JPS51118390A - Multi layer wiring unig - Google Patents
Multi layer wiring unigInfo
- Publication number
- JPS51118390A JPS51118390A JP50043202A JP4320275A JPS51118390A JP S51118390 A JPS51118390 A JP S51118390A JP 50043202 A JP50043202 A JP 50043202A JP 4320275 A JP4320275 A JP 4320275A JP S51118390 A JPS51118390 A JP S51118390A
- Authority
- JP
- Japan
- Prior art keywords
- unig
- layer wiring
- multi layer
- wiring
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To get wiring unit with high reliability by improving adhesion between wiring layer isolating film and metal wiring conductor layer in thin film integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50043202A JPS51118390A (en) | 1975-04-11 | 1975-04-11 | Multi layer wiring unig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50043202A JPS51118390A (en) | 1975-04-11 | 1975-04-11 | Multi layer wiring unig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51118390A true JPS51118390A (en) | 1976-10-18 |
Family
ID=12657333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50043202A Pending JPS51118390A (en) | 1975-04-11 | 1975-04-11 | Multi layer wiring unig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51118390A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917266A (en) * | 1982-07-21 | 1984-01-28 | Hitachi Ltd | Resin-encapsulated semiconductor device |
| US5200026A (en) * | 1990-05-18 | 1993-04-06 | International Business Machines Corporation | Manufacturing method for multi-layer circuit boards |
| US7611982B2 (en) | 2003-04-15 | 2009-11-03 | Tdk Corporation | Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
-
1975
- 1975-04-11 JP JP50043202A patent/JPS51118390A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917266A (en) * | 1982-07-21 | 1984-01-28 | Hitachi Ltd | Resin-encapsulated semiconductor device |
| US5200026A (en) * | 1990-05-18 | 1993-04-06 | International Business Machines Corporation | Manufacturing method for multi-layer circuit boards |
| US7611982B2 (en) | 2003-04-15 | 2009-11-03 | Tdk Corporation | Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
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