JPS51115221A - Lead-patenting treatment of copper wire - Google Patents
Lead-patenting treatment of copper wireInfo
- Publication number
- JPS51115221A JPS51115221A JP4011375A JP4011375A JPS51115221A JP S51115221 A JPS51115221 A JP S51115221A JP 4011375 A JP4011375 A JP 4011375A JP 4011375 A JP4011375 A JP 4011375A JP S51115221 A JPS51115221 A JP S51115221A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- copper wire
- patenting treatment
- patenting
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Heat Treatment Of Strip Materials And Filament Materials (AREA)
Abstract
PURPOSE:In the lead-patenting process of copper wire, the wire is coated with glass before it is passed through a lead bath. As a result, the carry-out of lead by the wire can be avoided, scale can be removed together with the glass coat, and the picking treatment after the patenting can be omitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4011375A JPS51115221A (en) | 1975-04-02 | 1975-04-02 | Lead-patenting treatment of copper wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4011375A JPS51115221A (en) | 1975-04-02 | 1975-04-02 | Lead-patenting treatment of copper wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51115221A true JPS51115221A (en) | 1976-10-09 |
| JPS5516216B2 JPS5516216B2 (en) | 1980-04-30 |
Family
ID=12571782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4011375A Granted JPS51115221A (en) | 1975-04-02 | 1975-04-02 | Lead-patenting treatment of copper wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51115221A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887720U (en) * | 1981-12-08 | 1983-06-14 | 山崎製パン株式会社 | Bread alignment and feeding device |
| JPS64519U (en) * | 1987-06-18 | 1989-01-05 | ||
| JPH0383717A (en) * | 1989-08-28 | 1991-04-09 | Ngk Insulators Ltd | Separating device for miscellaneous bagged solid |
-
1975
- 1975-04-02 JP JP4011375A patent/JPS51115221A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5516216B2 (en) | 1980-04-30 |
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