JPS5054287A - - Google Patents

Info

Publication number
JPS5054287A
JPS5054287A JP48102327A JP10232773A JPS5054287A JP S5054287 A JPS5054287 A JP S5054287A JP 48102327 A JP48102327 A JP 48102327A JP 10232773 A JP10232773 A JP 10232773A JP S5054287 A JPS5054287 A JP S5054287A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48102327A
Other versions
JPS5522020B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10232773A priority Critical patent/JPS5522020B2/ja
Publication of JPS5054287A publication Critical patent/JPS5054287A/ja
Publication of JPS5522020B2 publication Critical patent/JPS5522020B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP10232773A 1973-09-10 1973-09-10 Expired JPS5522020B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10232773A JPS5522020B2 (ja) 1973-09-10 1973-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10232773A JPS5522020B2 (ja) 1973-09-10 1973-09-10

Publications (2)

Publication Number Publication Date
JPS5054287A true JPS5054287A (ja) 1975-05-13
JPS5522020B2 JPS5522020B2 (ja) 1980-06-13

Family

ID=14324435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10232773A Expired JPS5522020B2 (ja) 1973-09-10 1973-09-10

Country Status (1)

Country Link
JP (1) JPS5522020B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54163917U (ja) * 1978-05-10 1979-11-16
JPS55165406U (ja) * 1979-05-16 1980-11-28
JPS55157240A (en) * 1979-05-25 1980-12-06 Nec Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214652A (en) * 1962-03-19 1965-10-26 Motorola Inc Transistor comprising prong-shaped emitter electrode

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214652A (en) * 1962-03-19 1965-10-26 Motorola Inc Transistor comprising prong-shaped emitter electrode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54163917U (ja) * 1978-05-10 1979-11-16
JPS55165406U (ja) * 1979-05-16 1980-11-28
JPS55157240A (en) * 1979-05-25 1980-12-06 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5522020B2 (ja) 1980-06-13

Similar Documents

Publication Publication Date Title
AU476761B2 (ja)
AR201235Q (ja)
AR201231Q (ja)
AU474838B2 (ja)
AU476714B2 (ja)
FR2251103B1 (ja)
AU476696B2 (ja)
JPS5713141B2 (ja)
JPS5054287A (ja)
AU477823B2 (ja)
AU476873B1 (ja)
AU477824B2 (ja)
AU479404A (ja)
CH567736A5 (ja)
CH564712A5 (ja)
CH565700A5 (ja)
CH562627A5 (ja)
CH561795A5 (ja)
AU479420A (ja)
CH560887A5 (ja)
CH565996A5 (ja)
CH567072A5 (ja)
CH1497674A4 (ja)
CH567208A5 (ja)
CH1347073A4 (ja)