JPS509342B1 - - Google Patents
Info
- Publication number
- JPS509342B1 JPS509342B1 JP45087957A JP8795770A JPS509342B1 JP S509342 B1 JPS509342 B1 JP S509342B1 JP 45087957 A JP45087957 A JP 45087957A JP 8795770 A JP8795770 A JP 8795770A JP S509342 B1 JPS509342 B1 JP S509342B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86485669A | 1969-10-08 | 1969-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS509342B1 true JPS509342B1 (de) | 1975-04-11 |
Family
ID=25344227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45087957A Pending JPS509342B1 (de) | 1969-10-08 | 1970-10-08 |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS509342B1 (de) |
| BE (1) | BE757162A (de) |
| CH (1) | CH528148A (de) |
| DE (1) | DE2049163C3 (de) |
| ES (1) | ES384535A1 (de) |
| FR (1) | FR2065090A5 (de) |
| GB (1) | GB1315510A (de) |
| IE (1) | IE34642B1 (de) |
| NL (1) | NL145718B (de) |
| SE (1) | SE365068B (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5377737U (de) * | 1976-11-26 | 1978-06-28 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2823881C3 (de) * | 1978-05-31 | 1982-03-18 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen |
| DE3064555D1 (en) | 1979-02-26 | 1983-09-22 | Nat Res Dev | Method of incorporating a distributed microwave circuit element in a microwave integrated circuit |
| US5699224A (en) * | 1995-10-25 | 1997-12-16 | Rohm Co., Ltd. | Thick-film capacitor and chip-type composite electronic component utilizing the same |
| CN107086095B (zh) * | 2017-06-22 | 2023-05-16 | 中国船舶重工集团公司第七0三研究所 | 一种电阻负载导流罩 |
-
0
- BE BE757162D patent/BE757162A/xx unknown
-
1970
- 1970-09-16 IE IE1205/70A patent/IE34642B1/xx unknown
- 1970-09-29 SE SE13180/70A patent/SE365068B/xx unknown
- 1970-10-03 ES ES384535A patent/ES384535A1/es not_active Expired
- 1970-10-05 NL NL707014581A patent/NL145718B/xx not_active IP Right Cessation
- 1970-10-06 GB GB4739470A patent/GB1315510A/en not_active Expired
- 1970-10-06 CH CH1480070A patent/CH528148A/de not_active IP Right Cessation
- 1970-10-06 FR FR7036094A patent/FR2065090A5/fr not_active Expired
- 1970-10-07 DE DE2049163A patent/DE2049163C3/de not_active Expired
- 1970-10-08 JP JP45087957A patent/JPS509342B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5377737U (de) * | 1976-11-26 | 1978-06-28 |
Also Published As
| Publication number | Publication date |
|---|---|
| IE34642B1 (en) | 1975-07-09 |
| NL7014581A (de) | 1971-04-14 |
| NL145718B (nl) | 1975-04-15 |
| FR2065090A5 (de) | 1971-07-23 |
| BE757162A (fr) | 1971-03-16 |
| ES384535A1 (es) | 1974-06-01 |
| GB1315510A (en) | 1973-05-02 |
| DE2049163C3 (de) | 1978-07-06 |
| DE2049163B2 (de) | 1977-11-10 |
| IE34642L (en) | 1971-04-08 |
| SE365068B (de) | 1974-03-11 |
| CH528148A (de) | 1972-09-15 |
| DE2049163A1 (de) | 1971-04-22 |