujitsu Limited Method of fabrication of multiple-layer high density substrate
RU2191848C2 (ru) * 1999-12-16 2002-10-27 Акционерное общество открытого типа "НИИ молекулярной электроники и завод "Микрон" Способ формирования диоксида кремния
JP3967239B2 (ja) * 2001-09-20 2007-08-29 株式会社フジクラ 充填金属部付き部材の製造方法及び充填金属部付き部材
JP5801047B2 (ja) * 2010-01-19 2015-10-28 有限会社ヨコタテクニカ リフロー半田付け装置及び方法
CN112654163A (zh) * 2020-12-25 2021-04-13 悦虎晶芯电路(苏州)股份有限公司 一种清理l异形槽孔拐角纤维丝毛刺的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3029473A (en) * 1959-05-25 1962-04-17 Riverside Plastics Corp Vacuum post-curing of infusible plastic material
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
US3413392A (en) * 1966-10-17 1968-11-26 Du Pont Hot pressing process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146661U (2) * 1975-05-19 1976-11-25

Also Published As

Publication number Publication date
BE745068A (fr) 1970-07-01
GB1302514A (2) 1973-01-10
US3755890A (en) 1973-09-04
DE2003473A1 (de) 1970-08-27
FR2029549A1 (2) 1970-10-23

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