JPS5036954B1 - - Google Patents

Info

Publication number
JPS5036954B1
JPS5036954B1 JP45104077A JP10407770A JPS5036954B1 JP S5036954 B1 JPS5036954 B1 JP S5036954B1 JP 45104077 A JP45104077 A JP 45104077A JP 10407770 A JP10407770 A JP 10407770A JP S5036954 B1 JPS5036954 B1 JP S5036954B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45104077A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45104077A priority Critical patent/JPS5036954B1/ja
Publication of JPS5036954B1 publication Critical patent/JPS5036954B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP45104077A 1970-11-27 1970-11-27 Pending JPS5036954B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP45104077A JPS5036954B1 (ja) 1970-11-27 1970-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45104077A JPS5036954B1 (ja) 1970-11-27 1970-11-27

Publications (1)

Publication Number Publication Date
JPS5036954B1 true JPS5036954B1 (ja) 1975-11-28

Family

ID=14371072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45104077A Pending JPS5036954B1 (ja) 1970-11-27 1970-11-27

Country Status (1)

Country Link
JP (1) JPS5036954B1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040107U (ja) * 1983-08-25 1985-03-20 八木アンテナ株式会社 アンテナ取付ねじ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6040107U (ja) * 1983-08-25 1985-03-20 八木アンテナ株式会社 アンテナ取付ねじ

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