JPS51101863A - DENSHIKAIROSO CHISEIZOHO - Google Patents
DENSHIKAIROSO CHISEIZOHOInfo
- Publication number
- JPS51101863A JPS51101863A JP2648875A JP2648875A JPS51101863A JP S51101863 A JPS51101863 A JP S51101863A JP 2648875 A JP2648875 A JP 2648875A JP 2648875 A JP2648875 A JP 2648875A JP S51101863 A JPS51101863 A JP S51101863A
- Authority
- JP
- Japan
- Prior art keywords
- denshikairoso
- chiseizoho
- denshikairoso chiseizoho
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2648875A JPS51101863A (en) | 1975-03-06 | 1975-03-06 | DENSHIKAIROSO CHISEIZOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2648875A JPS51101863A (en) | 1975-03-06 | 1975-03-06 | DENSHIKAIROSO CHISEIZOHO |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51101863A true JPS51101863A (en) | 1976-09-08 |
Family
ID=12194876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2648875A Pending JPS51101863A (en) | 1975-03-06 | 1975-03-06 | DENSHIKAIROSO CHISEIZOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51101863A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626444A (en) * | 1979-08-10 | 1981-03-14 | Toshiba Corp | Manufacture of semiconductor device |
| JPS5980991A (en) * | 1982-10-30 | 1984-05-10 | 日本メクトロン株式会社 | Method of pretreating solder in circuit board |
| JPS59113689A (en) * | 1982-12-20 | 1984-06-30 | 松下電器産業株式会社 | Method of mounting electronic part |
| JPS6284870A (en) * | 1985-10-11 | 1987-04-18 | Sony Corp | Reflowing soldering device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3420430A (en) * | 1967-05-05 | 1969-01-07 | Martin Marietta Corp | Automated hot gas soldering apparatus for attaching a plurality of flat pack integrated circuits to a printed circuit substrate |
| US3515330A (en) * | 1968-01-30 | 1970-06-02 | Collins Radio Co | Continuous flow mass pin-to-board hot air soldering device |
-
1975
- 1975-03-06 JP JP2648875A patent/JPS51101863A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3420430A (en) * | 1967-05-05 | 1969-01-07 | Martin Marietta Corp | Automated hot gas soldering apparatus for attaching a plurality of flat pack integrated circuits to a printed circuit substrate |
| US3515330A (en) * | 1968-01-30 | 1970-06-02 | Collins Radio Co | Continuous flow mass pin-to-board hot air soldering device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626444A (en) * | 1979-08-10 | 1981-03-14 | Toshiba Corp | Manufacture of semiconductor device |
| JPS5980991A (en) * | 1982-10-30 | 1984-05-10 | 日本メクトロン株式会社 | Method of pretreating solder in circuit board |
| JPS59113689A (en) * | 1982-12-20 | 1984-06-30 | 松下電器産業株式会社 | Method of mounting electronic part |
| JPS6284870A (en) * | 1985-10-11 | 1987-04-18 | Sony Corp | Reflowing soldering device |
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