JPS51118038A - Cooling device of semiconductor rectifier - Google Patents

Cooling device of semiconductor rectifier

Info

Publication number
JPS51118038A
JPS51118038A JP50043559A JP4355975A JPS51118038A JP S51118038 A JPS51118038 A JP S51118038A JP 50043559 A JP50043559 A JP 50043559A JP 4355975 A JP4355975 A JP 4355975A JP S51118038 A JPS51118038 A JP S51118038A
Authority
JP
Japan
Prior art keywords
cooling device
semiconductor rectifier
rectifier
semiconductor
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50043559A
Other languages
Japanese (ja)
Inventor
Kenji Kijima
Shozo Otomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP50043559A priority Critical patent/JPS51118038A/en
Publication of JPS51118038A publication Critical patent/JPS51118038A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To make the boiling bubbles not prevent the convection current on the rectifier of ebullition cooling system.
COPYRIGHT: (C)1976,JPO&Japio
JP50043559A 1975-04-10 1975-04-10 Cooling device of semiconductor rectifier Pending JPS51118038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50043559A JPS51118038A (en) 1975-04-10 1975-04-10 Cooling device of semiconductor rectifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50043559A JPS51118038A (en) 1975-04-10 1975-04-10 Cooling device of semiconductor rectifier

Publications (1)

Publication Number Publication Date
JPS51118038A true JPS51118038A (en) 1976-10-16

Family

ID=12667095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50043559A Pending JPS51118038A (en) 1975-04-10 1975-04-10 Cooling device of semiconductor rectifier

Country Status (1)

Country Link
JP (1) JPS51118038A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149567U (en) * 1977-04-30 1978-11-25
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149567U (en) * 1977-04-30 1978-11-25
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same

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