JPS51107772A - Denkibuhinnoseizohoho oyobi sonoseizosochi - Google Patents

Denkibuhinnoseizohoho oyobi sonoseizosochi

Info

Publication number: JPS51107772A
Authority: JP; Japan
Prior art keywords: sonoseizosochi; denkibuhinnoseizohoho; oyobi; oyobi sonoseizosochi; denkibuhinnoseizohoho oyobi
Prior art date: 1975-03-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP50033427A

Other languages

English (en)

Japanese (ja)

Other versions

JPS555267B2 (2

Inventor

Shigehisa Uchida

Yoshio Yoshikawa

Isao Ueda

Akira Matsumoto

Eiji Itemaya

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-03-18

Filing date

1975-03-18

Publication date

1976-09-24

1975-03-18 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1975-03-18 Priority to JP50033427A priority Critical patent/JPS51107772A/ja

1976-09-24 Publication of JPS51107772A publication Critical patent/JPS51107772A/ja

1980-02-05 Publication of JPS555267B2 publication Critical patent/JPS555267B2/ja

Status Granted legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices

Landscapes

Wire Bonding (AREA)
Die Bonding (AREA)

JP50033427A 1975-03-18 1975-03-18 Denkibuhinnoseizohoho oyobi sonoseizosochi Granted JPS51107772A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP50033427A JPS51107772A (en)	1975-03-18	1975-03-18	Denkibuhinnoseizohoho oyobi sonoseizosochi

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP50033427A JPS51107772A (en)	1975-03-18	1975-03-18	Denkibuhinnoseizohoho oyobi sonoseizosochi

Publications (2)

Publication Number	Publication Date
JPS51107772A true JPS51107772A (en)	1976-09-24
JPS555267B2 JPS555267B2 (2)	1980-02-05

Family

ID=12386247

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP50033427A Granted JPS51107772A (en)	1975-03-18	1975-03-18	Denkibuhinnoseizohoho oyobi sonoseizosochi

Country Status (1)

Country	Link
JP (1)	JPS51107772A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0370961U (2) *	1989-10-20	1991-07-17

1975
- 1975-03-18 JP JP50033427A patent/JPS51107772A/ja active Granted

Also Published As

Publication number	Publication date
JPS555267B2 (2)	1980-02-05

Publication	Publication Date	Title
JPS555267B2 (2)	1980-02-05
BG21320A1 (2)	1976-05-20
BG22008A1 (2)	1976-11-25
BG22246A2 (2)	1977-02-20
BG22312A1 (2)	1977-02-20
BG22546A1 (2)	1977-04-20
BG22570A1 (2)	1977-04-20
BG22697A1 (2)	1977-04-20
BG22710A1 (2)	1977-04-20
BG22739A1 (2)	1977-04-20
BG22941A1 (2)	1977-05-20
BG22979A1 (2)	1977-05-20
BG22982A1 (2)	1977-05-20
BG23376A1 (2)	1977-08-10
BG23488A1 (2)	1977-09-15
CH581916A5 (2)	1976-11-15
CH590631A5 (2)	1977-08-15
CH592477A5 (2)	1977-10-31
CH593544A5 (2)	1977-12-15
CH594258A5 (2)	1977-12-30
CH594437A5 (2)	1978-01-13
CH594494A5 (2)	1978-01-13
CH595129A5 (2)	1978-01-31
CH595480A5 (2)	1978-02-15
CH595901A5 (2)	1978-02-28