JPS509342B1 - - Google Patents

Info

Publication number
JPS509342B1
JPS509342B1 JP45087957A JP8795770A JPS509342B1 JP S509342 B1 JPS509342 B1 JP S509342B1 JP 45087957 A JP45087957 A JP 45087957A JP 8795770 A JP8795770 A JP 8795770A JP S509342 B1 JPS509342 B1 JP S509342B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45087957A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS509342B1 publication Critical patent/JPS509342B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
JP45087957A 1969-10-08 1970-10-08 Pending JPS509342B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
JPS509342B1 true JPS509342B1 (fr) 1975-04-11

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45087957A Pending JPS509342B1 (fr) 1969-10-08 1970-10-08

Country Status (10)

Country Link
JP (1) JPS509342B1 (fr)
BE (1) BE757162A (fr)
CH (1) CH528148A (fr)
DE (1) DE2049163C3 (fr)
ES (1) ES384535A1 (fr)
FR (1) FR2065090A5 (fr)
GB (1) GB1315510A (fr)
IE (1) IE34642B1 (fr)
NL (1) NL145718B (fr)
SE (1) SE365068B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (fr) * 1976-11-26 1978-06-28

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2823881C3 (de) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen
EP0015100B1 (fr) * 1979-02-26 1983-08-17 National Research Development Corporation Procédé d'incorporation d'un élément de circuit distribué à micro-ondes dans un circuit intégré à micro-ondes
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (zh) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (fr) * 1976-11-26 1978-06-28

Also Published As

Publication number Publication date
FR2065090A5 (fr) 1971-07-23
NL7014581A (fr) 1971-04-14
ES384535A1 (es) 1974-06-01
IE34642L (en) 1971-04-08
DE2049163A1 (de) 1971-04-22
BE757162A (fr) 1971-03-16
DE2049163C3 (de) 1978-07-06
IE34642B1 (en) 1975-07-09
GB1315510A (en) 1973-05-02
DE2049163B2 (de) 1977-11-10
CH528148A (de) 1972-09-15
NL145718B (nl) 1975-04-15
SE365068B (fr) 1974-03-11

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