JPS506151B1 - - Google Patents
Info
- Publication number
- JPS506151B1 JPS506151B1 JP45074565A JP7456570A JPS506151B1 JP S506151 B1 JPS506151 B1 JP S506151B1 JP 45074565 A JP45074565 A JP 45074565A JP 7456570 A JP7456570 A JP 7456570A JP S506151 B1 JPS506151 B1 JP S506151B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
- H10W72/334—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45074565A JPS506151B1 (th) | 1970-08-27 | 1970-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45074565A JPS506151B1 (th) | 1970-08-27 | 1970-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS506151B1 true JPS506151B1 (th) | 1975-03-11 |
Family
ID=13550854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45074565A Pending JPS506151B1 (th) | 1970-08-27 | 1970-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS506151B1 (th) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53128159A (en) * | 1977-04-13 | 1978-11-08 | Takasago Iron Works | Device for removing floated foreign materials on water surface |
| JPS5549766U (th) * | 1978-09-28 | 1980-04-01 | ||
| JPS6275895U (th) * | 1985-10-30 | 1987-05-15 | ||
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
-
1970
- 1970-08-27 JP JP45074565A patent/JPS506151B1/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53128159A (en) * | 1977-04-13 | 1978-11-08 | Takasago Iron Works | Device for removing floated foreign materials on water surface |
| JPS5549766U (th) * | 1978-09-28 | 1980-04-01 | ||
| JPS6275895U (th) * | 1985-10-30 | 1987-05-15 | ||
| JP2014022576A (ja) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | 半導体素子実装部材及び半導体装置 |
| US10068821B2 (en) | 2012-07-18 | 2018-09-04 | Nichia Corporation | Semiconductor component support and semiconductor device |
| JP2016184756A (ja) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |