JPS5111583A - - Google Patents
Info
- Publication number
- JPS5111583A JPS5111583A JP8294974A JP8294974A JPS5111583A JP S5111583 A JPS5111583 A JP S5111583A JP 8294974 A JP8294974 A JP 8294974A JP 8294974 A JP8294974 A JP 8294974A JP S5111583 A JPS5111583 A JP S5111583A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8294974A JPS5111583A (ja) | 1974-07-19 | 1974-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8294974A JPS5111583A (ja) | 1974-07-19 | 1974-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5111583A true JPS5111583A (ja) | 1976-01-29 |
Family
ID=13788458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8294974A Pending JPS5111583A (ja) | 1974-07-19 | 1974-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5111583A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822227A (ja) * | 1981-07-31 | 1983-02-09 | Kyoto Seisakusho:Kk | トレ−内の積重板紙の取出方法 |
| JPS6239128A (ja) * | 1985-08-12 | 1987-02-20 | Enshu Cloth Kk | 冷し嵌め装置 |
| JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
| JP2008024351A (ja) * | 2006-07-24 | 2008-02-07 | Tokiwa Kogyo Kk | 食品搬送装置 |
-
1974
- 1974-07-19 JP JP8294974A patent/JPS5111583A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822227A (ja) * | 1981-07-31 | 1983-02-09 | Kyoto Seisakusho:Kk | トレ−内の積重板紙の取出方法 |
| JPS6239128A (ja) * | 1985-08-12 | 1987-02-20 | Enshu Cloth Kk | 冷し嵌め装置 |
| JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
| JP2008024351A (ja) * | 2006-07-24 | 2008-02-07 | Tokiwa Kogyo Kk | 食品搬送装置 |