Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP50035584ApriorityCriticalpatent/JPS51111091A/en
Publication of JPS51111091ApublicationCriticalpatent/JPS51111091A/en
Production Of Multi-Layered Print Wiring Board
(AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices
(AREA)
Abstract
PURPOSE:To simplify the termination between the wiring layers in manufacturing semiconductor devices utilizing high polymer plastic such as polyemide as insulation between the wiring layers.
JP50035584A1975-03-261975-03-26Sewi-conductor device manufacturing process
PendingJPS51111091A
(en)