JPS51113463A - Supporting system of semiconductor pellet - Google Patents

Supporting system of semiconductor pellet

Info

Publication number
JPS51113463A
JPS51113463A JP50036972A JP3697275A JPS51113463A JP S51113463 A JPS51113463 A JP S51113463A JP 50036972 A JP50036972 A JP 50036972A JP 3697275 A JP3697275 A JP 3697275A JP S51113463 A JPS51113463 A JP S51113463A
Authority
JP
Japan
Prior art keywords
semiconductor pellet
supporting system
pellet
semiconductor
comitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50036972A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5523460B2 (fr
Inventor
Hideki Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036972A priority Critical patent/JPS51113463A/ja
Publication of JPS51113463A publication Critical patent/JPS51113463A/ja
Publication of JPS5523460B2 publication Critical patent/JPS5523460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Die Bonding (AREA)
JP50036972A 1975-03-28 1975-03-28 Supporting system of semiconductor pellet Granted JPS51113463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036972A JPS51113463A (en) 1975-03-28 1975-03-28 Supporting system of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036972A JPS51113463A (en) 1975-03-28 1975-03-28 Supporting system of semiconductor pellet

Publications (2)

Publication Number Publication Date
JPS51113463A true JPS51113463A (en) 1976-10-06
JPS5523460B2 JPS5523460B2 (fr) 1980-06-23

Family

ID=12484650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036972A Granted JPS51113463A (en) 1975-03-28 1975-03-28 Supporting system of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS51113463A (fr)

Also Published As

Publication number Publication date
JPS5523460B2 (fr) 1980-06-23

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