JPS5052975A - - Google Patents

Info

Publication number
JPS5052975A
JPS5052975A JP48100186A JP10018673A JPS5052975A JP S5052975 A JPS5052975 A JP S5052975A JP 48100186 A JP48100186 A JP 48100186A JP 10018673 A JP10018673 A JP 10018673A JP S5052975 A JPS5052975 A JP S5052975A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48100186A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48100186A priority Critical patent/JPS5052975A/ja
Publication of JPS5052975A publication Critical patent/JPS5052975A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Jigs For Machine Tools (AREA)
  • Wire Bonding (AREA)
JP48100186A 1973-09-07 1973-09-07 Pending JPS5052975A (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48100186A JPS5052975A (2) 1973-09-07 1973-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48100186A JPS5052975A (2) 1973-09-07 1973-09-07

Publications (1)

Publication Number Publication Date
JPS5052975A true JPS5052975A (2) 1975-05-10

Family

ID=14267262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48100186A Pending JPS5052975A (2) 1973-09-07 1973-09-07

Country Status (1)

Country Link
JP (1) JPS5052975A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0310722A (ja) * 1989-06-08 1991-01-18 Zexel Corp プリント基板の位置決め装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0310722A (ja) * 1989-06-08 1991-01-18 Zexel Corp プリント基板の位置決め装置

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